HITACHI VIA MECHANICS, LTD. Patent applications |
Patent application number | Title | Published |
20120105930 | Galvanoscanner and Laser Processing Machine - A galvanoscanner including: a rotor including a shaft as a rotational center, and permanent magnets disposed around the shaft and polarized to a plurality of poles in a circumferential direction of the shaft; and a stator disposed in the outside of the rotor through a clearance and including coils, a yoke, and an outer casing so that the rotor swings in a predetermined angle range; wherein: the permanent magnets are provided with grooves which are formed in a direction of the rotation shaft so as to straddle circumferentially adjacent magnetic poles of the permanent magnets; and the permanent magnets are parted into at least two parts per pole by parting lines. Thus, the ratio of the torque constant to the moment of inertia can be improved so that the current required for driving can be reduced and reduction of power consumption at driving time can be attained. | 05-03-2012 |
20120031147 | Method and Apparatus for Machining Thin-Film Layer of Workpiece - An apparatus for machining a thin-film layer of a workpiece, which is a transparent glass on which a thin-film layer is disposed on a top surface thereof, includes a workpiece-underside support mechanism for supporting the workpiece in a vertical direction by an air floatation mechanism and a suction mechanism, a clamp device for gripping the workpiece so as to follow the movement in the vertical direction of the workpiece, and a machining head for machining the thin-film layer with a laser beam. The machining head machines the thin-film layer on the top surface of the workpiece by irradiating the workpiece with a laser beam entering through the underside of the workpiece. Further including nozzles, the thin-film layer is machined while the cooling medium is delivered from the nozzles disposed by the thin-film layer side. | 02-09-2012 |
20110228537 | Adjustable Beam Size Illumination Optical Apparatus and Beam Size Adjusting Method - An adjustable beam size illumination optical apparatus includes a beam size adjusting optical system which includes groups of cylindrical array lenses disposed correspondingly to the long and short axis directions respectively and having variable intervals among the lenses, and a group of cylindrical telescope lenses disposed correspondingly to one of the long and short axis directions and having variable intervals among the lenses, and adjusts parallel light from a light source in size in accordance with the two axis directions orthogonal to each other. The lens interval of one of the cylindrical array lens groups and the cylindrical telescope lens group is changed to adjust a beam size on a projection surface in accordance with the long axis direction or the short axis direction. Thus, it is possible to adjust the beam size in accordance with the long axis direction and the short axis direction individually, and it is possible to make irradiation with the beam with uniform intensity. | 09-22-2011 |
20110136265 | Method of Manufacturing Thin-Film Solar Panel and Laser Scribing Apparatus - The present invention provides a method of manufacturing a thin-film solar panel with a laser scribing process to perform linear groove processing by irradiating a thin-film layer formed on a substrate with laser light to be separated from adjacent structure, including steps of: specifying an accurate position, size, shape of a adhered foreign matter on a glass substrate, a glass scratch, an air-bubble in the glass substrate causing an imperfection by inspecting a scribe line; and performing repair processing to form a new scribe line to bypass a portion of the imperfection after a final scribe line is formed. | 06-09-2011 |
20100288742 | ARC WELDING METHOD - A consumable electrode type arc welding method for generating arc between a plate-shaped work and a welding wire by a mixed shield gas including argon gas to weld the plate-shaped work, includes:
| 11-18-2010 |
20100027570 | FIBER LASER BASED PRODUCTION OF LASER DRILLED MICROVIAS FOR MULTI-LAYER DRILLING, DICING, TRIMMING OR MILLING APPLICATIONS - Fiber lasers and methods for constructing and using fiber lasers for micro-/nano-machining with output beams including stacked pulses and combinations of continuous wave, pseudo-continuous wave and pulse sequence components. | 02-04-2010 |
20090179354 | METHOD FOR MANUFACTURING THREE DIMENSIONAL ELECTRODE ELEMENTS FOR MICRO-BATTERIES - A method for forming an array of three dimensional electrode elements for micro-batteries, including forming a plurality of first parallel channels in a substrate, filling the plurality of first channels with a sacrificial filler material, forming at least one plurality of second parallel channels, each of the pluralities of channels being oriented in a different direction, and removing the sacrificial filler material to leave a grid array of electrode elements. The method may further include a preliminary step of depositing a sacrificial coating onto the surface of the substrate and a final step of removing the sacrificial coating and any debris resulting from the channel forming steps deposited thereon. | 07-16-2009 |
20090166340 | Method and apparatus for perforating printed circuit board - A method and an apparatus for perforating a printed circuit board are provided so that the processing efficiency and the board densification can be improved. In test processing, a conductor layer | 07-02-2009 |
20090111062 | Pattern Formation Method - The present invention provides a pattern formation method comprising a step of forming on a substrate a film of a first photosensitive material having low sensitivity to a light beam with a main wavelength at h-line emitted from a mask-less drawing exposure apparatus but having high sensitivity to an energy light beam containing ultraviolet light; a step of forming on the first photosensitive material a film of a second photosensitive material having higher sensitivity to a light beam with the main wavelength at h-line; a step of drawing a second pattern on the second photosensitive material with the mask-less direct drawing exposure apparatus; a step of developing the second photosensitive material; and a step of exposing to a light beam the second photosensitive material with the second pattern formed thereon and the first photosensitive material in batch to form a target first pattern on the first photosensitive material. | 04-30-2009 |
20090086009 | Laser Direct Imaging Apparatus and Imaging Method - A laser beam direct imaging apparatus and an imaging method which can precisely determine a back-surface-side position with respect to a front-surface-side position even if any kind of photosensitive material is used. In the laser direct imaging apparatus, a laser beam is deflected toward a main scanning direction (X-axis direction) while a workpiece mounted on a table is moved in a sub-scanning direction (Y-axis direction) so that a pattern is imaged on the surface of the workpiece. Hollow pins are disposed on the table so that the tips of the hollow pins | 04-02-2009 |
