| HEADWAY TECHNOLOGIES, INC. Patent applications |
| Patent application number | Title | Published |
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| 20120126427 | MEMORY DEVICE, LAMINATED SEMICONDUCTOR SUBSTRATE AND METHOD OF MANUFACTURING THE SAME - A memory device has a laminated chip package and a controller chip. In the laminated chip package, a plurality of memory chips are laminated. An interposed chip is laminated between the laminated chip package and the controller chip. The memory chips have a plurality of first wiring electrodes. The interposed chip has a plurality of second wiring electrodes. The second wiring electrodes are formed with a common arrangement pattern common with an arrangement pattern of a plurality of wiring electrodes for controller which are formed in the controller chip. The controller chip is laid on the interposed chip. | 05-24-2012 |
| 20120087217 | THERMALLY ASSISTED MAGNETIC HEAD, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step. | 04-12-2012 |
| 20120086130 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body. The main body includes a main part, and further includes first terminals and second terminals disposed on the top and bottom surfaces of the main part, respectively. The main part includes first and second layer portions, and through electrodes penetrating them. The through electrodes are electrically connected to the first and second terminals. Each of the layer portions includes a semiconductor chip having a first surface and a second surface opposite thereto, and further includes surface electrodes. The surface electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the surface electrodes of the first layer portion. The second terminals are formed by using the surface electrodes of the second layer portion. | 04-12-2012 |
| 20120080782 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. The first and second terminals are formed by using electrodes of the first and second layer portions. The layered chip package is manufactured by fabricating a layered substructure by stacking two substructures each of which includes an array of a plurality of preliminary layer portions, and then cutting the layered substructure. The layered substructure includes a plurality of preliminary wires that are disposed between two adjacent pre-separation main bodies and are to become the plurality of wires. | 04-05-2012 |
| 20120056333 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including first and second layer portions; and a plurality of first and second terminals that are disposed on the top and bottom surfaces of the main part, respectively, and are electrically connected to the plurality of wires. Each layer portion includes a semiconductor chip having a first surface and a second surface opposite thereto, and includes a plurality of electrodes. The electrodes are disposed on a side of the semiconductor chip opposite to the second surface. The first and second layer portions are bonded to each other such that the respective second surfaces face each other. The first terminals are formed by using the electrodes of the first layer portion, and the second terminals are formed by using the electrodes of the second layer portion. | 03-08-2012 |
| 20120032318 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring that includes a plurality of wires disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. Each layer portion includes a semiconductor chip. The plurality of second terminals are positioned to overlap the plurality of first terminals as viewed in a direction perpendicular to the top surface of the main body. A plurality of pairs of first and second terminals that are electrically connected via the wires include a plurality of pairs of a first terminal and a second terminal that are positioned not to overlap each other. | 02-09-2012 |
| 20120025355 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have electromagnetic shielding layer formed in regions other than the scribe-groove parts using a ferromagnetic body. Further, in the laminated semiconductor substrate, a through hole which penetrates the plurality of semiconductor substrates laminated in a laminated direction is formed in the scribe-groove part, and the laminated semiconductor substrate has a through electrode penetrating the plurality of semiconductor substrates through the through hole. | 02-02-2012 |
| 20120025354 | LAMINATED SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein. Further, an uppermost substrate and a lowermost substrate have an electromagnetic shielding layer formed using a ferromagnetic body. The electromagnetic shielding layer is formed in a shielding region except the extending zone. The extending zone is set a part which the wiring electrode crosses, in a peripheral edge part of the device region. | 02-02-2012 |
| 20120013025 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip. The plurality of wires include a plurality of common wires and a plurality of layer-dependent wires. In at least one of the layer portions, the semiconductor chip is electrically connected to the plurality of common wires and is selectively electrically connected to only the layer-dependent wire that the layer portion uses, among the plurality of layer-dependent wires. | 01-19-2012 |
| 20120013024 | Layered Chip Package and Method of Manufacturing Same - A layered chip package includes a main body and wiring, the wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a main part and a plurality of terminals. The main part includes a plurality of layer portions stacked. The terminals are disposed on at least either one of the top and bottom surfaces of the main part and electrically connected to the wires. Each of the layer portions includes a semiconductor chip, and a plurality of electrodes that are electrically connected to the wires. The electrodes include a plurality of first electrodes that are intended to establish electrical connection to the semiconductor chip, and a plurality of second electrodes that are not in contact with the semiconductor chip. In at least one of the layer portions, the first electrodes are in contact with and electrically connected to the semiconductor chip. | 01-19-2012 |
| 20110316141 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body, and wiring disposed on a side surface of the main body. The main body includes: a main part including a plurality of layer portions stacked; a plurality of first terminals disposed on the top surface of the main part and connected to the wiring; and a plurality of second terminals disposed on the bottom surface of the main part and connected to the wiring. The plurality of layer portions include a first-type layer portion and a second-type layer portion. The first-type layer portion includes a conforming semiconductor chip, and a plurality of first-type electrodes that are connected to the semiconductor chip and the wiring. The second-type layer portion includes a defective semiconductor chip, and a plurality of second-type electrodes that are connected to the wiring and not to the semiconductor chip. | 12-29-2011 |
| 20110316123 | Laminated semiconductor substrate, laminated chip package and method of manufacturing the same - In a laminated semiconductor substrate, a plurality of semiconductor substrates are laminated. Each of the semiconductor substrate has a plurality of scribe-groove parts formed along scribe lines. Further, each of the semiconductor substrate has a plurality of device regions insulated from each other and has a semiconductor device formed therein, a first wiring electrode and a second wiring electrode extend to the inside of a interposed groove part from a first device region and a second device region respectively, and are separated from each other. In the laminated semiconductor substrate, a through hole which the first wiring electrode appears is formed. The laminated semiconductor substrate has a through electrode. The through electrode is contact with all of the first wiring electrodes appearing in the through hole. The laminated semiconductor substrate has a plurality of laminated chip regions. | 12-29-2011 |
