| HITACHI CHEMICAL CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120064721 | POLISHING SLURRY AND POLISHING METHOD - The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive of which surface has been modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor. | 03-15-2012 |
| 20110206558 | ANALYTICAL PRETREATMENT DEVICE - The present invention relates to an analytical pretreatment device, comprising a supporting material | 08-25-2011 |
| 20110140300 | Microfluid-System-Supporting Unit And Production Method Thereof - The present invention relates to a microfluid-system-supporting unit, comprising a fixing layer formed on a substrate, a protective layer or a fixing layer, wherein part of at least one hollow filament in any shape is placed and fixed in the fixing layer. Thus, it provides a microfluid-system-supporting unit lower in surface irregularity even when there are multiple hollow filaments different in external diameter or the hollow filaments crosses each other and resistant to positional deviation of the hollow filament in the crossing regions, and a production method thereof. | 06-16-2011 |
| 20110135817 | Microfluid-System-Supporting Unit And Production Method Thereof - The present invention relates to a microfluid-system-supporting unit, comprising a fixing layer formed on a substrate, a protective layer or a fixing layer, wherein part of at least one hollow filament in any shape is placed and fixed in the fixing layer. Thus, it provides a microfluid-system-supporting unit lower in surface irregularity even when there are multiple hollow filaments different in external diameter or the hollow filaments crosses each other and resistant to positional deviation of the hollow filament in the crossing regions, and a production method thereof. | 06-09-2011 |
| 20110132535 | Microfluid-System-Supporting Unit And Production Method Thereof - The present invention relates to a microfluid-system-supporting unit, comprising a fixing layer formed on a substrate, a protective layer or a fixing layer, wherein part of at least one hollow filament in any shape is placed and fixed in the fixing layer. Thus, it provides a microfluid-system-supporting unit lower in surface irregularity even when there are multiple hollow filaments different in external diameter or the hollow filaments crosses each other and resistant to positional deviation of the hollow filament in the crossing regions, and a production method thereof. | 06-09-2011 |
| 20110114893 | CIRCUIT-CONNECTING MATERIAL AND CIRCUIT TERMINAL CONNECTED STRUCTURE AND CONNECTING METHOD - A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material. | 05-19-2011 |
| 20110045470 | PATHOGEN DETECTION IN LARGE-VOLUME PARTICULATE SAMPLES - Methods and filter systems for detecting microorganisms in a sample, such as a food sample, are disclosed. The filter is configured to attract the microorganism, for example by electrostatic charge. The filter containing the microorganism is incubated to grow the microorganism so that it may be detected. The filter may be degradable and the detection may involve extracting the microorganism or the molecular marker of the microorganism from the filter for detection. The filter system may also include a porous microbead component selected to trap dirt and other contaminants from the sample while allowing the microorganisms to pass among the microbeads. Methods are disclosed for detecting microorganisms in samples using the filter systems described. The methods may also include adding a polymer and/or a microorganism detection reagent to the filter to localize microorganism growth and prevent evaporation of reagents. | 02-24-2011 |
| 20110044864 | SUPPORTING UNIT FOR MICROFLUID SYSTEM - The present invention provides a supporting unit of microfluid system having a smaller restriction on the number of the steps and capacity of the reaction and analysis that can be produced easily, and a microfluid-system supporting unit allowing mounting of complicated fluid circuits densely. The present invention relates to a microfluid-system supporting unit, comprising a first supporting plate and at least one hollow filament constituting the channel of the microfluid system, wherein the hollow filament is placed on the first supporting plate in any shape and a particular internal region of the hollow filament has a function. | 02-24-2011 |
| 20110028073 | CMP POLISHING SLURRY AND POLISHING METHOD - The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and α-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films. | 02-03-2011 |
