HERAEUS MATERIALS TECHNOLOGY GMBH & CO. KG Patent applications |
Patent application number | Title | Published |
20150155252 | ALUMINUM COATED COPPER BOND WIRE AND METHOD OF MAKING THE SAME - A wire, preferably a bonding wire for bonding in microelectronics, contains a copper core with a surface and coating layer containing aluminum superimposed over the surface of the copper core. The ratio of the thickness of the coating layer to the diameter of the copper core is from 0.05 to 0.2 μm. The wire has a diameter in the range of from 100 μm to 600 μm and specified standard deviations of the diameter of the copper core and of the thickness of the coating layer. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding. | 06-04-2015 |
20150098170 | ALUMINUM COATED COPPER BOND WIRE AND METHOD OF MAKING THE SAME - The invention relates to a wire, preferably a bonding wire for bonding in microelectronics, containing a copper core with a surface and a coating layer containing aluminum superimposed over the surface of the core. In any cross-sectional view of the wire, the area share of the coating layer is from 20 to 50% based on the total area of the cross-section of the wire, and the aspect ratio between longest and shortest paths through the wire is from larger than 0.8 to 1.0. The wire has a diameter of from 100 μm to 600 μm. The invention further relates to a process for making a wire, to a wire obtained by the process, to an electric device containing at least two elements and the wire, to a propelled device containing the electric device, and to a process of connecting two elements through the wire by wedge bonding. | 04-09-2015 |
20150038034 | FLAT STRUCTURE, PARTICULARLY TEXTILE, CONTAINING PRECIOUS METAL WIRE - Known textile flat structures contain precious metal wire or they are composed completely thereof. In order to achieve high flexural and tensile strength, at the same time with high flexibility of the flat structure, the precious metal wire is configured as a precious metal cord having a plurality of cords or a plurality of individual precious metal wires or a combination of cords and individual precious metal wires, which are in each case laid around one another and/or twisted around one another. | 02-05-2015 |
20140120743 | WIRE FOR SLIDING CONTACTS, AND SLIDING CONTACTS - A wire is provided for producing a sliding contact, wherein at least an inner core of the wire consists of a copper-silver alloy. A sliding contact is also provided having at least one such wire, wherein a counter-contact is provided whose conductive surface has at least one of the wires touch against it. The spring force of the wire acting on the conductive surface of the counter-contact effects electrical contacting between the wire and the counter-contact and the counter-contact is mobile with respect to the wire, such that the surface of the wire slides over the counter-contact when the counter-contact moves. Components having the sliding contact are also provided, including a potentiometric sensor, potentiometer, sliding dolly regulator, position sensor, rotary switch, electrical motor, generator, wind turbine, slip ring system, actuator, or current collector. | 05-01-2014 |
20140063762 | SILVER ALLOY WIRE FOR BONDING APPLICATIONS - A bonding wire according to the invention contains a core having a surface, in which the core contains silver as a main component and at least one element selected from gold, palladium, platinum, rhodium, ruthenium, nickel, copper, and iridium. The wire exhibits at least one of the following properties:
| 03-06-2014 |
20140031202 | CATALYST - A catalyst comprising a plurality of catalyst gauzes that are arranged in series is provided. Each catalyst gauze is made of a first noble-metal-containing wire and a second noble-metal-containing wire which is embedded in the catalyst gauze and which gives the catalyst gauze a preferential direction. The catalyst gauzes according to the invention are arranged in series such that the angles between the preferential directions of neighboring catalyst gauzes ranges from 0° to 180°. The catalyst ensures a product yield that is reproducible over time and has a long service life. | 01-30-2014 |
20140031201 | CATALYST - A catalyst comprising a plurality of catalyst gauzes that are arranged in series is provided. Each catalyst gauze is made of a first noble-metal-containing wire and a second noble-metal-containing wire which is embedded in the catalyst gauze and which gives the catalyst gauze a preferential direction. The catalyst gauzes according to the invention are arranged in series such that the angles between the preferential directions of neighboring catalyst gauzes are between 0° and 180°. The catalyst ensures a product yield that is reproducible over time and has a long service life. | 01-30-2014 |
