| HITACHI CHEMICAL COMPANY, LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120114517 | Thermoelectric material formed of Mg2Si-based compound and production method therefor - A thermoelectric material (and a method for producing the same) is essentially formed of an Mg | 05-10-2012 |
| 20120104333 | COATED CONDUCTIVE PARTICLES AND METHOD FOR PRODUCING SAME - [Problem to be Solved] To provide conductive particles which are capable of providing an anisotropically conductive adhesive that can maintain sufficient insulation characteristics and conduction characteristics even when used for the connection of a very small circuit, while having excellent moisture absorption resistance at a lower cost. [Solution] A coated conductive particle ( | 05-03-2012 |
| 20120100718 | CMP Fluid and Method for Polishing Palladium - The CMP polishing liquid for polishing palladium of this invention comprises an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. The substrate polishing method is a method for polishing a substrate with a polishing cloth while supplying a CMP polishing liquid between the substrate and the polishing cloth, wherein the substrate is a substrate with a palladium layer on the side facing the polishing cloth, and the CMP polishing liquid is a CMP polishing liquid comprising an organic solvent, 1,2,4-triazole, a phosphorus acid compound, an oxidizing agent and an abrasive. | 04-26-2012 |
| 20120097902 | ANISOTROPIC CONDUCTIVE PARTICLES - The anisotropic conductive particles of the invention have conductive fine particles | 04-26-2012 |
| 20120094491 | CMP POLISHING LIQUID AND POLISHING METHOD - The invention relates to a CMP polishing liquid comprising a medium and silica particles as an abrasive grain dispersed into the medium, characterized in that:
| 04-19-2012 |
| 20120085579 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL AND CONNECTING STRUCTURE OF CIRCUIT MEMBER - An adhesive composition comprising: an adhesive component, conductive particles and insulating particles, wherein the ratio of the mean particle size of the insulating particles Ri to the mean particle size of the conductive particles Rc (Ri/Rc) is 120 to 300%. | 04-12-2012 |
| 20120040290 | PHOTOSENSITIVE RESIN COMPOSITION, AND PHOTOSENSITIVE ELEMENT, RESIST PATTERN FORMATION METHOD AND PRINTED CIRCUIT BOARD PRODUCTION METHOD EACH UTILIZING SAME - The present invention relates to a photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizable compound having an ethylenically unsaturated bond and (C) a photopolymerization initiator, wherein the (C) photopolymerization initiator comprises a compound represented by the following general formula (1). In formula (1), R | 02-16-2012 |
| 20120039563 | METHOD FOR PRODUCING OPTICAL WAVEGUIDE, OPTICAL WAVEGUIDE, AND PHOTOELECTRIC COMPOSITE WIRING BOARD - (1) A method for producing a flexible optical waveguide, containing: a step of forming a first cladding layer; a step of forming a first core layer by laminating a resin film for forming a core layer on at least one end portion of the first cladding layer; a step of forming a second core layer by laminating a resin film for forming a core layer on an entire surface of the first core layer and the first cladding layer; a step of forming a core pattern by patterning the first and second core layers; and a step of embedding the core pattern by forming a second cladding layer on the core pattern and the first cladding layer, (2) a flexible optical waveguide containing a lower cladding layer, a core part and an upper cladding layer, the upper cladding layer having a width that is smaller than a width of the lower cladding layer at least in a bent portion, and is equal to or smaller than a width of the lower cladding layer in an end portion, and the lower cladding layer having a width in a bent portion that is equal to or smaller than a width thereof in an end portion, and a method for producing the same. A flexible optical waveguide that is excellent in bending durability and has small optical loss, and a method for producing the same. | 02-16-2012 |
| 20120024818 | POLISHING AGENT FOR COPPER POLISHING AND POLISHING METHOD USING SAME - A polishing agent for copper polishing, comprising (A) an inorganic acid with divalent or greater valence, (B) an amino acid, (C) a protective film-forming agent, (D) an abrasive, (E) an oxidizing agent and (F) water, wherein the content of the component (A) is at least 0.08 mol/kg, the content of the component (B) is at least 0.20 mol/kg, the content of the component (C) is at least 0.02 mol/kg, and either or both of the following conditions (i) and (ii) are satisfied.