| 20110009033 | POLISHING SLURRY FOR METAL FILMS AND POLISHING METHOD - Provided are a polishing slurry for metal films and a polishing method which restrain the generation of erosion and seams, and makes the flatness of a surface polished therewith or thereby high. The slurry and the method are a polishing slurry, for metal films, comprising abrasive grains, a methacrylic acid based polymer and water, and a polishing method using the slurry, respectively. | 01-13-2011 |
| 20110006251 | CERIUM SALT, PRODUCING METHOD THEREOF, CERIUM OXIDE AND CERIUM BASED POLISHING SLURRY - A cerium salt wherein, when 20 g of the cerium salt is dissolved in a mixed liquid of 12.5 g of 6N nitric acid and 12.5 g of a 30% hydrogen peroxide aqueous solution, a concentration of an insoluble component present in the solution is 5 ppm or less by mass ratio to the cerium salt before dissolution and cerium oxide produced by processing the cerium salt at high temperatures. Scratch on a surface to be polished can be reduced when a cerium based polishing slurry containing the cerium oxide particles is used, since an amount of impurities in cerium oxide particles and cerium salt particles, raw material thereof, is reduced for high purification. | 01-13-2011 |
| 20100323584 | POLISHING LIQUID FOR METAL FILM AND POLISHING METHOD - The invention relates to a polishing liquid for metal film comprising 7.0% by weight or more of an oxidizer for metal, a water-soluble polymer, an oxidized metal dissolving agent, a metal anticorrosive agent and water, provided that the total amount of the polishing liquid for metal film is 100% by weight,
| 12-23-2010 |
| 20100301265 | POLISHING SLURRY AND METHOD OF POLISHING - A polishing slurry comprises a metal-oxidizing agent, a metal anticorrosive agent, an oxidized metal dissolving agent and water. The oxidized metal dissolving agent is at least one kind selected from the group consisting of an acid in which the negative value of the logarithm of the dissociation constant Ka (pKa) of a first dissociable acid group is 3.5 or more, an ammonium salt of the acid and an organic acid ester of the acid. The pH of the polishing slurry is within the range of 3 to 4. The concentration of the metal-oxidizing agent is within the range of 0.01 to 3 percent by weight. In the wiring-formation process of the semiconductor device, the conductor used for the barrier layer can be polished at a high polishing rate by using the polishing slurry having the low polishing particle concentration and the low metal anticorrosive agent concentration. | 12-02-2010 |
| 20100279296 | ENHANCED FC RECEPTOR-MEDIATED TUMOR NECROSIS FACTOR SUPERFAMILY MRNA EXPRESSION IN PERIPHERAL BLOOD LEUKOCYTES IN PATIENTS WITH RHEUMATOID ARTHRITIS - A method for predicting patient responsiveness to rheumatoid arthritis treatments involving altering expression of tumor necrosis factor superfamily (“TNFSF”)-2, TNFSF-8, or TNFSF-15 is disclosed. A method for monitoring the effectiveness of such therapy is also disclosed. Furthermore, a method of screening compounds for use in the treatment of rheumatoid arthritis is disclosed. A method of monitoring the disease state over time in rheumatoid arthritis patients is also disclosed. | 11-04-2010 |
| 20100247940 | Optical resin composition, optical resin material using the same, optical filter for image display device, and image display device - The invention provides an optical resin composition being transparent, having suitable adhesion and necessary impact absorption for protection of an image display device etc., not affecting constituent materials of a image display panel, and being excellent in reliability, and an optical resin material using the same. | 09-30-2010 |
| 20100233627 | PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR FORMING RESIST PATTERN, METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING SUBSTRATE FOR PLASMA DISPLAY PANEL - A photosensitive resin composition comprising (A) a binder polymer with a weight-average molecular weight of 35000 to 65000, (B) a photopolymerizable compound with an ethylenically unsaturated bond and (C) a photopolymerization initiator, wherein component (B) includes (B1) a photopolymerizable compound with one ethylenically unsaturated bond, (B2) a photopolymerizable compound with two ethylenically unsaturated bonds and (B3) a photopolymerizable compound with three ethylenically unsaturated bonds, and the proportion of component (B3) with respect to the total of component (B) is 15 to 30 wt %. | 09-16-2010 |