| 20110303637 | METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATOR INCLUDING WAVEGUIDE AND PLASMON GENERATOR - A near-field light generator includes: a waveguide; a clad layer having a penetrating opening and disposed on the waveguide; a plasmon generator accommodated in the opening; and a dielectric film interposed between the plasmon generator and each of the waveguide and the clad layer. In a method of manufacturing the near-field light generator, an initial clad layer is initially formed on the waveguide, and then the initial clad layer is taper-etched by RIE to form a recess that does not reach the top surface of the waveguide. Subsequently, the recess is etched by wet etching until the top surface of the waveguide is exposed in part. Next, the dielectric film is formed in the opening, and the plasmon generator is formed on the dielectric film. | 12-15-2011 |
| 20110266692 | LAYERED CHIP PACKAGE AND METHOD OF MANUFACTURING SAME - A layered chip package includes a main body and a plurality of through electrodes. The main body includes a plurality of layer portions stacked and a plurality of through holes that penetrate all the plurality of layer portions. The plurality of through electrodes are provided in the plurality of through holes of the main body and penetrate all the plurality of layer portions. Each of the plurality of layer portions includes a semiconductor chip. At least one of the plurality of layer portions includes wiring that electrically connects the semiconductor chip to the plurality of through electrodes. The wiring includes a plurality of conductors that make contact with a through electrode that is exposed in the wall faces of any one of the plurality of through holes and passes through the through hole. | 11-03-2011 |
| 20110242703 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The thermally assisted magnetic head includes a base layer which a base groove part having a width gradually getting smaller along a depth direction and extending in an intersecting direction intersecting with the medium-opposing surface is formed. The near-field light generating layer has an in-groove generating layer formed inside of the base groove part. The in-groove generating layer is formed along an inner wall surface of the base groove part and has a thin-film like structure. | 10-06-2011 |
| 20110228653 | LIGHT SOURCE UNIT FOR THERMALLY-ASSISTED MAGNETIC RECORDING CAPABLE OF MONITORING OF LIGHT OUTPUT - Provided is a light source unit that is to be joined to a slider to form a thermally-assisted magnetic recording head. The light source unit comprises: a unit substrate having a source-installation surface; a light source provided in the source-installation surface and emitting thermal-assist light; and a photodetector bonded to a rear joining surface of the unit substrate in such a manner that a rear light-emission center of the light source is covered with a light-receiving surface of the photodetector. The photodetector can be sufficiently close to the light source; thus, constant feedback adjustment with high efficiency for the light output of the light source can be performed. This adjustment enables light output from the light source to be controlled in response to changes in light output due to surroundings and to changes with time to stabilize the intensity of light with which a magnetic recording medium is irradiated. | 09-22-2011 |
| 20110228650 | METHOD FOR MANUFACTURING THERMALLY-ASSISTED MAGNETIC RECORDING HEAD COMPRISING LIGHT SOURCE UNIT AND SLIDER - A method for manufacturing a thermally-assisted magnetic recording head is provided, in which a light source unit including a light source and a slider including an optical system are bonded. A unit substrate is made of a material transmitting light having a predetermined wavelength, and a unit adhesion material layer that contains Sn, Sn alloy, Pb alloy or Bi alloy is formed on the light source unit and/or the slider. The manufacturing method includes: aligning the light source unit and the slider in such a way that a light from the light source can enter the optical system and the unit adhesion material layer is sandwiched therebetween; and causing a light including the predetermined wavelength to enter the unit substrate to melt the unit adhesion material layer. The unit adhesion material layer melted by the light including the predetermined wavelength can ensure high alignment accuracy as well as higher bonding strength and less change with time. | 09-22-2011 |
| 20110228649 | METHOD FOR MANUFACTURING THERMALLY-ASSISTED MAGNETIC RECORDING HEAD COMPRISING LIGHT SOURCE UNIT AND SLIDER - A method for manufacturing a thermally-assisted magnetic recording head is provided, in which a light source unit including a light source and a slider including an optical system are bonded. A unit substrate is made of a material transmitting light having a predetermined wavelength, and an adhesion material layer is formed on the light source unit and/or the slider. The manufacturing method includes: aligning the light source unit and the slider in such a way that a light from the light source can enter the optical system and the adhesion material layer is sandwiched therebetween; irradiating the adhesion material layer with a light including the predetermined wavelength through the unit substrate; and bonding them. The adhesion material layer melted by the light including the predetermined wavelength and transmitted through the unit substrate can ensure high alignment accuracy as well as higher bonding strength and less change with time. | 09-22-2011 |
| 20110228418 | HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH NEAR-FIELD LIGHT GENERATING ELEMENT - A near-field light generating element has an outer surface including a bottom surface that lies at an end closer to a top surface of a substrate, a waveguide facing surface that lies at an end farther from the top surface of the substrate and faces a waveguide, a front end face located in a medium facing surface, and a side surface that connects the bottom surface, the waveguide facing surface and the front end face to each other. The front end face includes a first side that lies at an end of the bottom surface, a tip that lies at an end farther from the top surface of the substrate and forms a near-field light generating part, a second side that connects an end of the first side to the tip, and a third side that connects the other end of the first side to the tip. The waveguide facing surface includes a width changing portion that has a width in a direction parallel to the bottom surface and the front end face, the width decreasing with decreasing distance to the front end face. | 09-22-2011 |
| 20110228417 | HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH NEAR-FIELD LIGHT GENERATING ELEMENT - A near-field light generating element has an outer surface. The outer surface includes a bottom surface, first and second inclined surfaces, an edge part that connects the first and second inclined surfaces to each other, and a front end face located in a medium facing surface. The front end face includes a first side that lies at an end of the first inclined surface, a second side that lies at an end of the second inclined surface, and a tip that is formed by contact of the first and second sides with each other and forms a near-field light generating part. Each of the first side and the second side has a lower part and an upper part that are continuous with each other. An angle formed between the upper part of the first side and the upper part of the second side is smaller than that formed between the lower part of the first side and the lower part of the second side. | 09-22-2011 |