| 02-02-2012 |
| 20120015126 | ADHESIVE MATERIAL REEL - A bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has a region in which an adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and an end tape which is bonded to the terminal end of the tape for circuit connection so as to cover the region, and extends toward the core from the terminal end. | 01-19-2012 |
| 20120012999 | SEMICONDUCTOR-ENCAPSULATING ADHESIVE, SEMICONDUCTOR-ENCAPSULATING FILM-FORM ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE - The present invention relates to a semiconductor-encapsulating adhesive, a semiconductor-encapsulating film-form adhesive, a method for producing a semiconductor device, and a semiconductor device. The present invention provides a semiconductor-encapsulating adhesive comprising (a) an epoxy resin, and (b) a compound formed of an organic acid reactive with an epoxy resin and a curing accelerator. | 01-19-2012 |
| 20110318929 | CMP POLISHING SOLUTION AND POLISHING METHOD - The CMP polishing solution of the invention comprises (A) a metal corrosion inhibitor containing a compound with a 1,2,3-triazolo[4,5-b]pyridine skeleton, (B) an abrasive grain having a positive zeta potential in the CMP polishing solution, (C) a metal oxide solubilizer and (D) an oxidizing agent. The polishing method of the invention comprises a first polishing step in which the conductive substance layer of a substrate comprising an interlayer insulating filth having an elevated section and a trench at the surface, a barrier layer formed following the surface of the interlayer insulating film and the conductive substance layer formed covering the barrier layer, is polished to expose the barrier layer located on the elevated section of the interlayer insulating film, and a second polishing step in which the barrier layer exposed in the first polishing step is polished using the CMP polishing solution to expose the elevated section of the interlayer insulating film. | 12-29-2011 |
| 20110308729 | ADHESIVE TAPE AND SOLAR CELL MODULE USING THE SAME - The present invention provides an adhesive tape | 12-22-2011 |
| 20110308728 | ADHESIVE TAPE AND SOLAR CELL MODULE USING THE SAME - The present invention provides an adhesive tape | 12-22-2011 |
| 20110301362 | NOVEL LIQUID TETRACARBOXYLIC DIANHYDRIDES AND PROCESS FOR THE PREPARATION THEREOF - The invention relates to a tetracarboxylic dianhydride represented by the following formula (1). | 12-08-2011 |
| 20110300778 | ABRADING AGENT AND ABRADING METHOD - A polishing agent which comprises a composition containing an inorganic acid, an amino acid, a protective film-forming agent, an abrasive, an oxidizing agent, an organic acid and water, adjusted to a pH of 1.5-4, wherein the amount of potassium hydroxide required to raise the pH of the composition without the organic acid to 4 is at least 0.10 mol with respect to 1 kg of the composition without the organic acid, and the organic acid contains at least two carboxyl groups, wherein the logarithm of the inverse of the first acid dissociation constant (pKa1) is no greater than 3. | 12-08-2011 |
| 20110300326 | ADHESIVE MATERIAL REEL - The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region. | 12-08-2011 |
| 20110291260 | SEMICONDUCTOR ENCAPSULATION ADHESIVE COMPOSITION, SEMICONDUCTOR ENCAPSULATION FILM-LIKE ADHESIVE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE - A semiconductor encapsulation adhesive composition comprising (a) an epoxy resin, (b) a curing agent and (c) an antioxidant. | 12-01-2011 |
| 20110275285 | POLISHING SOLUTION FOR CMP AND POLISHING METHOD USING THE POLISHING SOLUTION - The polishing solution for CMP according to the invention comprises abrasive grains, an additive and water, and the polishing solution comprises an organic compound satisfying specified conditions as the additive. The polishing method of the invention is for polishing of a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad. | 11-10-2011 |
| 20110275217 | POLISHING SOLUTION FOR CMP AND POLISHING METHOD USING THE POLISHING SOLUTION - The polishing solution for CMP of the invention comprises abrasive grains, a first additive and water, wherein the first additive is at least 1,2-benzoisothiazole-3(2H)-one or 2-aminothiazole. The polishing method of the invention is a polishing method for a substrate having a silicon oxide film on the surface, and the polishing method comprises a step of polishing the silicon oxide film with a polishing pad while supplying the polishing solution for CMP between the silicon oxide film and the polishing pad. | 11-10-2011 |
| 20110272292 | METAL COLLECTION METHOD AND METAL COLLECTION DEVICE - The method of the present invention includes a step (i) in which a voltage is applied between first and second electrodes | 11-10-2011 |
| 20110267791 | CIRCUIT CONNECTION MATERIAL, AND CONNECTION STRUCTURE OF CIRCUIT MEMBER AND CONNECTION METHOD OF CIRCUIT MEMBER USING THE CIRCUIT CONNECTION MATERIAL - A circuit connection material | 11-03-2011 |
| 20110241968 | MULTI-BEAM ANTENNA DEVICE - Provided is a multi-beam antenna device capable of suppressing an increase in loss of a Rotman lens so as to achieve enhanced gain. | 10-06-2011 |