| 20100196691 | FRICTION MATERIAL COMPOSITION AND FRICTION MATERIAL PRODUCED THEREWITH - Disclosed is a friction material composition, comprising a fiber matrix, a binder, an organic filler, and an inorganic filler, wherein the fiber matrix contains at least two types of mineral fibers different in average fiber length from each other, and the difference between the minimum value and the maximum value among the average fiber lengths of the mineral fibers is 50 μm or more. Also disclosed is a friction material produced by pressure-molding the friction material composition while heating. Further disclosed is a friction material having an underlayer material interposed between a friction surface and a back metal, while the underlayer material is produced by pressure-molding the friction material composition while heating. | 08-05-2010 |
| 20100192472 | ABRASIVE COMPOUNDS FOR SEMICONDUCTOR PLANARIZATION - A polishing slurry for semiconductor planarization containing cerium oxide particles and water, wherein the content of the cerium oxide particles having a diameter of 3 μm or more is 500 ppm or less (weight ratio) in a solid, preferably 100 ppm or less and it is more preferable that D99 (99% by volume of the whole particles in polishing slurry) of the cerium oxide particles is 1 μm or less. The polishing slurry can reduce the generation of scratches, and can polish a surface of the semiconductor substrate in the wiring formation process of semiconductor device precisely at a high speed. | 08-05-2010 |
| 20100141085 | IONIC POLYMER DEVICES AND METHODS OF FABRICATING THE SAME - An ionic polymer composite device and methods for fabricating the ionic polymer composite device are provided. The ionic polymer composite device includes two extended electrode layers, each extended electrode layer including at least one ionic polymer with a plurality of electrically conductive particles, and a dielectric layer including at least one sulfonated poly ether sulfone polymer or a derivative between the two extended electrode layers. | 06-10-2010 |
| 20100140638 | THERMOSETTING RESIN COMPOSITION FOR LIGHT REFLECTION, METHOD FOR MANUFACTURING THE RESIN COMPOSITION AND OPTICAL SEMICONDUCTOR ELEMENT MOUNTING SUBSTRATE AND OPTICAL SEMICONDUCTOR DEVICE USING THE RESIN COMPOSITION - This invention provides a heat curable resin composition for light reflection, which, after curing, can realize high reflectance in a range of visible light to near ultraviolet light, has excellent heat deterioration resistance and tablet moldability, and is less likely to cause burrs during transfer molding, and a process for producing the resin composition, and an optical semiconductor element mounting substrate and an optical semiconductor device using the resin composition. The heat curable resin composition for light reflection comprises a heat curable component and a white pigment and is characterized in that the length of burrs caused upon transfer molding under conditions of molding temperature 100° C. to 200° C., molding pressure not more than 20 MPa, and molding time 60 to 120 sec is not more than 5 mm and the light reflectance after heat curing at a wavelength of 350 nm to 800 nm is not less than 80%. The resin composition can be used for constructing the optical semiconductor element mounting substrate and the optical semiconductor device. | 06-10-2010 |
| 20100120250 | METAL POLISHING SLURRY AND POLISHING METHOD - The present invention relates to a metal polishing slurry containing abrasive grains, a metal-oxide-dissolving agent, and water, wherein the abrasive grains contain two or more abrasive grain species different from each other in average secondary particle diameter. Using the metal polishing slurry of the present invention, a metal polishing slurry can be obtained which gives a large polishing rate of an interlayer dielectric layer, and is high in the flatness of the polished surface. This metal polishing slurry can provide suitable method for a semiconductor device which is excellent in being made finer and thinner and in dimension precision and in electric characteristics, is high in reliability, and can attain a decrease in costs. | 05-13-2010 |
| 20100065819 | Well-aligned, high aspect-ratio, high-density silicon nanowires and methods of making the same - A method of producing silicon nanowires includes providing a substrate in the form of a doped material; formulating an etching solution; and applying an appropriate current density for an appropriate length of time. Related structures and devices composed at least in part from silicon nanowires are also described. | 03-18-2010 |
| 20090314343 | PV MODULE AND METHOD FOR MANUFACTURING PV MODULE - Provided is a photovoltaic (PV) module by which electric power generation efficiency can be improved by improving light use rate. An encapsulant ( | 12-24-2009 |
