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Hexcel Composites Limited

Hexcel Composites Limited Patent applications
Patent application numberTitlePublished
20120100335COMPOSITE MATERIALS - A prepreg comprising a structural layer of packed unidirectional conductive fibres comprising thermosetting resin in the interstices, and a first outer layer of resin comprising thermosetting resin, and being essentially free of unidirectional conductive fibres, which when cured under elevated temperature, produces a cured composite material comprising a cured structural layer of packed unidirectional conductive fibres and a first outer layer of cured resin comprising unidirectional conductive fibres dispersed within.04-26-2012
20110262630Composite Materials With Improved Performance - A composite material comprising at least one polymeric resin and optionally at least one fibrous reinforcement where the polymeric resin comprises at least one difunctional epoxy resin and at least one epoxy resin with a functionality greater than two having at least one meta-substituted phenyl ring in its backbone.10-27-2011
20110067812CURE ACCELERATORS - An epoxy resin composition comprising an epoxy resin component combined with a sufficient amount of an imidazole curative to provide curing of the epoxy resin composition. The epoxy resin composition further includes a non-hydroxyl containing cure accelerator for the imidazole curative.03-24-2011
20100276645IMPROVED STRUCTURAL ADHESIVE MATERIALS - An adhesive material comprising at least one adhesive polymeric resin, at least one low aspect ratio metal-coated additive, and at least one high aspect ratio metal-coated additive. There is additionally provided an adhesive material comprising at least one adhesive polymeric resin, and one of either; a) low aspect ratio metal-coated additives present in the range 0.2 wt. % to 30 wt. % of the adhesive material; or b) discrete high aspect ratio metal-coated additives present in the range 0.2 wt. % to 25 wt. % of the adhesive material.11-04-2010
20100228001Thermoplastic Toughening Material And Related Method - A non-fibrous, apertured membrane comprises at least one thermoplastic polymeric material and has a discrete porous structure. The membrane is soluble in the thermoset matrix polymer of a composite material.09-09-2010
20100219612FIBER REINFORCED RESIN ASSEMBLY - An uncured fiber reinforced assembly that includes a reinforcement layer containing a fibrous material and at least one highly reactive curing agent. A matrix film layer is applied to the reinforcement layer so that it does not substantially impregnate the reinforcement layer. The matrix film layer includes at least one uncured epoxy resin and at least one latent epoxy curing agent. The assembly is designed for use in making snowboards and skis.09-02-2010
20100151214COMPOSITE MATERIAL - A composite material (06-17-2010
20100108259Low Temperature Curing Of Toughened Adhesives - Surfaces are bonded together using a thermoplastic toughened epoxy adhesive wherein the adhesive contains an epoxy component, a thermoplastic component, a core/shell particle component and a curing agent. The thermoplastic toughened epoxy adhesive is only heated during bonding to a relatively low curing temperature of between 140° C. and 160° C. for a sufficient time to cure the adhesive and provide surfaces that are bonded together with a high-strength bond.05-06-2010
20100086737SURFACE FINISH FOR COMPOSITE MATERIALS - The surface finish of composite materials is improved by reducing the amount of “print-through” that occurs as the surface ages. A resin matrix, which is modified with rubber particles, is used in combination with a surface finish film to provide extremely flat and durable surface finishes.04-08-2010
20100068497ADHESION PROMOTING LAYER FOR COMPOSITE ASSEMBLIES - The adhesion between an underlying composite material and its surface finish is increased by including an adhesion promoting layer at the interface where the uncured composite material and the surface finish meet during the lay up of the uncured composite assembly. The adhesion promoting layer includes a cure accelerating agent for the composite material matrix resin.03-18-2010
20090317609CURABLE RESIN FILMS - A curable resin with at least one electrically conductive metal region on its surface formed by depositing on the surface a composition comprising activator, contacting the activator with a solution of a reducing agent and a solution of a metal ion, the reducing agent and metal ion undergoing chemical reaction activated by the activator to form an electrically conductive metal region on the surface, and method of forming is provided.12-24-2009
20090252916COMPOSITE MATERIAL ASSEMBLY - A composite material assembly (10-08-2009
20090202809Fibre reinforced assembly - An uncured assembly which comprises a fibrous reinforcement. Associated with said reinforcement is a resin material comprising at least one solid amine-terminated epoxy resin, at least one solid epoxy-terminated epoxy resin and optionally at least one cure catalyst.08-13-2009

Patent applications by Hexcel Composites Limited