20130316122 | METHOD FOR PARTIAL LAMINATION OF FLEXIBLE SUBSTRATES - A method for producing a laminate made up of at least two films/foils is provided. At least one first film/foil is structured and subsequently laminated to at least one second film/foil. The at least one second film/foil is punched by at least one tool in a single working step and is laminated to the structured first film/foil simultaneously. The films/foils are conveyed, at least part of the time, to the at least one tool. A laminate produced according to such a method and a device for producing a laminate using such a method are also provided. The device is suited for conveying and laminating the at least one first and second films/foils, wherein regions of the films/foils are aligned to be parallel with respect to each other. The device includes at least one tool that can be used to punch-laminate second film/foil onto the first film/foil. | 11-28-2013 |
20130264200 | PLANAR OR TUBULAR SPUTTERING TARGET AND METHOD FOR THE PRODUCTION THEREOF - Planar or tubular sputtering targets made of a silver base alloy and at least one further alloy component selected from indium, tin, antimony, and bismuth accounting jointly for a weight fraction of 0.01 to 5.0% by weight are known. However, moving on to ever larger targets, spark discharges are evident and often lead to losses especially in the production of large and high-resolution displays having comparatively small pixels. For producing a sputtering target with a large surface area on the basis of a silver alloy of this type, which has a surface area of more than 0.3 m | 10-10-2013 |
20130223032 | CHIP-INTEGRATED THROUGH-PLATING OF MULTI-LAYER SUBSTRATES - A laminate and method for producing the laminate are provided for contacting at least one electronic component. An insulating layer is laminated between first and second metal layers electrically contacted to each other in at least one contact region. At least one recess in the contact region is generated with at least one embossing and/or bulging in the first metal layer. The distance between the two metal layers is reduced, such that dimensions of the embossing/bulging are sufficient for taking up the electronic component, which is inserted and connected into the embossing/bulging in a conductive manner therein. The electronic component is taken up in the embossing/bulging entirely with respect to its circumference and at least partly with respect to the height (H) of the electronic component. The laminate may be used as a circuit board, sensor, LED lamp, mobile phone component, control, or regulator. | 08-29-2013 |
20130215584 | LAMINATE WITH INTEGRATED ELECTRONIC COMPONENT - The invention relates to methods for producing a laminate for contacting an electronic component, in which an insulating layer is arranged between first and second metal layers. The method includes contacting the metal layers to each other in a contact region, generating a recess in the insulating layer, laminating the metal layers to the insulating layer, generating a notch for accommodating the electronic component in the contact region in the first metal layer, inserting the electronic component in a depression in the laminate formed through a notch and recess. The electronic component is connected in a conductive manner to the second metal layer, such that an entire circumference of the electronic component is accommodated in the recess and/or notch, and at least part of the height of the electronic component is accommodated in the notch and/or recess. The invention also relates to such a laminate for contacting an electronic component. | 08-22-2013 |
20130213689 | CORE-JACKET BONDING WIRE - A bonding wire is provided containing a wire core made of a first material containing a metal and a wire jacket that envelopes the wire core and is made of a second material containing a metal. The wire core and the wire jacket are made of different metals and the bonding wire has an aspect ratio of no more than 0.8. The bonding wire efficiently prevents damage to bonding surfaces during the bonding process and short-circuiting during the use of corresponding sub-assemblies. | 08-22-2013 |