| 20090311684 | ENHANCED FC RECEPTOR-MEDIATED TUMOR NECROSIS FACTOR SUPERFAMILY AND CHEMOKINE MRNA EXPRESSION IN PERIPHERAL BLOOD LEUKOCYTES IN PATIENTS WITH RHEUMATOID ARTHRITIS - A method for predicting patient responsiveness to rheumatoid arthritis treatments involving altering expression of TNFSF-3, TNFSF-4, TNFSF-7, TNFSF-11, or TNFSF-14 is disclosed. A method for monitoring the effectiveness of such therapy is also disclosed. Furthermore, a method of screening compounds for use in the treatment of rheumatoid arthritis is disclosed. A method of monitoring the disease state over time in rheumatoid arthritis patients is also disclosed. | 12-17-2009 |
| 20090309220 | ADHESIVE COMPOSITION, CIRCUIT CONNECTING MATERIAL, CONNECTION STRUCTURE OF CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE - The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000. | 12-17-2009 |
| 20090307030 | RISK MANAGEMENT SUPPORT SERVER AND JOB SUPPORT DEVICE - A risk management support server possible of obtaining support information according to various viewpoints of risk management is provided. In client ( | 12-10-2009 |
| 20090301875 | IONIC POLYMER DEVICES AND METHODS OF FABRICATING THE SAME - An ionic polymer composite device and methods for fabricating the ionic polymer composite device are provided. The ionic polymer composite device includes two extended electrode layers, each extended electrode layer including at least one ionic polymer with a plurality of electrically conductive particles, and a dielectric layer including at least one sulfonated poly ether sulfone polymer or a derivative between the two extended electrode layers. | 12-10-2009 |
| 20090291264 | Microfluid-System-Supporting Unit And Production Method Thereof - The present invention relates to a microfluid-system-supporting unit, comprising a fixing layer formed on a substrate, a protective layer or a fixing layer, wherein part of at least one hollow filament in any shape is placed and fixed in the fixing layer. Thus, it provides a microfluid-system-supporting unit lower in surface irregularity even when there are multiple hollow filaments different in external diameter or the hollow filaments crosses each other and resistant to positional deviation of the hollow filament in the crossing regions, and a production method thereof. | 11-26-2009 |
| 20090288697 | CONDUCTIVE ADHESIVE FILM AND SOLAR CELL MODULE - The conductive adhesive film of the invention is a conductive adhesive film for electrical connection between photovoltaic cell surface electrodes and wiring members, which comprises an insulating adhesive | 11-26-2009 |
| 20090274586 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
| 20090274585 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
| 20090274584 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
| 20090274583 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
| 20090274582 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
| 20090274581 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 11-05-2009 |
| 20090272726 | Method for Manufacturing Display Apparatus and Manufacturing Apparatus of the Display Apparatus - [PROBLEM] A thin film laminated substrate is cut by a laser beam under certain conditions, so that a cut surface which is sufficient for a display apparatus can be obtained without damaging the thin film laminated substrate, and the cutting is enabled by a low-output inexpensive apparatus, so that a reduction in cost can be expected. | 11-05-2009 |
| 20090269245 | MICRO FLUID SYSTEM SUPPORT AND MANUFACTURING METHOD THEREOF - A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. | 10-29-2009 |
| 20090261483 | ADHESIVE COMPOSITION, ADHESIVE COMPOSITION FOR CIRCUIT CONNECTION, CONNECTED BODY SEMICONDUCTOR DEVICE - An adhesive composition containing: (a) a thermoplastic resin; (b) a radical-polymerizable compound including two or more (meth)acryloyl groups; (c) a curing agent that generates a radical by photoirradiation of 150 to 750 nm and/or heating at 80 to 200° C.; and (d) a liquid rubber having a viscosity of 10 to 1000 Pa·s at 25° C. | 10-22-2009 |
| 20090253133 | ENHANCED T CELL RECEPTOR-MEDIATED TUMOR NECROSIS FACTOR SUPERFAMILY AND CHEMOKINE MRNA EXPRESSION IN PERIPHERAL BLOOD LEUKOCYTES IN PATIENTS WITH CROHN'S DISEASE - A method is disclosed for determining whether a human having Crohn's disease is likely to respond to a therapy targeting a TNFSF member or a cytokine by measuring the level of certain mRNAs in response to a stimulus. A method of evaluating the effectiveness of a Crohn's disease therapy in a human is also disclosed. Furthermore, a method of screening compounds for use in the treatment of Crohn's disease is disclosed. A method of monitoring the disease state over time in Crohn's disease patients is also disclosed. | 10-08-2009 |
