Honeywell Internationa Inc. Patent applications |
Patent application number | Title | Published |
20100139373 | MEMS SENSOR PACKAGE - Methods and apparatus for a MEMS sensor package are provided. In one embodiment, a MEMS sensor package comprises a MEMS sensor; a sensor body permeable to gas leakage at a first leak rate; a backfill gas that pressurizes the sensor body to a backfill pressure; wherein the backfill pressure provides a dampening of the MEMS sensor; and wherein the backfill pressure is set such than any increase in pressure within the sensor body due to gas leakage will not cause a deviation in a Q value of the MEMS sensor beyond a predefined range for at least a specified design service life for the MEMS sensor package. | 06-10-2010 |
20090310433 | DATA ALIGNMENT AND DE-SKEW SYSTEM AND METHOD FOR DOUBLE DATA RATE INPUT DATA STREAM - A system for aligning data is provided. The system comprises a demultiplexing component adapted to bifurcate a double data rate (DDR) data stream into first and second single data rate (SDR) data streams, a delay architecture adapted to generate delayed SDR data streams from the SDR data streams, a logic circuit adapted to analyze the SDR data streams and delayed SDR data streams to detect a predetermined bit pattern conveyed in the DDR data stream and to indicate detection of the predetermined bit pattern, and a data aligning component adapted to determine the number of intervening bits between occurrences of the predetermined bit pattern and to frame the intervening bits, thereby producing aligned data. | 12-17-2009 |