| 20110228416 | A METHOD OF MANUFACTURING A THERMALLY ASSISTED MAGNETIC HEAD - A thermally assisted magnetic head is formed by performing a head forming process, a mounting part forming process and a light source mounting process in that order. In the head forming process, a planned area is secured on a light source placing surface of a slider substrate, then a magnetic head part is formed on a head area other than the planned area and a spacer for securing a mounting space for the laser diode is formed on the planned area. In the mounting part forming process, a light source mounting part is formed by removing the spacer. In the light source mounting process, a laser diode is mounted on the light source mounting part formed by the mounting part forming step. | 09-22-2011 |
| 20110221073 | Layered chip package with wiring on the side surfaces - A layered chip package has a main body including pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The pairs of layer portions include specific pairs of layer portions. Each of the specific pairs of layer portions includes a first-type layer portion and a second-type layer portion. The first-type layer portion includes electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. The specific pairs of layer portions are provided in an even number. | 09-15-2011 |
| 20110210095 | METHOD OF MANUFACTURING NEAR-FIELD LIGHT GENERATING ELEMENT AND METHOD OF MANUFACTURING HEAT-ASSISTED MAGNETIC RECORDING HEAD - A near-field light generating element has an outer surface including first and second inclined surfaces and an edge part that connects the first and second inclined surfaces to each other. In a method of manufacturing the near-field light generating element, a polishing stopper layer is initially formed on a metal layer, and the polishing stopper layer and the metal layer are etched so that the metal layer is provided with the first inclined surface. Next, a coating layer is formed to cover the metal layer and the polishing stopper layer. The coating layer is made of a non-metallic inorganic material that has an etching rate lower than that of the metal layer in a second etching step to be performed later. Next, the coating layer is polished until the polishing stopper layer is exposed. Next, the second etching step is performed to etch the polishing stopper layer and the metal layer using the coating layer as the etching mask. This provides the metal layer with the second inclined surface and the edge part, and thereby makes the metal layer into the near-field light generating element. | 09-01-2011 |
| 20110201137 | Method of manufacturing layered chip package - A method of manufacturing a layered chip package that includes a main body, and wiring disposed on a side surface of the main body. The main body includes a plurality of layer portions. The method includes fabricating a plurality of substructures, and completing the layered chip package by fabricating the main body using the plurality of substructures and by forming the wiring on the main body. Each substructure is fabricated through the steps of: fabricating a pre-substructure wafer including a plurality of pre-semiconductor-chip portions aligned; distinguishing between a normally functioning pre-semiconductor-chip portion and a malfunctioning pre-semiconductor-chip portion among the plurality of pre-semiconductor-chip portions included in the pre-substructure wafer; and forming electrodes connected to the normally functioning pre-semiconductor-chip portion and having respective end faces located in the side surface of the main body on which the wiring is disposed, without forming any electrode connected to the malfunctioning pre-semiconductor-chip portion. | 08-18-2011 |
| 20110189822 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body and wiring. The main body includes a plurality of layer portions stacked. The wiring is disposed on at least one side surface of the main body. In the method of manufacturing the layered chip package, first, a plurality of substructures each of which includes an array of a plurality of preliminary layer portions are used to fabricate a layered substructure that includes a plurality of pre-separation main bodies arranged in rows. Next, the layered substructure is cut into a plurality of blocks each of which includes a row of a plurality of pre-separation main bodies, and the wiring is formed on the plurality of pre-separation main bodies included in each block simultaneously. The plurality of pre-separation main bodies are then separated from each other. Each of the plurality of blocks includes a row of three, four, or five pre-separation main bodies. | 08-04-2011 |
| 20110189820 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - In a method of manufacturing a layered chip package, a layered substructure is fabricated and used to produce a plurality of layered chip packages. The layered substructure includes first to fourth substructures stacked, each of the substructures including an array of a plurality of preliminary layer portions. In the step of fabricating the layered substructure, initially fabricated are first to fourth pre-polishing substructures each having first and second surfaces. Next, the first and second pre-polishing substructures are bonded to each other with the first surfaces facing each other, and then the second surface of the second pre-polishing substructure is polished to form a first stack. Similarly, the third and fourth pre-polishing substructures are bonded to each other and the second surface of the third pre-polishing substructure is polished to form a second stack. Then, the first and second stacks are bonded to each other. | 08-04-2011 |
| 20110188354 | HEAT-ASSISTED MAGNETIC RECORDING HEAD WITH CONVERGENT LENS - A heat-assisted magnetic recording head includes a magnetic pole, a waveguide that allows light to propagate therethrough, a near-field light generating element that generates near-field light based on the light propagating through the waveguide, a convergent lens, and a laser diode disposed above the waveguide. The convergent lens transmits light that is emitted from the laser diode, so that the light transmitted through the convergent lens is incident on the waveguide. | 08-04-2011 |
| 20110186985 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode with a portion thereof arranged within the unit region. Further, the plurality of groove portions have a wide-port structure in which a wide width portion wider in width than a groove lower portion including a bottom portion is formed at an inlet port thereof. | 08-04-2011 |
| 20110180932 | METHOD OF MANUFACTURING LAYERED CHIP PACKAGE - A layered chip package includes a main body, and wiring including a plurality of wires disposed on a side surface of the main body. The main body includes a plurality of semiconductor chips stacked, and a plurality of electrodes that electrically connect the semiconductor chips to the wires. A method of manufacturing the layered chip package includes the steps of: fabricating a substructure that includes an array of a plurality of pre-separation main bodies and a plurality of holes for accommodating a plurality of preliminary wires, the holes being formed between two adjacent pre-separation main bodies; forming the preliminary wires in the plurality of holes by plating; and cutting the substructure so that the plurality of pre-separation main bodies are separated from each other and the preliminary wires are split into two sets of wires of two separate main bodies, whereby a plurality of layered chip packages are formed. | 07-28-2011 |
