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HESSE & KNIPPS GMBH
| HESSE & KNIPPS GMBH Patent applications | ||
| Patent application number | Title | Published |
|---|---|---|
| 20110266329 | BONDING DEVICE, ULTRASONIC TRANSDUCER, AND BONDING METHOD - A bonding device, particularly for producing bond connections between electrical conductors made of wire material or strip material and contact points of substrates such as electrical circuits, wherein the bonding device comprises a bonding head ( | 11-03-2011 |