| HITACHI YONEZAWA ELECTRONICS CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110033984 | MOLD CLEANING SHEET AND METHOD OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME - A cleaning sheet ( | 02-10-2011 |
| 20110018122 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE - A semiconductor device is disclosed which includes a tab ( | 01-27-2011 |
| 20100044854 | SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME AND A MOUNTING STRUCTURE OF A SEMICONDUCTOR DEVICE - A semiconductor device is disclosed which includes a tab ( | 02-25-2010 |
| 20090263940 | MOLDING CLEANING SHEET AND METHOD OF PRODUCING SEMICONDUCTOR DEVICES USING THE SAME - A cleaning sheet ( | 10-22-2009 |
| 20090203173 | MOLD CLEANING SHEET AND MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE USING THE SAME - A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed along the peripheral edge to the outside of the plural cavities of the mating surface of the molding die, the cleaning sheet main body being formed with first through holes at positions corresponding to the cavities of the molding die, air vent slits and flow cavity recesses at positions corresponding to the air vents of the cavities, second through holes at positions corresponding to the pots of the molding die, and slits at positions corresponding to the runners of the molding die, thereby capable of improving the cleaning effect of the molding die and shortening the time for the cleaning operation to improve the productivity. | 08-13-2009 |
| 20080296784 | Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device - A semiconductor device is disclosed which includes a tab ( | 12-04-2008 |
| 20080268578 | Manufacturing method of a semiconductor device - A non-leaded resin-sealed semiconductor device is manufactured by the steps of providing a conductive flat substrate (metal plate) of copper plate or the like, fixing semiconductor elements respectively to predetermined positions on the principal surface of the substrate by an insulating adhesive, electrically connecting electrodes on the surfaces of the semiconductor elements with predetermined partition parts of the substrate separate from the semiconductor elements by conductive wires, forming an insulating resin layer on the principal surface of the substrate to cover the semiconductor elements and wires, selectively removing the substrate from the rear of said substrate to form electrically independent partition parts whereof at least some are external electrode terminals, and selectively removing said resin layer to fragment the device into regions containing the semiconductor elements and the plural partition parts around the semiconductor elements. Thus, there is provided a compact non-leaded semiconductor device having a large number of electrode terminals. | 10-30-2008 |