| 20110170216 | MAGNETIC HEAD FOR PERPENDICULAR MAGNETIC RECORDING - A magnetic layer for writing incorporates: a pole layer having an end face located in a medium facing surface; and an upper yoke layer. A first magnetic layer for flux concentration is connected to the pole layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a first coil. A second magnetic layer for flux concentration is connected to the upper yoke layer at a location away from the medium facing surface, and passes a magnetic flux corresponding to a magnetic field generated by a second coil. A nonmagnetic layer is disposed between the pole layer and the upper yoke layer. The upper yoke layer is connected to the pole layer at a location closer to the medium facing surface than the nonmagnetic layer. | 07-14-2011 |
| 20110164333 | Thermally assisted magnetic head, method of manufacturing the same, head gimbal assembly, and hard disk drive - A thermally assisted magnetic head includes a main magnetic pole layer, a near-field light generating layer having a generating end part generating near-field light arranged within a medium-opposing surface, and an optical waveguide guiding light to the near-field light generating layer. The near-field light generating layer has a near-field light generating part in a triangle shape with the generating end part being one vertex, and is formed in a triangle pole shape. The optical waveguide is formed to be opposed to a ridge part of the near-field light generating layer via an interposed layer. The main magnetic pole layer is formed to be opposed to the generating end part via the interposed layer. The thermally assisted magnetic head further includes a heat radiating layer in contact with an opposite side of the near-field light generating layer from the optical waveguide. | 07-07-2011 |
| 20110149426 | Heat-assisted magnetic recording head with internal mirror - A heat-assisted magnetic recording head has an internal mirror that includes a reflecting film support body and a reflecting film. The internal mirror reflects light that comes from above a waveguide so that the reflected light travels through the waveguide toward a medium facing surface. The reflecting film support body includes first and second inclined surfaces. The reflecting film includes first and second portions that are located on the first and second inclined surfaces, respectively. The step of forming the reflecting film support body includes two-taper etching operations to be performed on an initial support body. | 06-23-2011 |
| 20110147343 | Method of manufacturing magnetic head for perpendicular magnetic recording - A magnetic head includes: a pole layer including a track width defining portion and a wide portion; and an accommodation layer disposed on a bottom forming layer and having a groove that accommodates the pole layer. The groove includes a first portion for accommodating at least part of the track width defining portion, and a second portion for accommodating at least part of the wide portion. A manufacturing method for the magnetic head includes the steps of; forming a groove defining layer on a nonmagnetic layer that is intended to later become the accommodation layer; forming a mask that covers an area of the nonmagnetic layer where to form the first portion of the groove; etching the nonmagnetic layer so that the second portion of the groove is formed in the nonmagnetic layer; removing the mask; and taper-etching the nonmagnetic layer so that the first portion of the groove is formed in the nonmagnetic layer and the groove is thereby completed. | 06-23-2011 |
| 20110115079 | Wafter and substructure for use in manufacturing electronic component packages - A wafer for electronic component packages is used for manufacturing a plurality of electronic component packages, each of the plurality of electronic component packages including: a base incorporating a plurality of external connecting terminals; and at least one electronic component chip bonded to the base and electrically connected to the plurality of external connecting terminals. The wafer has a plurality of sets of external connecting terminals corresponding to the plurality of electronic component packages, a retainer for retaining the plurality of sets of external connecting terminals, and a coupling portion for coupling the plurality of sets of external connecting terminals to one another. The wafer includes a plurality of pre-base portions that will each be subjected to bonding of the at least one electronic component chip thereto and will be subjected to separation from one another later so that each of them will thereby become the base. | 05-19-2011 |
| 20110096443 | MTJ incorporating CoFe/Ni multilayer film with perpendicular magnetic anisotropy for MRAM application - A MTJ for a spintronic device is disclosed and includes a thin composite seed layer made of at least Ta and a metal layer having fcc(111) or hcp(001) texture as in Ta/Ti/Cu to enhance perpendicular magnetic anisotropy (PMA) in an overlying laminated layer with a (CoFe/Ni) | 04-28-2011 |
| 20110096435 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror fixed to the laser diode. The laser diode has an emitting end face that includes an emission part for emitting laser light; a mounting surface that lies at an end in a direction perpendicular to the plane of an active layer and faces the slider; and a rear surface opposite to the mounting surface. The external mirror includes: a first to-be-fixed part disposed along the emitting end face; a second to-be-fixed part disposed along the rear surface; and a coupling part that couples the first and second to-be-fixed parts to each other. The first to-be-fixed part has a reflecting surface that reflects the laser light emitted from the emission part toward the waveguide. | 04-28-2011 |
| 20110095414 | Semiconductor substrate, laminated chip package, semiconductor plate and method of manufacturing the same - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: a device region in contact with at least any one of the plurality of groove portions and having a semiconductor device formed therein; a surface insulating layer formed to cover the device region and constituting a surface layer of the semiconductor substrate; and a wiring electrode connected to the semiconductor device and formed in a protruding shape rising above a surface of the surface insulating layer. The semiconductor substrate can be manufactured by forming a plurality of groove portions along scribe lines; applying an insulating material to a surface on a side where the plurality of groove portions are formed to form a surface insulating layer; and forming a wiring electrode connected to the semiconductor device and in a protruding shape rising above a surface of the surface insulating layer, after the formation of the surface insulating layer. | 04-28-2011 |
| 20110095289 | Laminated chips package, semiconductor substrate and method of manufacturing the laminated chips package - In a laminated chip package, a plurality of semiconductor plates each having a semiconductor device and a wiring electrode connected to the semiconductor device are laminated. On a side surface for wiring of the laminated chip package, an end face of an inner electrode for examination formed inside the side surface for wiring in the semiconductor plate is formed. The laminated chip package further has an outer electrode for examination connecting the end faces of the inner electrodes for examination along a lamination direction of the semiconductor plates, only for two adjacent semiconductor plates among the semiconductor plates. | 04-28-2011 |