| 20090220897 | RADIATION CURABLE COMPOSITION, STORING METHOD THEREOF, FORMING METHOD OF CURED FILM, PATTERNING METHOD, USE OF PATTERN, ELECTRONIC COMPONENTS AND OPTICAL WAVEGUIDE - The present invention provides a radiation curing composition comprising (a): a siloxane resin, (b): a photoacid generator or photobase generator, and (c): a solvent capable of dissolving component (a) and containing an aprotic solvent. | 09-03-2009 |
| 20090215064 | QUANTITATIVE ASSESSMENT OF INDIVIDUAL CANCER SUSCEPTIBILITY BY MEASURING DNA DAMAGE-INDUCED MRNA IN WHOLE BLOOD - Heparinized human whole blood from patients with invasive breast cancer, with (multiple primary) and without (single primary) a second primary cancer, and from unaffected controls was stimulated with 0.1-10 Gy of radiation and incubated at 37° C. for 2 hours. P21 and PUMA mRNA were then quantified. The results suggest that cancer susceptibility represented by the multiple primary cases was significantly related to over-reaction of p21 mRNA, and not PUMA. | 08-27-2009 |
| 20090203028 | NOVEL APTAMERS THAT BIND TO LISTERIA SURFACE PROTEINS - Aptamers bind to | 08-13-2009 |
| 20090200071 | RESIN COMPOSITION, PREPREG, LAMINATE, AND WIRING BOARD - To provide a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, a prepreg, a laminate, and a wiring board. | 08-13-2009 |
| 20090196066 | OPTICAL CONNECTING MEMBER AND DISPLAY APPARATUS - Disclosed is an information processing device with lighting function that realizes reduced power consumption and cost reductions. The optical connecting member | 08-06-2009 |
| 20090189111 | COMPOSITES FOR SOUND CONTROL APPLICATIONS - A sound attenuating material includes a matrix, and a nanofiller, the material effectively reduces the level of low frequency sound incident thereon. | 07-30-2009 |
| 20090165396 | Method of Producing Oxide Particles, Slurry, Polishing Slurry, and Mehod of Polishing Substrate - The present invention provides a method of producing oxide particles, comprising a step of mixing a metal carbonate with an acid to give a mixture, a step of heating the mixture to give a metal oxide and a step of pulverizing the metal oxide, and slurry wherein metal oxide particles obtained by the above method of producing are dispersed in an aqueous medium, a polishing slurry, and a method of polishing a substrate. | 07-02-2009 |
| 20090156007 | Polishing slurry and polishing method - The present invention relates to polishing slurry and polishing method used for polishing in a process for forming wirings of a semiconductor device, and the like. There are provided polishing slurry giving a polished surface having high flatness even if the polished surface is made of two or more substances, and further, capable of suppressing metal residue and scratches after polishing, and a method of chemical mechanical polishing using this. The polishing slurry of the present invention is polishing slurry containing at least one of a surfactant and an organic solvent, and a metal oxide dissolving agent and water, or polishing slurry containing water and abrasive of which surface has been modified with an alkyl group, and preferably, it further contains a metal oxidizer, water-soluble polymer, and metal inhibitor. | 06-18-2009 |
| 20090143511 | ENCAPSULATED EPOXY-RESIN MOLDING COMPOUND, AND ELECTRONIC COMPONENT DEVICE - The present invention relates to an encapsulated epoxy-resin molding compound, comprising an epoxy resin (A), a hardening agent (B), and magnesium hydroxide (C), wherein the magnesium hydroxide (C) has a [101]/[001] peak intensity ratio of 0.9 or more as determined by X-ray diffraction, a BET specific surface area of 1 to 4 m | 06-04-2009 |
| 20090117829 | Polishing slurry for metal, and polishing method - A polishing slurry for metal comprises an oxidizer, a metal oxide dissolving agent, a metal inhibitor, and water, wherein the metal inhibitor is at least one of a compound having an amino-triazole skeleton and a compound having an imidazole skeleton. The use of the polishing slurry for metal makes it possible to raise the polishing speed sufficiently while keeping the etching speed low, restrain the generation of corrosion of the surface of a metal and dishing, and form a metal-film-buried pattern having a high reliability in the process of formation of wiring of semiconductor devices. | 05-07-2009 |
