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HITACHI HIGH-TECHNOLOGIES CORPORTION
| HITACHI HIGH-TECHNOLOGIES CORPORTION Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20080297782 | WAFER SURFACE INSPECTION APPARATUS AND WAFER SURFACE INSPECTION METHOD - A wafer surface inspection method and apparatus of high sensitivity, and free from performance degradation in terms of cleanliness, coordinate repeatability of foreign particles and the like. Gas for cooling is sprayed onto a laser irradiation position on the wafer surface to prevent an increase in temperature of the foreign particles and to suppress break-down of the foreign particles. | 12-04-2008 |