| 20110068456 | Layered chip package and method of manufacturing same - A layered chip package includes a plurality of layer portions that are stacked, each of the layer portions including a semiconductor chip. The plurality of layer portions include at least one first-type layer portion and at least one second-type layer portion. The semiconductor chip has a circuit, a plurality of electrode pads electrically connected to the circuit, and a plurality of through electrodes. In every vertically adjacent two of the layer portions, the plurality of through electrodes of the semiconductor chip of one of the two layer portions are electrically connected to the respective corresponding through electrodes of the semiconductor chip of the other of the two layer portions. The first-type layer portion includes a plurality of wires for electrically connecting the plurality of through electrodes to the respective corresponding electrode pads, whereas the second-type layer portion does not include the wires. | 03-24-2011 |
| 20110058273 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror provided outside the slider. The slider includes a magnetic pole, a waveguide, and a near-field light generating element. The laser diode includes: an emitting end face that lies at an end in a direction parallel to the plane of an active layer and includes a laser-light emission part; and a mounting surface that lies at an end in a direction perpendicular to the plane of the active layer and faces the slider. The external mirror includes: a first reference surface that is parallel to the emitting end face and faces the emitting end face; a second reference surface that is parallel to the mounting surface and faces toward the same direction as the mounting surface does; and a reflecting surface that connects the first and second reference surfaces to each other and reflects the laser light emitted from the emission part toward the waveguide. | 03-10-2011 |
| 20110041322 | Method of manufacturing magnetic head for perpendicular magnetic recording including two side shields - A magnetic head includes a pole layer, first and second side shields, and an encasing layer having a pole groove that accommodates the pole layer and first and second side shield grooves that accommodate the first and second side shields. In a manufacturing method for the magnetic head, the pole groove and first and second initial side shield grooves are formed in a nonmagnetic layer using an etching mask layer having first to third openings. In the manufacturing method, a wall face of the first initial side shield groove that is closer to the pole groove and a wall face of the second initial side shield groove that is closer to the pole groove are etched by dry etching to thereby complete the first and second side shield grooves. | 02-24-2011 |
| 20110013497 | Heat-assisted magnetic recording head with laser diode fixed to slider - A heat-assisted magnetic recording head includes a slider, an edge-emitting laser diode fixed to the slider, and an external mirror provided outside the slider. The slider includes a magnetic pole, a waveguide, a near-field light generating element, and a substrate. The substrate has a top surface facing toward the magnetic pole, the near-field light generating element and the waveguide. The slider has a top surface that lies above the top surface of the substrate, at an end of the slider farther from the top surface of the substrate. The laser diode includes: an active layer; an emitting end face that lies at an end in a direction parallel to the plane of the active layer and includes an emission part for emitting laser light; and a bottom surface that lies at an end in a direction perpendicular to the plane of the active layer. The laser diode is arranged so that the bottom surface faces the top surface of the slider. The external mirror reflects the laser light emitted from the emission part toward the waveguide. | 01-20-2011 |
| 20100328806 | Near-field light generating device that includes near-field light generating element accommodated in a groove of an encasing layer - A near-field light generating element accommodated in a groove of an encasing layer has an outer surface that includes a first end face including a near-field light generating part, a second end face opposite to the first end face, and a coupling portion that couples the first and second end faces. The coupling portion includes a top surface, and first and second side surfaces that decrease in distance from each other with increasing distance from the top surface. The first end face includes a first side located at an end of the first side surface, and a second side located at an end of the second side surface. Each of the first and second sides includes an upper part and a lower part continuous with each other. An angle formed between the respective lower parts of the first and second sides is smaller than that formed between the respective upper parts of the first and second sides. | 12-30-2010 |
| 20100327464 | Layered chip package - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. The insulating portion has an end face located at the side surface of the main body on which the wiring is disposed. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed. | 12-30-2010 |
| 20100304531 | Method of manufacturing layered chip package - A layered chip package includes a plurality of layer portions stacked, each layer portion including a semiconductor chip having a first surface with a device formed thereon and a second surface opposite thereto. The plurality of layer portions include at least a pair of layer portions disposed such that the first surfaces of the respective semiconductor chips face toward each other. A manufacturing method for the layered chip package includes the steps of: fabricating a layered substructure by stacking a plurality of substructures each including a plurality of layer portions corresponding to the plurality of layer portions of the layered chip package; and fabricating a plurality of layered chip packages by using the layered substructure. The step of fabricating the layered substructure includes: fabricating a first and a second pre-polishing substructure each having a first surface and a second surface; bonding the pre-polishing substructures to each other such that their respective first surfaces face toward each other; and forming a first and a second substructure by polishing the second surfaces. | 12-02-2010 |
| 20100301007 | Method of manufacturing magnetic head for perpendicular magnetic recording including two side shields - A magnetic head includes a pole layer, first and second side shields, and an encasing layer having first to third grooves that accommodate the pole layer and the first and second side shields. A manufacturing method for the magnetic head includes the step of forming the first to third grooves in a nonmagnetic layer by using an etching mask layer having first to third openings. This step includes the steps of forming the first groove by etching the nonmagnetic layer using the first opening, with the second and third openings covered with a first mask; and forming the second and third grooves by etching the nonmagnetic layer using the second and third openings, with the first opening covered with a second mask. | 12-02-2010 |
| 20100277832 | PMR writer device with multi-level tapered write pole - A perpendicular magnetic recording (PMR) head is fabricated with a multi-level tapered write pole. The write pole comprises a main pole with a tapered tip on which is formed at least one yoke that has a tapered edge. The edge of the yoke is recessed from the ABS of the tapered tip, giving the write pole a stepped profile. The tapered tip can be two sloped surfaces that are symmetric about a mid plane of the main pole or the taper can be a single sloped edge on the leading side or the trailing side of the pole. The yoke structure can consist of a single yoke formed on one side of the main pole or it can consist of two yokes formed symmetrically on both the leading and trailing sides of the main pole. Other yoke/pole combinations are also described as are various shield formations. The write pole structure creates an efficient channeling of magnetic flux to the ABS surface of the pole tip which produces magnetic recording field at high area densities. | 11-04-2010 |