| 20090111128 | METHOD FOR PREDICTING IMMUNE RESPONSE TO NEOPLASTIC DISEASE BASED ON mRNA EXPRESSION PROFILE IN NEOPLASTIC CELLS AND STIMULATED LEUKOCYTES - Tumor necrosis factor (TNF) is capable of inducing apoptosis by interacting with specific TNF receptors on the surface of cancer cells. Because multiple members of TNF ligand and receptor are present within each superfamily, over 300 different ligand-receptor combinations exist. Activated blood leukocytes produce TNF as part of the immune response to cancer, as well as producing chemokines to attract other leukocytes to the site. A method is disclosed of detecting significant induction of a variety of TNF superfamily subtype and chemokine mRNAs in blood leukocytes when whole blood is exposed to heat-aggregated IgG or anti-T cell receptor antibodies as a model of immune system interactions. Substantial individual-to-individual variation is observed in TNF subtypes and chemokines induced. Since peripheral blood leukocytes are the supply of anti-cancer immune cells, the quantitation of ex vivo inducibility of appropriate TNF ligands and chemokines in blood will be useful in individualized cancer immunotherapy. If the tumor mass is small, such as with early invisible metastatic lesions, appropriate TNF assaults may be sufficient to prevent relapse. | 04-30-2009 |
| 20090110838 | Composition for forming silica-based film, method of forming silica-based film, and electronic component provided with silica-based film - The present invention provides a composition for forming a silica-based film, the composition containing (a) a siloxane resin; (b) an organic solvent including at least one species of aprotic solvent; and (c) an onium salt. | 04-30-2009 |
| 20090094901 | CMP Polishing Liquid and Polishing Method - A CMP polishing liquid being capable of using in a chemical mechanical polishing comprising of: a first chemical mechanical polishing step of polishing a conductive substance layer of a substrate having an interlayer insulation film containing convex and concave regions on a surface thereof, a barrier layer coating along the surface of the interlayer insulation film, and the conductive substance layer coating the barrier layer while filling the concave regions, and thus exposing the barrier layer in the convex regions; and a second chemical mechanical polishing step of exposing the interlayer insulation film in the convex regions by polishing the barrier layer exposed in the first chemical mechanical polishing step; characterized in that a difference (B)−(A) is 650 {acute over (Å)} or less,
| 04-16-2009 |
| 20090036623 | PROCESS FOR PRODUCING CONJUGATED POLYMER - An object of the present invention is to provide a process for producing a conjugated polymer that enables a significant shortening of the reaction time. A process for producing a conjugated polymer according to the present invention is a process for producing a conjugated polymer by Suzuki coupling, wherein the process uses microwave irradiation. The conjugated polymer is preferably a polymer used as an organic electronics material, and is even more preferably a polymer used as an electroluminescent material. | 02-05-2009 |
| 20090032394 | IONIC POLYMER DEVICES AND METHODS OF FABRICATING THE SAME - An embodiment provides an ionic polymer device comprising two extended electrode layers comprising a plurality of conductive particles, wherein the plurality of conductive particles form a concentration gradient in each of the two extended electrode layers, an ionic polymer dielectric layer between two extended electrode layers, and at least one conductive layer on outer surfaces of two extended electrode layers. Another embodiment provides an ionic polymer device comprising a polymer composite with a plurality of surface features on two opposite surfaces, and at least one conductive layer on each of said two opposite surfaces. One embodiment provides a method of making an ionic polymer device, comprising forming a partially cured polymer-metallic salt layer, reducing the metallic salt to form a plurality of metal particles, thereby forming a first extended electrode layer and a second extended electrode layer at and near opposite surfaces of the ionic polymer device. | 02-05-2009 |
| 20090012232 | Curing Accelerator, Curable Resin Composition and Electronic Parts Device - A curing accelerator that enables a composition to exhibit excellent fluidity, reflow crack resistance and high-temperature storage properties, and exhibits excellent curability even upon moisture absorption, as well as a curable resin composition, and an electronic parts device comprising an element that has been encapsulated using the curable resin composition. The curable resin composition is prepared using a curing accelerator comprising a compound represented by a formula (I) shown below. | 01-08-2009 |
| 20080318075 | Photocurable Resin Composition - A photocurable resin composition comprising a (meth)acrylate ester with a sulfur content of no more than 5 ppm is disclosed. This photocurable resin composition is preferably used in a coating material or an adhesive, or in an adhesive layer or a protective layer formed on top of the metal layer of an optical disk. | 12-25-2008 |
