| HIMAX SEMICONDUCTOR, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120075736 | COLOR FILTER AND MANUFACTURING METHOD THEREOF - A method for manufacturing a color filter is provided. The method includes following steps. A substrate is provided. A first filter layer is formed on a first part of a first region and a first part of a second region of the substrate. A second filter layer is formed on a second part of the second region. A third filter layer is formed on a second part of the first region and a third part of the second region. When a white beam is projected on the color filter, the first region and the second region reflect a plurality of color beams. A color filter manufactured through the method is also provided. | 03-29-2012 |
| 20120075724 | MICRO-LENS MODULE - A micro-lens module including a first lens, a second lens, and an aperture stop is provided. The first lens is disposed between an object side and an image side, wherein a first surface of the first lens facing the object side is an aspheric surface, and the curvature radius of the aspheric surface is R | 03-29-2012 |
| 20110248367 | IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME - An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a light blocking spacer, a lens layer and a fixing shell. The light blocking spacer is disposed on the image sensor and located in the light non-gathering region. The light blocking spacer has a through hole exposing a portion of the image sensor in the light gathering region. The lens layer is disposed on the light blocking spacer and covers the through hole. The lens layer includes a transparent substrate and a lens disposed on the transparent substrate and located in the light gathering region. The fixing shell located in the light non-gathering region wraps the sidewalls of the image sensor, the light blocking spacer and the lens layer continuously. The material of the fixing shell includes a thermosetting material. A method for manufacturing the image sensor module is also provided. | 10-13-2011 |
| 20110222173 | WAFER LEVEL OPTICAL LENS SUBSTRATE AND FABRICATION METHOD THEREOF - A wafer level optical lens substrate including a substrate and at least one lens is provided. The substrate has at least one through hole and at least one flange, wherein each flange is located on a side wall in each through hole. Each lens located in each through hole is embedded with each flange. A method of fabricating a wafer level optical lens substrate and a wafer level optical lens module are also provided respectively. | 09-15-2011 |