| 20100260015 | Heat-assisted magnetic recording head with near-field light generating element - A heat-assisted magnetic recording head includes a magnetic pole, a waveguide, a near-field light generating element, and a substrate on which they are stacked. The near-field light generating element and the waveguide are disposed farther from the top surface of the substrate than is the magnetic pole. The near-field light generating element has an outer surface including: a first end face located in the medium facing surface; a second end face farther from the medium facing surface; and a coupling portion coupling the first and second end faces to each other. The first end face includes a near-field light generating part. The waveguide has an outer surface including an opposed portion opposed to a part of the coupling portion. The head further includes a mirror that reflects light emitted from a light source disposed above the waveguide, so as to let the light travel through the waveguide toward the medium facing surface. | 10-14-2010 |
| 20100200977 | Layered chip package and method of manufacturing same - A layered chip package has a main body including a plurality of pairs of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip. The plurality of pairs of layer portions include at least one specific pair of layer portions consisting of a first-type layer portion and a second-type layer portion. The first-type layer portion includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the second-type layer portion does not include such electrodes. A layered substructure formed of a stack of two substructures each of which includes a plurality of preliminary layer portions aligned is used to fabricate a stack of a predetermined two or greater number of pairs of layer portions, and the main body is fabricated by stacking an additional first-type layer portion together with the stack, the number of the additional first-type layer portion being equal to the number of the specific pair(s) of layer portions included in the stack. | 08-12-2010 |
| 20100200959 | SEMICONDUCTOR SUBSTRATE, LAMINATED CHIP PACKAGE, SEMICONDUCTOR PLATE AND METHOD OF MANUFACTURING THE SAME - A semiconductor substrate has a plurality of groove portions formed along scribe lines. The semiconductor substrate includes: insulating layers formed in the plurality of groove portions; a rectangular unit region in contact with at least any one of the plurality of groove portions; and a wiring electrode including an extended terminal portion extended from the unit region to the inside of the groove portion. The semiconductor substrate is manufactured by forming a plurality of groove portions along scribe lines; embedding an insulating material in the plurality of groove portions and planarizing a surface to form insulating layers; and forming a wiring electrode including an extended terminal portion extended from a rectangular unit region in contact with at least any one of the plurality of groove portions to the inside of the groove portion. | 08-12-2010 |
| 20100195264 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, an interdiginated pair of internal electrodes are arranged, on a substrate, perpendicular to a surface of the substrate, and a ceramic dielectric member is filled into a gap between this pair of internal electrodes. For this reason, the dimensions of the internal electrodes do not substantially change before and/or after the formation of the ceramic dielectric member, whereby the dimensions formed at the time of internal electrode can be maintained. According to this ceramic capacitor, since the internal electrode dimensions can be easily controlled like this, dimensional control of internal electrode spacing can also be easily carried out. | 08-05-2010 |
| 20100195262 | CERAMIC CAPACITOR AND METHOD OF MANUFACTURING SAME - In a ceramic capacitor according to the present invention, the electrode strips of an internal electrode and the dielectric strips of a ceramic dielectric member are arranged perpendicularly to the surface of a substrate, and as such, the plurality of electrode strips and the plurality of dielectric strips are arranged alternately along a parallel direction relative to the substrate surface. That is, the electrode strips and the dielectric strips are multi-layered along a parallel direction relative to the substrate surface, thereby facilitating the realization of multi-layering in the ceramic capacitor by a known patterning technology. | 08-05-2010 |
| 20100192343 | METHOD OF MANUFACTURING CERAMIC CAPACITOR - In a method of manufacturing ceramic capacitor according to the present invention, a pair of interdigitated internal electrodes are arranged perpendicularly to the surface of the substrate, subsequent to which the respective end faces of this pair of internal electrodes are exposed, and a pair of external electrodes are formed at these exposed end faces. In this method of manufacturing ceramic capacitor, formation of the external electrodes on the end faces of the respective internal electrodes, with these internal electrodes being interdigitately integrally-formed and the end faces thereof being exposed, it possible to reliably and easily form the external electrodes. | 08-05-2010 |
| 20100182003 | MAGNETIC FILM SENSOR AND METHOD OF MANUFACTURING THE SAME - A magnetic film sensor comprises a magnetic film for generating a magnetostriction, and a magnetostrictive structure for generating a magnetostriction in the magnetic film. The magnetostrictive structure is constructed so as to generate a magnetostriction by curving the magnetic film, for example. The magnetostrictive structure is obtained, for example, by providing a depressed insulating layer having a surface formed with a depression and forming the magnetic film across the depression. | 07-22-2010 |
| 20100165517 | Magnetic head for perpendicular magnetic recording having side shield layer and method of manufacturing same - A magnetic head includes a side shield layer and an encasing layer. The side shield layer has a first end face located in the medium facing surface, a second end face opposite to the first end face, and a first groove accommodating a portion of a pole layer. The first end face includes two portions located on both sides of an end face of the pole layer that are opposite to each other in a track width direction. The encasing layer is formed of a nonmagnetic material and disposed on a side of the side shield layer opposite to a medium facing surface. The encasing layer has a front end face touching the second end face of the side shield layer, and a second groove accommodating another portion of the pole layer. The distance from the medium facing surface to an arbitrary point on the second end face of the side shield layer decreases with decreasing distance from the arbitrary point to the top surface of a substrate. | 07-01-2010 |
| 20100154198 | Sensing unit and method of making same - In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved. | 06-24-2010 |
| 20100149687 | Magnetic head that suppresses protrusion of medium facing surface caused by heat of coil - A magnetic head includes a coil, a pole layer, and a coil adjacent layer. The coil includes a winding portion having two side surfaces. The coil adjacent layer is adjacent to at least part of the whole of the two side surfaces of the winding portion. The coil adjacent layer is formed of a nonmagnetic material having a linear thermal expansion coefficient of 5×10 | 06-17-2010 |
