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HOKURIKU ELECTRIC INDUSTRY CO., LTD.

HOKURIKU ELECTRIC INDUSTRY CO., LTD. Patent applications
Patent application numberTitlePublished
20120112137MANUFACTURING METHOD FOR METAL OXIDE SEMICONDUCTOR MATERIAL FOR GAS SENSOR - Provided is a manufacturing method of a metal oxide semiconductor material for gas sensors by which an oxide precursor and noble metal colloid particles will not readily cohere in the manufacturing process. The manufacturing process implements a precursor solution synthesis step 05-10-2012
20110141046DISPLAY APPARATUS WITH TOUCH PANEL AND PIEZOELECTRIC ACTUATOR - Provided herein are a display apparatus with a touch panel to which a piezoelectric actuator may readily be mounted, and a piezoelectric actuator used in such a display apparatus with a touch panel. A support structure for supporting a piezoelectric actuator 06-16-2011
20110117689SEMICONDUCTOR SENSOR AND MANUFACTURING METHOD OF SENSOR BODY FOR SEMICONDUCTOR SENSOR - A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L05-19-2011
20110100122BIAXIAL ANGULAR VELOCITY SENSOR - A biaxial angular velocity sensor provided herein has good detection sensitivity and allows an oscillator to be fixed stably. The biaxial angular velocity sensor includes an oscillator (05-05-2011
20110080251CHIP-LIKE ELECTRIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME - A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodes 04-07-2011
20100266753CONNECTOR CHIP AND MANUFACTURING METHOD THEREOF - The present invention provides a connector chip capable of preventing electrical shorting between adjoining electrodes and also capable of readily connecting a plurality of electrodes on a first circuit substrate and a plurality of electrodes on a second circuit substrate without using a dedicated mounting device or the like. A plurality of conductive paths 10-21-2010
20100072046WATERPROOF PUSH BUTTON SWITCH - A waterproof push button switch does not need to be covered with a resin to a height at which a divided connected portion of a case for the switch is hidden by the resin in a height direction and the divided connected portion may be waterproofed. A gap (03-25-2010
20100003839CONNECTOR DEVICE FOR INTERCONNECTING CIRCUIT SUBSTRATES - A connector device for interconnecting circuit substrates is obtained, in which a pitch for electrically conducting paths can easily be aligned with a pitch for electrodes on the side of circuit substrates. The connector includes a rectangular parallelepiped connecting element (01-07-2010
20090289315SEMICONDUCTOR SENSOR AND MANUFACTURING METHOD OF SENSOR BODY FOR SEMICONDUCTOR SENSOR - A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L11-26-2009
20090267725SURFACE MOUNT VARIABLE RESISTOR - A surface mount variable resistor meets the needs of user for front and rear terminals of an insulating substrate. The surface mount variable resistor includes an insulating substrate 10-29-2009
20090253275CONNECTOR DEVICE FOR INTERCONNECTING CIRCUIT SUBSTRATES - A connector device for interconnecting circuit substrates is provided, in which no electric element for protection needs to be mounted separately on circuit substrates. A rectangular parallelepiped connecting element having an electrical component (10-08-2009
20090231086TERMINAL STRUCTURE OF CHIPLIKE ELECTRIC COMPONENT - A terminal structure of a chip-like electric component capable of blocking entry of electromigration-causing factors through an insulating resin layer in the vicinity of the peak of a raised portion of an electrical element forming layer is obtained. A metal-glaze-based front electrode 09-17-2009

Patent applications by HOKURIKU ELECTRIC INDUSTRY CO., LTD.