Hitachi Chemical Dupont Microsystems, Ltd.
|Hitachi Chemical Dupont Microsystems, Ltd. Patent applications|
|Patent application number||Title||Published|
|20130143011||PHOTOSENSITIVE RESIN COMPOSITION - A photosensitive resin composition including: (a) a polyamide acid; (b) a compound (b1) having 4 or more of a methylol group, a methoxymethyl group and the both thereof, or a compound (b2) represented by the following formula (2); and (c) a photopolymerization initiator.||06-06-2013|
|20120328856||PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME - A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).||12-27-2012|
|20120288798||POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PATTERNED CURED FILM AND ELECTRONIC COMPONENT - A positive photosensitive resin composition including:||11-15-2012|
|20110171436||NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, PATTERN FORMING METHOD AND ELECTRONIC PARTS - A negative-type photosensitive resin composition which is good in sensitivity and resolution, a pattern forming method by the use thereof wherein a pattern which can be developed in an alkali aqueous solution, is excellent in sensitivity, resolution and heat resistance and has a good shape is obtained, and highly reliable electronic parts are provided. The negative-type photosensitive rein composition includes (a) a polymer that has a phenolic hydroxyl group at a terminal and is soluble in the alkali aqueous solution, (b) a compound that generates an acid by irradiating active light, and (c) a compound that can be crosslinked or polymerized by an action of the acid.||07-14-2011|
|20110059305||POLYIMIDE PRECURSOR COMPOSITION, POLYIMIDE FILM, AND TRANSPARENT FLEXIBLE FILM - The polyimide precursor composition of the present invention is characterized in comprising a polyimide precursor having a structure formed by reacting a diamine component (A) containing a fluorine-containing aromatic diamine (a1) represented by the following chemical formula (I)||03-10-2011|
|20110027544||Resin composition for insulating film or surface-protective film of electronic components, method for producing pattern-cured film and electronic components - A resin composition includes: (A) a polymer having a structural unit shown by the formula (I), and an acidic functional group or a group derived therefrom at both of the terminals;||02-03-2011|
|20100260983||PHOTOSENSITIVE RESIN COMPOSITION AND CIRCUIT FORMATION SUBSTRATE USING THE SAME - A photosensitive resin composition for an interlayer insulating film or a protective film of a substrate for circuit formation, which includes a polymer (a) having a structural unit shown by the formula (A) and a compound (b) which generates a radical when irradiated with active rays and has a structure shown by the following formula (B).||10-14-2010|
|20100258336||POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERN, ELECTRONIC COMPONENT - Provided are a positive photosensitive resin composition that is developable in an alkaline aqueous solution and gives a good shaped pattern that is excellent in heat resistance and mechanical property, a method for producing the pattern and an electronic component. The positive photosensitive resin composition contains (a) polybenzoxazole or a polybenzoxazole precursor polymer having a structural unit represented by either a general formula (1) or (2) and satisfying conditions (i) and/or (ii), (b) a compound that generates an acid by being irradiated with active light ray and (c) a compound having a structure represented by a general formula (3) crosslinkable or polymerizable with said component (a).||10-14-2010|
|20100159217||NEGATIVE-TYPE PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING PATTERNS, AND ELECTRONIC PARTS - A heat resistant negative-type photosensitive resin composition which is good in sensitivity and resolution, a method for producing a pattern capable of obtaining the pattern which is excellent in sensitivity, resolution and heat resistance and has a good shape, and a highly reliable electronic part having the pattern having a good shape and property are provided. A crosslinking agent capable of crosslinking or polymerizing by an action of an acid includes a compound having at least one methylol group or alkoxyalkyl group in a molecule, in the negative-type photosensitive resin composition.||06-24-2010|
|20100092879||PHOTOSENSITIVE RESIN COMPOSITION, PROCESS FOR PRODUCING PATTERNED HARDENED FILM WITH USE THEREOF AND ELECTRONIC PART - To provide a photosensitive resin composition in which a hardened film obtained from the photosensitive resin composition has properties comparable to those of a film hardened at a high temperature, a method for manufacturing a patterned hardened film using the photosensitive resin composition, and an electronic part. The photosensitive resin composition includes (a) a polybenzoxazole precursor having a repeating unit represented by a general formula (I):||04-15-2010|
|20090189254||CIRCUIT CONNECTION STRUCTURE, METHOD FOR PRODUCING THE SAME AND SEMICONDUCTOR SUBSTRATE FOR CIRCUIT CONNECTION STRUCTURE - A circuit connection structure that exhibits excellent adhesiveness between a heat resistant resin film and a circuit adhesive member, even under high temperature and high humidity, is provided by introducing a chemically stable functional group into the heat resistant resin film by additional surface treatment to improve adhesiveness. In a circuit connection structure, a semiconductor substrate and a circuit member are adhered by a circuit adhesive member sandwiched therewith. First circuit electrode on the semiconductor substrate and second circuit electrode on the circuit member are connected electrically by conductive particles in the circuit adhesive member. A surface modification is given to the semiconductor substrate by plasma treatment using gas containing nitrogen, ammonia and the like. Therefore, the heat resistant resin film on the semiconductor substrate and the circuit adhesive member are firmly adhered for a long period of time even under high temperature and high humidity.||07-30-2009|
|20090137129||METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method is provided for manufacturing a semiconductor device having a heat-resistant resin film with flip-chip connection structure using a solder bump or a gold bump and an epoxy resin compound laminated thereon, in which adhesiveness is improved particularly after exposure to high temperature and high humidity environments for a long period of time, thereby enhancing the reliability of the semiconductor device. The method, in accordance with the present invention, for manufacturing a semiconductor device having a heat-resistant resin film formed on a semiconductor element and an epoxy resin compound layer laminated thereon, comprises the steps of carrying out a plasma treatment on a surface of the heat-resistant resin film on which the epoxy resin compound layer is laminated using a nitrogen atom-containing gas containing at least one of nitrogen, ammonia, and hydrazine.||05-28-2009|
Patent applications by Hitachi Chemical Dupont Microsystems, Ltd.