| 20100118438 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY AND HARD DISK DRIVE - A thin-film magnetic head is manufactured as follows. First, a base insulating layer having a magnetic pole forming depression sunken into a form corresponding to the main magnetic pole layer is formed, a stop film for CMP is formed such as to fill the magnetic pole forming depression, and then a magnetic layer is formed on the stop film. Next, the magnetic layer is separated by forming a separation groove substantially surrounding the magnetic pole forming depression on the outside thereof, and thus separated magnetic layer is formed with a cover insulating film adapted to cover the whole upper face. The surface is polished by CMP until the stop film is exposed, so that the part of magnetic layer remaining on the inside of the magnetic pole forming depression is used as the main magnetic pole layer. Further, a recording gap layer, a write shield layer, and a thin-film coil are formed. | 05-13-2010 |
| 20100109137 | Layered chip package with heat sink - A layered chip package includes: a plurality of layer portions stacked, each of the layer portions including a semiconductor chip; and a heat sink. Each of the plurality of layer portions has a top surface, a bottom surface, and four side surfaces. The heat sink has at least one first portion, and a second portion coupled to the at least one first portion. The at least one first portion is adjacent to the top surface or the bottom surface of at least one of the layer portions. The second portion is adjacent to one of the side surfaces of each of at least two of the plurality of layer portions. | 05-06-2010 |
| 20100044879 | Layered chip package and method of manufacturing same - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. The plurality of layer portions include at least one layer portion of a first type and at least one layer portion of a second type. The layer portions of the first and second types each include a semiconductor chip. The layer portion of the first type further includes a plurality of electrodes each connected to the semiconductor chip and each having an end face located at the side surface of the main body on which the wiring is disposed, whereas the layer portion of the second type does not include any electrode connected to the semiconductor chip and having an end face located at the side surface of the main body on which the wiring is disposed. The wiring is connected to the end face of each of the plurality of electrodes. | 02-25-2010 |
| 20090325345 | Method of manufacturing layered chip package - A manufacturing method for a layered chip package including a stack of a plurality of layer portions includes the steps of: fabricating a layered substructure by stacking a plurality of substructures each including a plurality of layer portions corresponding to the plurality of layer portions of the layered chip package; and fabricating a plurality of layered chip packages by using the layered substructure. The step of fabricating the layered substructure includes: fabricating a first and a second pre-polishing substructure; bonding the first pre-polishing substructure to a jig such that a first surface of the first pre-polishing substructure faces the jig; forming a first substructure by polishing a second surface of the first pre-polishing substructure; bonding the second pre-polishing substructure to the first substructure such that a first surface of the second pre-polishing substructure faces the polished surface of the first substructure; and forming a second substructure by polishing a second surface of the second pre-polishing substructure. | 12-31-2009 |
| 20090321957 | Layered chip package and method of manufacturing same - A layered chip package includes: a main body including a plurality of layer portions; wiring disposed on a side surface of the main body; a plurality of first terminals disposed on a top surface of the main body; and a plurality of second terminals disposed on a bottom surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed. The wiring is connected to the end faces of the plurality of electrodes of the plurality of layer portions, and to the plurality of first and second terminals. | 12-31-2009 |
| 20090315189 | Layered chip package and method of manufacturing same - A layered chip package includes a main body including a plurality of layer portions, and wiring disposed on a side surface of the main body. Each layer portion includes a semiconductor chip, an insulating portion covering at least one side surface of the semiconductor chip, and a plurality of electrodes connected to the semiconductor chip. The insulating portion has an end face located at the side surface of the main body on which the wiring is disposed. Each electrode has an end face surrounded by the insulating portion and located at the side surface of the main body on which the wiring is disposed. To manufacture the layered chip package, a layered chip package substructure is fabricated by: processing a semiconductor wafer to form a plurality of pre-semiconductor-chip portions aligned; forming at least one groove extending to be adjacent to at least one of the pre-semiconductor-chip portions; forming an insulating layer to fill the groove; and forming the electrodes. | 12-24-2009 |
| 20090296275 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film magnetic head has an equidistant two-stage structure in which a first turn part of a first conductor layer and a second turn part of a second conductor layer overlap vertically along the medium-opposing surface while having the same front distance from respective front side faces closer to the medium-opposing surface to the medium-opposing surface. | 12-03-2009 |
| 20090294402 | Method of manufacturing magnetic head for perpendicular magnetic recording - A magnetic head includes: a pole layer including a track width defining portion and a wide portion; and an encasing layer disposed on a bottom forming layer and having a groove that accommodates the pole layer. The groove includes a first portion for accommodating at least part of the track width defining portion, and a second portion for accommodating at least part of the wide portion. A manufacturing method for the magnetic head includes: the step of etching a nonmagnetic layer that will become the encasing layer later, such that an initial groove including the first portion is formed in the nonmagnetic layer; the step of forming an initial groove mask covering the first portion; and a second etching step for etching the nonmagnetic layer so as to complete the groove. When the second etching step starts, a portion of the top surface of the bottom forming layer located in a region in which the second portion is to be formed is covered with the nonmagnetic layer or the initial groove mask. | 12-03-2009 |
| 20090279207 | THIN-FILM MAGNETIC HEAD, METHOD OF MANUFACTURING THE SAME, HEAD GIMBAL ASSEMBLY, AND HARD DISK DRIVE - A thin-film magnetic head is constructed such that a main magnetic pole layer having a magnetic pole end face on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the main magnetic pole layer on the medium-opposing surface side, a gap layer formed between the main magnetic pole layer and write shield layer, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated on a substrate. This thin-film coil has a plurality of turn parts arranged at respective positions having different distances from the medium-opposing surface, while a non-expandable part made of an insulating material having a coefficient of thermal expansion smaller than that of a photosensitive resin is formed between the turn parts. | 11-12-2009 |
| 20090277870 | Method of manufacturing magnetic head for perpendicular magnetic recording - A magnetic head includes a pole layer, and an encasing layer having a groove that accommodates the pole layer. A manufacturing method for the magnetic head includes the steps of forming a nonmagnetic layer that will later undergo formation of the groove therein and will thereby become the encasing layer; forming the groove in the nonmagnetic layer so that the nonmagnetic layer becomes the encasing layer; and forming the pole layer such that the pole layer is accommodated in the groove of the encasing layer. The nonmagnetic layer is formed of Al | 11-12-2009 |