20090080047 | Laser Direct Imaging Apparatus - A laser direct imaging apparatus which can expose photosensitive materials having various sensitivities and which can correct an imaging position in accordance with deformation of a workpiece. In the laser direct imaging apparatus, the workpiece is moved in a sub-scanning direction while a cylindrical lens is used to converge a laser beam, which has been modulated based on raster data, in the sub-scanning direction and deflect the laser beam toward a main scanning direction so as to image a desired pattern on the workpiece. The cylindrical axis of the cylindrical lens is designed to be able to rotate horizontally and to be able to change an angle with respect to the main scanning direction. | 03-26-2009 |
20080314625 | Printed Circuit Board and Method of Manufacturing the Same - The present invention relates to a method of manufacturing a printed circuit board and to a printed circuit board, the method comprising the steps of: preliminarily forming a plurality of test pattern layers | 12-25-2008 |
20080244158 | Drawing Apparatus - A drawing apparatus which can create an exposure pattern rapidly. The drawing apparatus has a raster conversion processing module for converting vector images as wiring patterns into bitmap image data, an image cache module for temporarily storing a predetermined-size cached image supplied from the raster conversion processing module, a first compression module for compressing the cached image stored in the image cache module, a second compression module for compressing the cached image stored in the image cache module in a compression ratio differing from that of the first compression module, a comparison module for comparing data sizes of compressed data generated by the first and second compression modules and selecting one having a smaller data size, a memory access module for writing the compressed data selected by the comparison module, into a storage module, and a cache region control module for controlling a compression status of the cached image. | 10-02-2008 |
20080237204 | Laser Beam Machining Method for Printed Circuit Board - A laser beam machining method for a printed circuit board, for enabling to bring the depth of a bottom surface of grooves within an overlap region, which is irradiated with a laser beam, repetitively, to be nearly equal to that of the bottom surface of grooves within other regions, comprises the following steps of: fixing a line beam | 10-02-2008 |
20080232421 | Method and Apparatus for Forming a Plurality of Laser Beams With Ultraviolet Wavelength, and Laser Machining Apparatus - The invention provides a method and an apparatus for forming a plurality of ultraviolet-wavelength laser beams, and a laser machining apparatus, in which the machining efficiency can be improved due to easy maintenance and inspection while deterioration of wavelength conversion means can be prevented to reduce the running cost. A laser beam with a near infrared wavelength output from a laser oscillator is branched into a plurality of laser beams by a laser distribution unit. Each branched laser beam is partially converted into a laser beam whose wavelength is ½ of the near infrared wavelength by a wavelength converter. An ultraviolet laser beam whose wavelength is ⅓ of the near infrared wavelength of the laser beam is formed out of the branched laser beam and the laser beam with the wavelength which is ½ of the near infrared wavelength by another wavelength converter, both the branched laser beam and the laser beam with the wavelength which is ½ of the near infrared wavelength being output from the wavelength converter. The ultraviolet laser beam is extracted and supplied to a portion to be machined, by a wavelength separator. | 09-25-2008 |
20080230512 | Printed Circuit Board and Method for Processing Printed Circuit Board - The invention is to provide a printed circuit board in which advance of packaging density of the printed circuit board and reduction in production cost can be attained while processing quality can be made uniform, a method for processing the printed circuit board and a method for producing the printed circuit board. | 09-25-2008 |
20080223839 | Laser Machining Apparatus - A laser machining apparatus capable of accurately projecting mask patterns onto a work piece and superior in machining accuracy. An auto-focusing unit is provided. The auto-focusing unit includes a television camera for observing alignment marks formed on the surface of the work piece so as to be able to measure the focal length of a projection lens. A main-scanning direction expansion/contraction ratio Ex of the work piece to its design value and a sub-scanning direction expansion/contraction ratio Ey of the work piece to its design value are obtained. The imaging magnification M of the projection lens is corrected to compensate the expansion/contraction ratio Ex. The moving speed of a mask and/or the moving speed of the work piece are corrected in consideration of the imaging magnification M of the projection lens so as to compensate the expansion/contraction ratio Ey. | 09-18-2008 |
20080223833 | Machining Apparatus for Drilling Printed Circuit Board - A machining apparatus in which the machining efficiency can be improved even if characters are machined in a printed circuit board. A coordinate transformation unit is provided for transforming central coordinates of each dot d of each character of a character string into coordinates in a machining coordinate system with which the holes will be machined. Prior to machining, based on a character string and position information of the character string described in a machining program, central coordinates of each dot of each character of the character string are transformed into coordinates in the machining coordinate system with which the holes will be machined. Each dot d is regarded as a hole and machined. The number of times of movement of a table can be thus minimized so that the machining efficiency can be improved. | 09-18-2008 |
20080213705 | PATTERN EXPOSURE METHOD AND PATTERN EXPOSURE APPARATUS - A pattern exposure method and a pattern exposure apparatus in which the throughput is improved with an inexpensive apparatus and without a low running cost. Output faces of a plurality of laser beams emitted from a plurality of semiconductor lasers respectively are arranged in two directions. One of the directions is the same direction as the scanning direction of a polygon mirror while the other is a direction crossing the scanning direction of the polygon mirror. In this event, the array pitch of the output faces arranged in the direction crossing the scanning direction of the polygon mirror is made equal to resolution of an exposure pattern. In this event, the wavelength of each laser may be made not longer than 410 nm. | 09-04-2008 |