HIMAX SEMICONDUCTOR, INC.
|HIMAX SEMICONDUCTOR, INC. Patent applications|
|Patent application number||Title||Published|
|20140339714||SEMICONDUCTOR DEVICE - A semiconductor device including a substrate and at least one alignment mark disposed on the substrate and having at least one hollow pattern. Therefore, the identification rate of the alignment mark can be high by the hollow pattern.||11-20-2014|
|20120075736||COLOR FILTER AND MANUFACTURING METHOD THEREOF - A method for manufacturing a color filter is provided. The method includes following steps. A substrate is provided. A first filter layer is formed on a first part of a first region and a first part of a second region of the substrate. A second filter layer is formed on a second part of the second region. A third filter layer is formed on a second part of the first region and a third part of the second region. When a white beam is projected on the color filter, the first region and the second region reflect a plurality of color beams. A color filter manufactured through the method is also provided.||03-29-2012|
|20120075724||MICRO-LENS MODULE - A micro-lens module including a first lens, a second lens, and an aperture stop is provided. The first lens is disposed between an object side and an image side, wherein a first surface of the first lens facing the object side is an aspheric surface, and the curvature radius of the aspheric surface is R||03-29-2012|
|20110248367||IMAGE SENSOR MODULE AND METHOD OF MANUFACTURING THE SAME - An image sensor module having a light gathering region and a light non-gathering region includes an image sensor, a light blocking spacer, a lens layer and a fixing shell. The light blocking spacer is disposed on the image sensor and located in the light non-gathering region. The light blocking spacer has a through hole exposing a portion of the image sensor in the light gathering region. The lens layer is disposed on the light blocking spacer and covers the through hole. The lens layer includes a transparent substrate and a lens disposed on the transparent substrate and located in the light gathering region. The fixing shell located in the light non-gathering region wraps the sidewalls of the image sensor, the light blocking spacer and the lens layer continuously. The material of the fixing shell includes a thermosetting material. A method for manufacturing the image sensor module is also provided.||10-13-2011|
|20110222173||WAFER LEVEL OPTICAL LENS SUBSTRATE AND FABRICATION METHOD THEREOF - A wafer level optical lens substrate including a substrate and at least one lens is provided. The substrate has at least one through hole and at least one flange, wherein each flange is located on a side wall in each through hole. Each lens located in each through hole is embedded with each flange. A method of fabricating a wafer level optical lens substrate and a wafer level optical lens module are also provided respectively.||09-15-2011|
Patent applications by HIMAX SEMICONDUCTOR, INC.