Hong Heng Sheng Electronical Technology (HuaiAn)Co., Ltd Patent applications |
Patent application number | Title | Published |
20120031873 | ETCHING DEVICE AND METHOD FOR MANUFACTURING PRINTED CIRCUIT BOARD USING SAME - In a method for manufacturing a printed circuit board, a substrate, including a number of plated through holes (PTHs) is provided. Each of the PTHs has an electrically conductive layer plated on its inner wall and includes an electrically connecting portion and a stub. A protective layer is formed on a surface of the substrate adjacent to the stub. An etching device, including an upper plate and a number of spray tubes corresponding to the PTHs, is provided. Each of the spray tubes includes a protruding portion beyond the upper plate. The substrate is arranged in such a manner that the protective layer is in contact with the upper plate and the protruding portions are received in the stubs. After that, the protruding portions spray an etchant to etch and remove the electrically conductive layer of the stubs, and the protective layer is removed. | 02-09-2012 |
20110186339 | PRINTED CIRCUIT BOARD WITH CARBON NANOTUBE BUNDLE - A printed circuit board includes a composite layer, a first electrically conductive pattern, and a second electrically conductive pattern. The composite layer includes a polymer matrix and an electrically conductive pin embedded therein. The polymer matrix has a first surface and an opposite second surface. The pin includes a catalyst block and a carbon nanotube bundle grown on the catalyst block. The catalyst block is exposed at the first surface, and the carbon nanotube bundle is exposed at the second surface. The first pattern is formed on the first surface, and includes a first electrical contact, which is electrically coupled to the catalyst block. The second pattern is formed on the second surface, and includes a second electrical contact, which is electrically coupled to the carbon nanotube bundle. | 08-04-2011 |