| 20080308790 | Organic Siloxane Film, Semiconductor Device Using the Same, Flat Panel Display Device, and Raw Material Liquid - Disclosed is materials design for prolonging the duration of the low relative dielectric constant of an organic siloxane film having a low relative dielectric constant. Specifically, in an organic siloxane film having a relative dielectric constant of not more than 2.1, the elemental ratio of carbon to silicon in the film is set to not less than 0.10 and not more than 0.55. | 12-18-2008 |
| 20080297459 | Reflector and Backlight Device - A back light device realizing improvement in hotspots and bright line in the region of light incidence and of darkness arising in between light sources is provided by forming the reflective surface of the reflector as a structured face comprising an iteration of prism elements of trapezoidal section. | 12-04-2008 |
| 20080290529 | SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF - A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by volume or less, having a residual volatile component in an amount not more than 3.0% by weight, having a modulus of elasticity of 10 MPa or less at a temperature of 250 ° C. The semiconductor device thus obtained can be free from occurrence of reflow cracks during reflow soldering for the packaging of semiconductor devices. | 11-27-2008 |
| 20080254717 | Cmp Polishing Slurry and Method of Polishing Substrate - A CMP polishing slurry of the present invention contains cerium oxide particles, water, and a polymer of at least one of a methacrylic acid and the salt thereof, and/or a polymer of at least one of a methacrylic acid and the salt thereof and a monomer having an unsaturated double bond, preferably contains furthermore a dispersant or a polymer of monomers containing at least one of an acrylic acid and the salt thereof. The present invention provides a CMP polishing slurry and a polishing method that, after polishing, give a polished film having a smaller difference in residual film thickness due to a pattern density difference. | 10-16-2008 |
| 20080234409 | Sealant Epoxy-Resin Molding Material, and Electronic Component Device - Disclosed is an encapsulation epoxy resin material containing an epoxy resin (A) and a curing agent (B). The epoxy resin (A) contains a compound represented by the general formula (I) below. The encapsulation epoxy resin material has excellent reliability in flame retardance, formability, reflow resistance, moisture resistance, high-temperature shelf characteristics and the like, and is suitably used for encapsulation of a VLSI. Also disclosed is an electronic component comprising an element encapsulated with such a material. (I) (In the general formula (I), R | 09-25-2008 |
| 20080214093 | CMP polishing slurry and polishing method - The present invention relates to a CMP polishing slurry, comprising cerium oxide particles, a dispersing agent, a water-soluble polymer and water, wherein the water-soluble polymer is a compound having a skeleton of any one of an N-mono-substituted product and an N,N-di-substituted product of any one selected from the group consisting of acrylamide, methacrylamide and α-substituted products thereof. The amount of the water-soluble polymer is preferably in the range of 0.01 part or more by weight and 10 parts or less by weight for 100 parts by weight of the polishing slurry. Thus it is possible to provide a polishing slurry and a polishing method which make it possible to polish a film made of silicon oxide or the like effectively and rapidly and further control the process therefor easily in CMP technique for flattening an interlayer insulating film, a BPSG film, an insulator film for shallow trench isolation, and other films. | 09-04-2008 |
| 20080200032 | POLISHING METHOD OF SEMICONDUCTOR SUBSTRATE - The present invention relates to a method of polishing a semiconductor substrate, comprising pressing a semiconductor substrate having a film to be polished that is held by a carrier onto a polishing cloth fixed on a revolving polishing table and supplying a polishing slurry to the space between the polishing cloth and the semiconductor substrate, wherein the end point of polishing is determined according to the change in the friction coefficient while the friction coefficient between the semiconductor substrate and the polishing cloth is measured. According to the present invention it is possible to measure friction coefficient accurately in polishing a semiconductor substrate and use the change thereof to determine the end point of polishing. | 08-21-2008 |