| 20110223539 | PHOTOSENSITIVE RESIN COMPOSITION FOR PROTECTIVE FILM OF PRINTED WIRING BOARD FOR SEMICONDUCTOR PACKAGE - The photosensitive resin composition for a protective film of a printed wiring board for a semiconductor package, according to the invention, comprises (A) an acid-modified vinyl group-containing epoxy resin, (B) a phenol compound, (C) a compound having at least one ethylenically unsaturated group in each molecule, (D) a photopolymerization initiator and (E) inorganic fine particles. | 09-15-2011 |
| 20110198433 | REEL - A reel comprising a columnar wind-up unit | 08-18-2011 |
| 20110176288 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTING STRUCTURE FOR CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a thermoplastic resin, a radical polymerizing compound, a radical polymerization initiator and a radical polymerization regulator. According to the present invention it is possible to provide an adhesive composition, a circuit connecting material, a connection structure for a circuit member and a semiconductor device whereby curing treatment can be carried out with sufficient speed at low temperature, curing treatment can be carried out with a wide process margin, and adequately stable adhesive strength can be obtained. | 07-21-2011 |
| 20110159430 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD OF FORMING RESIST PATTERN AND METHOD OF PRODUCING PRINTED WIRING BOARD - A photosensitive resin composition comprising: (A) a binder polymer having a divalent group represented by formula (I), (II) and (III); (B) a photopolymerizing compound; and (C) a photopolymerization initiator. | 06-30-2011 |
| 20110139922 | REEL - A reel including a columnar wind-up unit | 06-16-2011 |
| 20110139916 | REEL - A reel including a columnar wind-up unit | 06-16-2011 |
| 20110133346 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 06-09-2011 |
| 20110127667 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 06-02-2011 |
| 20110121447 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 05-26-2011 |
| 20110121243 | ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES - The anisotropically conductive adhesive composition according to the present invention is an anisotropically conductive adhesive composition to connect a first circuit member where a first circuit electrode is formed on the principal surface of a first substrate and a second circuit member where a second circuit electrode is formed on the principal surface of a second substrate with the first circuit electrode and the second circuit electrode placed opposite, wherein the anisotropically conductive adhesive composition comprises an adhesive and a coated particle where at least part of the surface of a conductive particle is coated with an insulating material containing a polymer electrolyte and an inorganic oxide fine particle. | 05-26-2011 |
| 20110111344 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD - A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound having an ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a polymerization inhibitor, wherein the content of the (D) polymerization inhibitor is 20-100 ppm by mass based on the total solid content of the composition. | 05-12-2011 |
| 20110086309 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD - The invention provides a photosensitive resin composition comprising (A) 100 parts by weight of a binder polymer having 10-65 parts by weight of a divalent group obtained from a specific styrene compound and its derivative, 5-55 parts by weight of a divalent group obtained from a specific (meth)acrylic acid ester and its derivative and 15-50 parts by weight of a divalent group obtained from (meth)acrylic acid, (B) a photopolymerizing compound and (C) a photopolymerization initiator. | 04-14-2011 |
| 20110081616 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, RESIST PATTERN MANUFACTURING METHOD, AND PRINTED CIRCUIT BOARD MANUFACTURING METHOD - A photosensitive resin composition comprising a (A) binder polymer, a (B) photopolymerizing compound having ethylenic unsaturated bonds in the molecule, a (C) photopolymerization initiator and a (D) polymerization inhibitor, wherein the (C) photopolymerization initiator comprises an acridine compound, and the content of the (D) polymerization inhibitor is 20-100 ppm by weight. | 04-07-2011 |
| 20110052118 | Fabrication Method of Optical Wiring Board and Optical Printed Circuit Board - The fabrication of an optical wiring board is performed in the following manner: A core member | 03-03-2011 |
| 20110045639 | PHOTOSENSITIVE ADHESIVE - A photosensitive adhesive capable of alkali development, the photosensitive adhesive exhibiting adhesion property for an adherend after it has been patterned by light exposure and development, the photosensitive adhesive being used in a method for producing a semiconductor device | 02-24-2011 |
| 20110045354 | ARTIFICIAL GRAPHITE PARTICLES AND METHOD FOR MANUFACTURING SAME, NONAQUEOUS ELECTROLYTE SECONDARY CELL NEGATIVE ELECTRODE AND METHOD FOR MANUFACTURING SAME, AND LITHIUM SECONDARY CELL - Artificial graphite particles, having a secondary particle structure in which a plurality of primary particles composed of graphite are clustered or bonded together, and having a layer structure in which the edge portion of the primary particles is bent in a polyhedral shape. | 02-24-2011 |