20130187495 | CONTACT PIECE CONTAINING PRECIOUS METAL ON A SPRING SUPPORT HAVING A ROTATIONALLY SYMMETRICAL BENDING MOMENT - A spring contact for a sliding contact is provided having a terminal region and at least one contact region including an elongated spring element and a precious metal. The spring contact includes a conductive spring support and at least one contact piece. The spring support has essentially symmetrical rigidity in some regions in a plane perpendicular to the elongated extension of the spring support, and is made of a conductive material essentially free of precious metal. The contact piece(s) is/are conductively connected to the spring support, and has at least one surface to form the sliding contact. A surface of the contact piece(s) is made of a precious metal or a precious metal alloy. A slip ring transmitter for a motor or dynamo is also provided having a spring contact of this type, wherein the surface of the contact piece(s) touch(es) against the slip ring(s) in a conductive manner. | 07-25-2013 |
20130186146 | REDUCTION OF THE EVAPORATION RATE OUT OF PLATINUM AND Pt ALLOYS - Methods for reducing the evaporation rate of platinum and Pt alloys upon their use at high temperatures >1,200° C. in an oxidizing atmosphere include the steps: (A) providing a component made of platinum or a platinum alloy; (B) wrapping the outer surface of the component with a flexible bandage having open porosity and provided with an oxide ceramic material and/or a glass-forming material; (C) using the component at operating temperatures >1,200° C. Methods for scavenging noble metal oxides evaporating or sublimating from the surface of platinum or Pt alloys include: (A) providing a component made of platinum or a platinum alloy; (B) wrapping the outer surface of the component with a flexible bandage having open porosity; and (C) using the component at operating temperatures >1,200° C. Correspondingly wrapped components are also provided. | 07-25-2013 |
20130142568 | 3N COPPER WIRES WITH TRACE ADDITIONS FOR BONDING IN MICROELECTRONICS DEVICES - A 3N copper wire with trace additions for bonding in microelectronics contains 3N copper and one or more corrosion resistance addition materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance addition materials is between about 90 wt. ppm and about 980 wt. ppm. | 06-06-2013 |
20130142567 | DOPED 4N COPPER WIRES FOR BONDING IN MICROELECTRONICS DEVICES - A doped 4N copper wire for bonding in microelectronics contains one or more corrosion resistance dopant materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance dopant materials is between about 10 wt. ppm and about 80 wt. ppm. | 06-06-2013 |
20130140084 | Alloyed 2N Copper Wires for Bonding in Microelectronics Devices - An alloyed 2N copper wire for bonding in microelectronics contains 2N copper and one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.009 wt % and about 0.99 wt %. | 06-06-2013 |
20130140068 | Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics Devices - A secondary alloyed 1N copper wire for bonding in microelectronics contains one or more corrosion resistance alloying materials selected from Ag, Ni, Pd, Au, Pt, and Cr. A total concentration of the corrosion resistance alloying materials is between about 0.09 wt % and about 9.9 wt %. | 06-06-2013 |
20130126934 | BONDING WIRE FOR SEMICONDUCTOR DEVICES - A bonding wire for semiconductor devices and a method of manufacturing the wire are provided. The bonding wire contains at least one element selected from zinc, tin, and nickel in an amount of 5 ppm to 10 wt %, the remainder containing silver and inevitable impurities. The method involves pouring a silver alloy according to the invention into a mold and melting the silver alloy, continuously casting the melted silver alloy, and drawing the continuously casted silver alloy. | 05-23-2013 |
20130068373 | PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE - A paste may be used to connect at least one electronic component to at least one substrate through contact regions, wherein at least one of the contact regions contains a non-noble metal. The paste contains (a) metal particles, (b) at least one activator that bears at least two carboxylic acid units in the molecule, and (c) a dispersion medium. A method for connecting at least one electronic component to at least one substrate through the contact regions includes steps of providing a substrate having a first contact region and an electronic component having a second contact region; providing the above paste; generating a structure, wherein the first contact region of the substrate contacts the second contact region of the electronic component through the paste; and sintering the structure while producing a module including at least the substrate and the electronic component connected to each other through the sintered paste. | 03-21-2013 |
