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Hewlett-Packard Co.
Corvallis, OR US
| Hewlett-Packard Co. Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20100051453 | Process for making dense mixed metal Si3N4 targets - A composition and method for fabricating high-density Ta-Al-O, Ta-Si-N, and W-Si-N sputtering targets, having particular usefulness for the sputtering of heater layers for ink jet printers. Compositions in accordance with the invention comprise a metal component, Si | 03-04-2010 |