| 20110031631 | PHOTOSENSITIVE ADHESIVE, SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device | 02-10-2011 |
| 20110031449 | CONDUCTIVE FINE PARTICLES AND ANISOTROPIC CONDUCTIVE MATERIAL - The invention provides conductive fine particles with a satisfactory monodisperse property, low cost, resistance to migration and excellent conductivity. Conductive fine particles having core particle surfaces coated with a metal-plated coating film layer containing nickel and phosphorus and a multilayer conductive layer comprising a palladium layer as the outer surface, wherein the phosphorus content in region A of the metal-plated coating film layer, at a distance of no greater than 20% of the thickness of the entire metal-plated coating film layer from the surface of the core particle, is 7-15 wt % of the entire region A, the phosphorus content in region B of the metal-plated coating film layer, at a distance of no greater than 10% of the thickness of the entire metal-plated coating film layer from the surface of the metal-plated coating film layer on the palladium layer side, is 0.1-3 wt % of the entire region B, and the phosphorus content of the entire metal-plated coating film layer is 7 wt % or greater. | 02-10-2011 |
| 20110027997 | POLISHING LIQUID FOR CMP AND POLISHING METHOD - The present invention can provide a polishing liquid for CMP having good dispersion stability and a high polishing rate in polishing of interlayer insulating films and a polishing method. Disclosed a polishing liquid for CMP comprising: a medium; and colloidal silica particles dispersed in the medium, a blending amount of the colloidal silica particles being 2.0 to 8.0% by mass relative to 100% by mass of the polishing liquid,
| 02-03-2011 |
| 20100327237 | CONDUCTIVE PARTICLE AND METHOD FOR PRODUCING CONDUCTIVE PARTICLE - A conductive particle | 12-30-2010 |
| 20100327227 | SCINTILLATOR SINGLE CRYSTAL, HEAT TREATMENT PROCESS FOR PRODUCTION OF SCINTILLATOR SINGLE CRYSTAL, AND PROCESS FOR PRODUCTION OF SCINTILLATOR SINGLE CRYSTAL - The scintillator single crystal of the invention comprises a cerium-activated orthosilicate compound represented by the following formula (1). | 12-30-2010 |
| 20100307805 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE AND METHOD FOR PRODUCING THE SAME - The circuit connecting material of the invention is a circuit connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and second circuit electrode laid facing each other, the circuit connecting material comprising a curing agent that generates free radicals, a radical polymerizing substance and a compound containing secondary thiol group. The circuit connecting material of the invention is capable of low-temperature rapid curing and has excellent storage stability. | 12-09-2010 |
| 20100294329 | MEMBER FOR CONDUCTOR CONNECTION, METHOD FOR MANUFACTURING THE SAME, CONNECTION STRUCTURE, AND SOLAR CELL MODULE - The member for conductor connection of the invention is a member for conductor connection having an adhesive layer | 11-25-2010 |
| 20100288328 | CONDUCTOR-CONNECTING MEMBER, METHOD FOR PRODUCING THE SAME, CONNECTION STRUCTURE, AND SOLAR CELL MODULE - The conductor-connecting member of the invention is a conductor-connecting member comprising an adhesive layer | 11-18-2010 |
| 20100277884 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTION STRUCTURE - The circuit-connecting material of the invention is a circuit-connecting material for connection between a first circuit member having a first circuit electrode formed on the main side of a first board, and a second circuit member having a second circuit electrode formed on the main side of a second board, with the first circuit electrode and the second circuit electrode laid facing each other, the circuit-connecting material comprising a film-forming material, a curing agent that generates free radicals upon heating, a radical-polymerizing substance, an isocyanate group-containing compound and a ketimine group-containing compound represented by the following general formula (I), wherein the isocyanate group-containing compound content is 0.1-5 parts by weight and the ketimine group-containing compound content is 0.1-5 parts by weight with respect to 100 parts by weight as the total of the film-forming material and radical-polymerizing substance. | 11-04-2010 |
| 20100263208 | CIRCUIT CONNECTING METHOD - The invention provides a circuit connecting method that can satisfactorily reduce connection resistance between circuit electrodes electrically connected via an anisotropic conductive film for circuit connection. | 10-21-2010 |
| 20100248162 | Photosensitive Resin Composition, Photosensitive Element Using Same, Method for Forming Resist Pattern, and Method for Producing Printed Wiring Board - The photosensitive resin composition of the invention is characterized by comprising (A) a binder polymer, (B) a photopolymerizing compound with at least one polymerizable ethylenic unsaturated bond in the molecule, (C) a photopolymerization initiator and (D) a compound represented by the following general formula (1). | 09-30-2010 |