20130040807 | NON-WOVEN MATERIAL OR NETTING OF METAL FIBERS - A metal fiber based on one or several elements from the group of platinum, palladium, rhodium, ruthenium, and iridium with 0 to 30% by weight of one or several additional alloy elements from the group of nickel, cobalt, gold, rhenium, molybdenum, and tungsten, contains 1 to 500 ppm by weight of boron or phosphorus. A non-woven material or netting, in particular for the production of nitrogen oxide or for the production of hydrocyanic acid, is made of such fibers. For the production of fibers based on noble metals having up to 30% by weight of additional alloy metals by drawing the fibers from a melt, the melting point of the metal is reduced by at least 400° C., before drawing of the fibers, by additionally alloying with boron or phosphorus, and the boron or the phosphorus is removed again from the fibers. | 02-14-2013 |
20120270019 | METHOD FOR MANUFACTURING A PARTIALLY COATED CARRIER STRUCTURE - A method is provided for manufacturing a partially coated carrier structure including a carrier tape coated by a coating. A protective film is applied to at least a portion of the coating, the coating is partially removed from the carrier tape, and the protective film is removed from the coating. A device for manufacturing a partially coated carrier structure by a method of this type includes a first conveying facility for conveying a carrier tape coated by a coating, an application facility for application of a protective film to at least a portion of the coating, and at least one tool that can be used to partially remove the coating from the carrier tape. | 10-25-2012 |
20120251430 | NITROGEN OXIDE AND HYDROCYANIC ACID PRODUCTION METHOD - A metal fiber based on one or several elements from the group of platinum, palladium, rhodium, ruthenium, and iridium with 0 to 30% by weight of one or several additional alloy elements from the group of nickel, cobalt, gold, rhenium, molybdenum, and tungsten, contains 1 to 500 ppm by weight of boron or phosphorus. A non-woven material or netting, in particular for the production of nitrogen oxide or for the production of hydrocyanic acid, is made of such fibers. For the production of fibers based on noble metals having up to 30% by weight of additional alloy metals by drawing the fibers from a melt, the melting point of the metal is reduced by at least 400° C., before drawing of the fibers, by additionally alloying with boron or phosphorus, and the boron or the phosphorus is removed again from the fibers. | 10-04-2012 |
20120213917 | TUBE-SHAPED SPUTTERING TARGET - A tube-shaped sputtering target is provided having a carrier tube and an indium-based sputtering material arranged on the carrier tube. The sputtering material has a microstructure having a mean grain size of less than 1 mm, measured as the mean diameter of the grains on the sputtering-roughened surface of the sputtering material. | 08-23-2012 |
20120153012 | METAL PASTE WITH CO-PRECURSORS - A sintering method allows components to be joined to each other in a stable way at a processing temperature of less than | 06-21-2012 |
20120153011 | METAL PASTE WITH OXIDIZING AGENTS - A sintering method is provided which allows components to be joined to each other in a stable way, wherein the processing temperature is less than 200° C. and stable contact points are produced, which have low porosity and also high electrical and thermal conductivity. The method for joining components includes (a) providing a sandwich arrangement having at least (a1) one component 1, (a2) one component 2, and (a3) a metal paste located between component 1 and component 2, and (b) sintering the sandwich arrangement. The metal paste contains (A) 75-90 weight percent of at least one metal present in the form of particles having a coating containing at least one organic compound, (B) 0-12 weight percent of at least one metal precursor, (C) 6-20 weight percent of at least one solvent, and (D) 0.1-15 weight percent of at least one sintering agent selected from the group comprising (i) organic peroxides, (ii) inorganic peroxides, and (iii) inorganic acids. | 06-21-2012 |
20120146018 | THIN FILM TRANSISTOR (TFT) HAVING COPPER ELECTRODES - A TFT structure is provided in which an oxidic semiconductor is used in combination with an electrode material based on a Cu alloy. | 06-14-2012 |
20120139003 | OPTOELECTRONIC COMPONENT - An optoelectronic component including a connection carrier including an electrically insulating film at a top side of the connection carrier, an optoelectronic semiconductor chip at the top side of the connection carrier, a cutout in the electrically insulating film which encloses the optoelectronic semiconductor chip, and a potting body surrounding the optoelectronic semiconductor chip, wherein a bottom area of the cutout is formed at least regionally by the electrically insulating film, the potting body extends at least regionally as far as an outer edge of the cutout facing the optoelectronic semiconductor chip, and the cutout is at least regionally free of the potting body. | 06-07-2012 |