| 20100243303 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND METHOD FOR MANUFACTURING CONNECTION STRUCTURE OF CIRCUIT MEMBER - The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component. | 09-30-2010 |
| 20100243059 | SOLAR BATTERY CELL - Disclosed is a solar battery cell comprising: a crystalline silicon substrate; a cell electrode for extracting external electric power formed on a light-receiving surface of the crystalline silicon substrate; a front surface tab line connected to the cell electrode; a rear surface electrode formed on a reverse light-receiving surface of the crystalline silicon substrate; and a rear surface tab line connected to the rear surface electrode, wherein the rear surface electrode and the rear surface tab line are connected with a resin conductive paste or conductive film, and the rear surface electrode is uniformly formed on the reverse light-receiving surface of the crystalline silicon substrate. The solar battery cell can improve efficiency of electric power generation and decrease costs for members thereof. | 09-30-2010 |
| 20100221533 | CIRCUIT CONNECTING ADHESIVE FILM AND CIRCUIT CONNECTING STRUCTURE - A circuit connecting adhesive film comprising an insulating adhesive, conductive particles and a particulate non-conductive phase containing a polyamide-based elastomer and/or a polyester-based elastomer, wherein the conductive particles and non-conductive phase are dispersed in the insulating adhesive. | 09-02-2010 |
| 20100216309 | CMP POLISHING LIQUID AND METHOD FOR POLISHING SUBSTRATE USING THE SAME - Disclosed is a CMP polishing liquid for polishing a substrate having a layer containing ruthenium, comprising: an oxidizing agent; polishing particles; water; and a compound having a structure represented by the following Formula (1), or a salt thereof. This CMP liquid is improved in at least the polishing rate to a ruthenium layer when compared with conventional polishing liquid. Also disclosed is a method for polishing a substrate using such a CMP polishing liquid. | 08-26-2010 |
| 20100212943 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER - The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. | 08-26-2010 |
| 20100208444 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER - The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. | 08-19-2010 |
| 20100167030 | ADHESIVE TAPE AND ADHESIVE TAPE ROLL - The invention provides an adhesive tape comprising a tape-like support base and a tape-like adhesive layer, wherein the adhesive layer is formed on the main side of the support base and the width of the support base is longer than the width of the adhesive layer. According to the invention, seepage of adhesive components in the adhesive layer of the adhesive tape in the widthwise direction from the sides of the support base can be reduced compared to the prior art. | 07-01-2010 |
| 20100147355 | CONNECTED STRUCTURE AND METHOD FOR MANUFACTURE THEREOF - A method for electrically connecting a surface electrode of a solar battery cell and a wiring member via a conductive adhesive film, wherein the conductive adhesive film contains an insulating adhesive and conductive particles, and wherein when the ten point height of roughness profile and maximum height of the surface of the surface electrode in contact with the conductive adhesive film are Rz (μm) and Ry (μm) respectively, the average particle diameter r (μm) of the conductive particles is equal to or greater than the ten point height of roughness profile Rz, and the thickness t (μm) of the conductive adhesive film is equal to or greater than the maximum height Ry. | 06-17-2010 |
| 20100140556 | FILMY ADHESIVE FOR CIRCUIT CONNECTION - A filmy adhesive for circuit connection that is interposed between circuit electrodes opposed to each other and by heating and applying pressure to the circuit electrodes opposed to each other, attains electrical connection between the electrodes along the direction of pressure application, characterized in that the angle of contact of the adhesive after hardening with water is 90° or greater. | 06-10-2010 |
| 20100139947 | CIRCUIT-CONNECTING MATERIAL, AND CONNECTION STRUCTURE FOR CIRCUIT MEMBER - A circuit-connecting material for electrical connection of two circuit members with circuit electrodes formed thereon, with the circuit electrodes opposing, wherein the circuit-connecting material comprises an adhesive composition and conductive particles, and the conductive particles are conductive particles having a plurality of protrusions on the surface and consisting of a core made of an organic high molecular compound covered with a metal layer composed of nickel or a nickel alloy, the mean particle size of the core being 1-4 μm and the thickness of the metal layer being 65-125 nm. | 06-10-2010 |
| 20100133486 | COATED PARTICLE AND METHOD FOR PRODUCING THE SAME, ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION USING COATED PARTICLE, AND ANISOTROPIC CONDUCTIVE ADHESIVE FILM - Disclosed is a coated particle ( | 06-03-2010 |
| 20100129752 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT EMPLOYING THE SAME, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD - The photosensitive resin composition of the present invention is a photosensitive resin composition comprising:
| 05-27-2010 |
| 20100116314 | CONDUCTOR CONNECTION MEMBER, CONNECTION STRUCTURE, AND SOLAR CELL MODULE - The electric conductor connecting member of this invention comprises a metal foil having a roughened surface on at least one main side, and an adhesive layer formed on the roughened surface of the metal foil. | 05-13-2010 |
| 20100116310 | SOLAR BATTERY CELL CONNECTION METHOD AND SOLAR BATTERY MODULE - The method of connecting solar battery cells of the present invention is a method of connecting solar battery cells which are each provided with a front-face electrode on a front face thereof and a back-face electrode on a back face thereof, and comprises: a first process of preparing a wiring member including a strip-like conductive substrate and an adhesive layer provided on one face of the conductive substrate, and bonding the adhesive layer on one end portion of the wiring member with a front-face electrode or a back-face electrode of one solar battery cell; a second process of turning an other end portion of the wiring member having gone through the first process, around a central axis along a longitudinal direction thereof so that an adhesive layer surface of the other end portion is opposite in orientation to an adhesive layer surface of the one end portion; and a third process of bonding the adhesive layer of the other end portion of the wiring member having gone through the second process with an electrode of an other solar battery cell having an opposite polarity to the electrode of the one solar battery cell which has been bonded in the aforementioned first process. | 05-13-2010 |
| 20100112481 | PHOTOSENSITIVE ELEMENT - A photosensitive element | 05-06-2010 |
| 20100110652 | ANISOTROPIC CONDUCTIVE ADHESIVE COMPOSITION, ANISOTROPIC CONDUCTIVE FILM, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD FOR MANUFACTURING COATED PARTICLES - The anisotropically conductive adhesive composition according to the present invention is an anisotropically conductive adhesive composition to connect a first circuit member where a first circuit electrode is formed on the principal surface of a first substrate and a second circuit member where a second circuit electrode is formed on the principal surface of a second substrate with the first circuit electrode and the second circuit electrode placed opposite, wherein the anisotropically conductive adhesive composition comprises an adhesive and a coated particle where at least part of the surface of a conductive particle is coated with an insulating material containing a polymer electrolyte and an inorganic oxide fine particle. | 05-06-2010 |
| 20100108365 | CIRCUIT CONNECTION MATERIAL, CIRCUIT MEMBER CONNECTING STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER - The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group. | 05-06-2010 |
| 20100108141 | METHOD FOR CONNECTING CONDUCTOR, MEMBER FOR CONNECTING CONDUCTOR, CONNECTING STRUCTURE AND SOLAR CELL MODULE - The electric conductor connection method of the invention is a method for electrical connection between a mutually separated first electric conductor and second electric conductor, comprising a step of hot pressing a metal foil, a first adhesive layer formed on one side of the metal foil and a first electric conductor, arranged in that order, to electrically connect and bond the metal foil and first electric conductor, and hot pressing the metal foil, the first adhesive layer or second adhesive layer formed on the other side of the metal foil, and the second electric conductor, arranged in that order, to electrically connect and bond the metal foil and the second electric conductor. | 05-06-2010 |
| 20100102321 | RADIATION-SENSITIVE COMPOSITION, METHOD OF FORMING SILICA-BASED COATING FILM, SILICA-BASED COATING FILM, APPARATUS AND MEMBER HAVING SILICA-BASED COATING FILM AND PHOTOSENSITIZING AGENT FOR INSULATING FILM - The present invention provides a photosensitive resin composition comprising a component (a): a siloxane resin obtained by hydrolyzing and condensing a silane compound comprising a compound represented by the general formula (1) shown below, a component (b): a solvent dissolving the component (a) therein, and a component (c): a quinonediazide sulfonic acid ester. | 04-29-2010 |
| 20100089626 | COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL FOR CONNECTING CIRCUIT BOARD, AND MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF - It is an object of the invention to provide a composite with sufficiently reliable bonding and adequately minimized generation of fluff from flaking resin dust and fibers. This object is achieved by the composite ( | 04-15-2010 |
| 20100071940 | CONNECTING TERMINAL, SEMICONDUCTOR PACKAGE USING CONNECTING TERMINAL AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE - The connection reliability of connecting terminals with displacement gold plating films is improved by connecting terminals comprising a conductive layer, an electroless nickel plating film, a first palladium plating film which is a displacement or electroless palladium plating film with a purity of 99% by mass or greater, a second palladium plating film which is an electroless palladium plating film with a purity of at least 90% by mass and less than 99% by mass, and a displacement gold plating film, wherein the electroless nickel plating film, the first palladium plating film, the second palladium plating film and the displacement gold plating film are laminated in that order on one side of the conductive layer, and the displacement gold plating film is situated on the uppermost surface layer on the opposite side from the conductive layer. | 03-25-2010 |
| 20100065311 | CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER - The conductive particle of the invention each comprises a conductive nucleus particle and an insulating coating containing an organic high molecular compound on the surface of the nucleus particle, and the coverage factor as defined by the following formula (1) is in the range of 20-40%. | 03-18-2010 |
| 20100041785 | PHOTOSENSITIVE RESIN COMPOSITION AND PHOTOSENSITIVE ELEMENT USING THE SAME - The photosensitive resin composition of the invention comprises (A) a carboxyl group-containing binder polymer, (B) a photopolymerizing compound, (C) a photopolymerization initiator and (D) a dicyandiamide and/or its derivative, wherein the (B) photopolymerizing compound contains (B1) a compound with a weight-average molecular weight of 3500-100000 and with an urethane bond and an ethylenic unsaturated group in the molecule. | 02-18-2010 |
| 20100028808 | PHOTOSENSITIVE ELEMENT - A photosensitive element wherein the haze of the support film | 02-04-2010 |
| 20100025097 | CIRCUIT CONNECTION STRUCTURE - There is provided a circuit connection structure that can provide satisfactory electrical connection between opposing circuit electrodes and that can sufficiently increase the long-term reliability of electrical characteristics between circuit electrodes. A circuit connection structure | 02-04-2010 |
| 20100021667 | ADHESIVE TAPE - An adhesive tape | 01-28-2010 |
| 20100018755 | ANISOTROPIC CONDUCTIVE TAPE AND METHOD OF MANUFACTURING IT, CONNECTED STRUCTURE AND METHOD OF CONNECTING CIRCUIT MEMBER BY USE OF THE TAPE - The anisotropic conductive tape ( | 01-28-2010 |
| 20100013078 | ADHESIVE FOR CONNECTION OF CIRCUIT MEMBER AND SEMICONDUCTOR DEVICE USING THE SAME - An adhesive for connecting circuit members, which is interposed between a semiconductor chip having protruding connecting terminals and a board having wiring patterns formed thereon for electrically connecting the connecting terminals and the wiring patterns facing each other and bonding the semiconductor chip and the board by applying pressure/heat, containing a resin composition containing a thermoplastic resin, a crosslinkable resin and a hardening agent for forming a crosslink structure of the crosslinkable resin; and composite oxide particles dispersed in the resin composition. | 01-21-2010 |
| 20100012358 | CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE FOR CIRCUIT MEMBER USING THE SAME AND PRODUCTION METHOD THEREOF - The circuit-connecting material of the present invention is a circuit-connecting material for connecting a first circuit component having a plurality of first circuit electrodes on a main surface of a first circuit board and a second circuit component having a plurality of second circuit electrodes on a main surface of a second circuit board, in such a manner that the first circuit electrodes and the second circuit electrodes are electrically connected while being opposed to one another; wherein the circuit-connecting material contains an adhesive composition, conductive particles, and a plurality of insulating particles containing one or both of polyamic acid particles and polyimide particles. | 01-21-2010 |
| 20100003771 | PRODUCTION METHOD OF SEMICONDUCTOR DEVICE AND BONDING FILM - To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product | 01-07-2010 |
| 20090317746 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT COMPRISING THE SAME, METHOD OF FORMING RESIST PATTERN, AND PROCESS FOR PRODUCING PRINTED WIRING BOARD - ABSTRACT A photosensitive resin composition according to the invention comprises (A) a binder polymer, (B) a photopolymerizing compound with an ethylenic unsaturated group and (C) a photopolymerization initiator, wherein component (B) contains a compound represented by the following general formula (I). | 12-24-2009 |
| 20090283625 | REEL - A reel comprising a columnar wind-up unit | 11-19-2009 |
| 20090236026 | METHOD FOR MANUFACTURING MULTILAYER FILM - A process for production of a multilayer film that comprises a step in which an adhesive layer formed on a temporary base is situated along the lengthwise direction of the temporary base at a prescribed spacing and cut in such a manner that the plurality of sections which are to serve as adhesive films are partitioned from the other sections, and a step in which the adhesive films on the temporary base are moved onto a support film at a prescribed spacing along the lengthwise direction of the support film. The spacing between the adjacent adhesive films on the temporary base is different from the spacing between the adjacent adhesive films on the support film. | 09-24-2009 |