20120119392 | LEAD-FREE HIGH TEMPERATURE COMPOUND - A simple method is provided for firmly-bonded connection of an electronic component to a substrate, which dispenses with the use of lead-containing paste solders and leads to a contact layer featuring sufficiently high resistance to heat fatigue in an environment characterized by incessant periodical temperature variations, and featuring high thermal and electrical conductivity. The method for firmly-bonded connection of an electronic component to a substrate includes the steps of: (a) providing an electronic component having a first surface to be connected and a substrate having a second surface to be connected; (b) applying a paste solder to at least one of the surfaces to be connected; (c) arranging the electronic component and the substrate such that the first electronic component surface to be connected and the second substrate surface to be connected contact each other through the paste solder; and (d) soldering the arrangement from (c) in order to generate a firmly-bonded connection between the electronic component and the substrate, wherein the paste solder contains (i) 10-30% by weight copper particles, (ii) 60-80% by weight particles of at least one substance selected from the group consisting of tin and tin-copper alloys, and (iii) 3-30% by weight solder flux, wherein the mean particle diameter of the particles (i) and of the particles (ii) is no more than 15 μm, and wherein the thickness of the applied layer of paste solder is at least 20 μm. | 05-17-2012 |
20120085641 | Sputtering Target Having Amorphous and Microcrystalline Portions and Method of Producing Same - A sputtering target is provided which ensures the production of unvaryingly homogenous layers of the sputtering material during the lifespan of the sputtering target. The sputtering target includes a mixture of oxides of indium, zinc, and gallium, the mixture containing at least one ternary mixed oxide of indium, zinc, and gallium and at least one amorphous phase. The portion of ternary mixed oxides of indium, zinc, and gallium is at least 50 weight percent, relative to the total weight of the mixture, and the portion of amorphous phase is at least 20 weight percent, relative to the total weight of the mixture. | 04-12-2012 |
20120055978 | Contacting Means and Method for Contacting Electrical Components - A method is provided for connecting at least two components, in which a sintering preform is used. This preform includes a carrier having a surface that has at least one structuring element containing hardened paste, wherein the hardened paste contains: (a) metal particles having a coating that contains at least one organic compound; and (b) at least one sintering aid selected from the group consisting of (b1) organic peroxides, (b2) inorganic peroxides, (b3) inorganic acids, (b4) salts of organic acids, wherein the organic acids have 1-4 carbon atoms, (b5) esters of organic acids, wherein the organic acids have 1-4 carbon atoms, and (b6) carbonyl complexes. The surface of the carrier having the hardened paste is not reactive to the constituents of the paste. | 03-08-2012 |
20120055707 | Use of Aliphatic Hydrocarbons and Paraffins as Solvents for Silver Sinter Pastes - A process is provided for fastening an electronic component to a substrate, the process including the steps of: (i) providing an electronic component and a substrate; (ii) creating a sandwich arrangement having the electronic component, the substrate and a layer arranged in between them, wherein the layer includes a paste containing (a) metal particles having a coating including at least one coating compound selected from the group consisting of fatty acids, fatty acid salts and fatty acid esters, and (b) at least one aliphatic hydrocarbon compound; and (iii) sintering the sandwich arrangement. | 03-08-2012 |
20120000582 | TREATMENT OF BORON-CONTAINING, PLATINUM GROUP METAL-BASED ALLOYS - Castings made of boron-containing alloys based on at least one platinum group metal are treated by thermal ageing in the presence of oxygen and at temperatures below the melting point of the alloy. This enables the alloys to be processed at temperatures customary in the jewelry industry. The treated castings can also be processed into medical technology products. | 01-05-2012 |