| 20090235972 | ADHESIVE TAPE AND SOLAR CELL MODULE USING THE SAME - The present invention provides an adhesive tape | 09-24-2009 |
| 20090230233 | REEL - A reel including a columnar wind-up unit | 09-17-2009 |
| 20090202944 | PHOTOSENSITIVE RESIN COMPOSITION, AND, PHOTOSENSITIVE ELEMENT, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING PARTITION WALL FOR PLASMA DISPLAY PANEL USING THE COMPOSITION - A photosensitive resin composition comprising (A) a binder polymer, (B) a photopolymerizing compound with a polymerizable ethylenic unsaturated bond, (C) a photoradical polymerization initiator containing a 2,4,5-triarylimidazole dimer or its derivative, and (D) a compound represented by the following general formula (1) | 08-13-2009 |
| 20090189254 | CIRCUIT CONNECTION STRUCTURE, METHOD FOR PRODUCING THE SAME AND SEMICONDUCTOR SUBSTRATE FOR CIRCUIT CONNECTION STRUCTURE - A circuit connection structure that exhibits excellent adhesiveness between a heat resistant resin film and a circuit adhesive member, even under high temperature and high humidity, is provided by introducing a chemically stable functional group into the heat resistant resin film by additional surface treatment to improve adhesiveness. In a circuit connection structure, a semiconductor substrate and a circuit member are adhered by a circuit adhesive member sandwiched therewith. First circuit electrode on the semiconductor substrate and second circuit electrode on the circuit member are connected electrically by conductive particles in the circuit adhesive member. A surface modification is given to the semiconductor substrate by plasma treatment using gas containing nitrogen, ammonia and the like. Therefore, the heat resistant resin film on the semiconductor substrate and the circuit adhesive member are firmly adhered for a long period of time even under high temperature and high humidity. | 07-30-2009 |
| 20090171061 | PHENOL RESIN AND RESIN COMPOSITION - The present invention provides a phenol resin having, as a unit in its main-chain skeleton, a structure represented by the following general formula (I), as well as a resin composition using the same. According to the phenol resin of the invention, epoxylation thereof, chemical modification thereof, reaction thereof with an epoxy resin, and the like are facilitated. Phenol resins ranging from low-molecular-weight resins rich in fluidity to high-melting resins can be synthesized, and these phenol resins are industrially useful. When the phenol resin of the present invention is used as a hardening agent for epoxy resin etc., its resin composition can give a cured product of high Tg without deteriorating adhesiveness. | 07-02-2009 |
| 20090169808 | COMPOSITE, PREPREG, LAMINATED PLATE CLAD WITH METAL FOIL, MATERIAL FOR CONNECTING CIRCUIT BOARD, AND MULTILAYER PRINTED WIRING BOARD AND METHOD FOR MANUFACTURE THEREOF - It is an object of the invention to provide a composite with sufficiently reliable bonding and adequately minimized generation of fluff from flaking resin dust and fibers. This object is achieved by the composite ( | 07-02-2009 |
| 20090149309 | Sintered Ceramic, Slide Part therefrom, and Process for Producing Sintered Ceramic - It is an object of the invention to provide a ceramic sintered body that has a dense structure and minimal cracking and that exhibits excellent sliding properties even in a non-lubricated state, as well as a process for its production and sliding parts that employ the same. According to a preferred mode, the sintered body of the invention comprises silicon carbide as the parent material and further contains a solid lubricant A with a mean particle size of no greater than 5 μm and a solid lubricant B with a mean particle size of 10-70 μm. | 06-11-2009 |
| 20090093567 | RESIN COMPOSITION FOR SHELL MOLD AND RESIN COATED SAND - A resin composition for a shell mold which reduces smoke generation upon molding of a casting mold and maintains a crumbility and a casting mold strength of a phenolic resin, and resin coated sand by the use thereof are provided. The resin composition for the shell mold includes the phenolic resin and an aromatic condensed phosphate ester. The phenolic resin is used as a binder of the resin coated sand used for producing a main mold and a core for shell mold casting of cast iron, cast steel, aluminum, and the like. The aromatic condensed phosphate ester is very effective as a crumbling agent for improving the crumbility of the casting mold after casting. | 04-09-2009 |
| 20090048392 | Resin Pulley and Resin Composition - A resin pulley is provided in which, in particular, abrasion resistance in a dusty atmosphere and thermal shock resistance are superior and belt attacking property is suppressed. | 02-19-2009 |
| 20080299027 | SCINTILLATOR SINGLE CRYSTAL, HEAT TREATMENT METHOD FOR PRODUCTION OF SCINTILLATOR SINGLE CRYSTAL, AND METHOD FOR PRODUCTION OF SCINTILLATOR SINGLE CRYSTAL - The scintillator single crystal of the invention comprises a cerium-activated orthosilicate compound represented by the following general formula (1). The scintillator single crystal of the invention exhibits improved scintillation properties by reduced segregation between elements in the crystal ingot. | 12-04-2008 |