| 20090269708 | Method of manufacturing magnetic head having a patterned pole layer and method of forming a patterned layer - A method of forming a magnetic head comprises the steps of: selectively exposing through the use of a photomask a photoresist layer unpatterned; forming a pattern for forming a pole layer by developing the photoresist layer after the exposure; and forming the pole layer through the use of the pattern. The photomask includes first to third regions. The first region has such a perimeter that a projection image thereof is shaped along a perimeter of an ideal shape of the top surface of the pole layer. The second region touches the perimeter of the first region, and is located outside the first region. The third region is located inside the first region without touching the perimeter of the first region. The third region suppresses deviation of the pole layer from its desired shape which may be caused by the effect of light reflected while the photoresist layer is exposed. | 10-29-2009 |
| 20090173714 | Method of manufacturing magnetic head for perpendicular magnetic recording - A magnetic head comprises: an encasing layer made of a nonmagnetic material and having a groove that opens in the top surface; a nonmagnetic metal layer made of a nonmagnetic metal material, disposed on the top surface of the encasing layer, and having a penetrating opening that is contiguous to the groove; and a pole layer made of a magnetic metal material and encased in the groove of the encasing layer and in the opening of the nonmagnetic metal layer. The pole layer has an end face located in a medium facing surface, the end face having a first portion and a second portion that is located farther from a substrate than the first portion and connected to the first portion. The first portion has a width that decreases as the distance from the substrate decreases. The second portion has a uniform width that defines the track width. In the medium facing surface, the nonmagnetic metal layer exists on both sides of the second portion, the sides being opposed to each other in the direction of track width. | 07-09-2009 |
| 20090162699 | Magnetic head for perpendicular magnetic recording and method of manufacturing same - A magnetic head includes: a pole layer; a pole-layer-encasing layer made of a nonmagnetic material and having a top surface and a groove that opens at the top surface; and a nonmagnetic layer that is made of a nonmagnetic metal material, disposed in the groove and forms a pole-layer-encasing section that accommodates the pole layer. A method of manufacturing the magnetic head includes the steps of: forming the pole-layer-encasing layer; forming an initial nonmagnetic layer in the groove of the pole-layer-encasing layer by physical vapor deposition, the initial nonmagnetic layer being intended to become the nonmagnetic layer later by undergoing etching of a surface thereof, etching the surface of the initial nonmagnetic layer by dry etching so that the initial nonmagnetic layer becomes the nonmagnetic layer; and forming the pole layer in the pole-layer-encasing section formed by the nonmagnetic layer. | 06-25-2009 |
| 20090158582 | Method of manufacturing a magnetic head for perpendicular magnetic recording - A method of manufacturing a magnetic head is disclosed. The steps of manufacture include the formation of an underlying layer made of a material whose etching rate of ion beam etching is higher than that of a magnetic alloy used to make a pole layer, and the formation of a magnetic layer, which includes a portion of the magnetic layer to be etched that will be formed into a track width defining portion by making its side surfaces sloped through etching. The magnetic layer is formed such that the portion to be etched is disposed on the underlying layer. The side surfaces of the portion to be etched by the ion beam etching are etched so that the magnetic layer is formed into the pole layer and so that the end face of the track width defining portion located in the medium facing surface has a width that decreases with decreasing distance from the substrate. | 06-25-2009 |
| 20090147400 | Magnetic head for perpendicular magnetic recording - A magnetic head comprises a pole layer, a shield layer, a gap layer disposed between the pole layer and the shield layer, and a coil. The shield layer incorporates: a first layer disposed on the gap layer; a second layer disposed on the first layer; and a third layer disposed on the second layer. The first layer has an end face located in a medium facing surface. An end face of each of the second and third layers closer to the medium facing surface is located at a distance from the medium facing surface. A first nonmagnetic layer is disposed around the first layer. A second nonmagnetic layer is disposed between the medium facing surface and the end face of the second layer closer to the medium facing surface. | 06-11-2009 |
| 20090141406 | Magnetic head for perpendicular magnetic recording and method of manufacturing same - A magnetic head includes a pole layer and a shield. The shield includes a shield layer having a front end face located in the medium facing surface at a position forward of an end face of the pole layer along a direction of travel of the recording medium. The magnetic head further includes a stopper layer for suppressing protrusion of the front end face of the shield layer, the stopper layer being disposed adjacent to the shield layer and made of a nonmagnetic material having a linear thermal expansion coefficient of 5×10 | 06-04-2009 |
| 20090135530 | Magnetic head for perpendicular magnetic recording and method of manufacturing same - A pole layer has an end face located in a medium facing surface, allows a magnetic flux corresponding to a magnetic field generated by a coil to pass therethrough, and generates a write magnetic field. A shield includes a first layer having an end face located in the medium facing surface at a position forward of the end face of the pole layer along a direction of travel of a recording medium, and a second layer disposed between at least part of the coil and the medium facing surface and magnetically connected to the first layer. The second layer has an end face closer to the medium facing surface, and this end face is located at a distance from the medium facing surface. A nonmagnetic layer made of an inorganic insulating material is provided between the end face of the second layer and the medium facing surface, and a photoresist layer is provided between the end face of the second layer and the nonmagnetic layer. | 05-28-2009 |
| 20090086370 | Thin film magnetic head structure, method of making same and thin film magnetic head - A thin-film magnetic head structure has a configuration adapted to manufacture a thin-film magnetic head configured such that a main magnetic pole layer including a magnetic pole tip on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole tip so as to form a recording gap layer on the medium-opposing surface side, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated. The magnetic pole tip of the main magnetic pole layer includes an even width portion having a substantially even width along an extending direction. | 04-02-2009 |
| 20090059426 | Magnetic head for perpendicular magnetic recording and method of manufacturing same - A top surface of a pole layer of a magnetic head includes: a first portion having a first edge located in a medium facing surface and a second edge opposite thereto; and a second portion located farther from the medium facing surface than the first portion and connected to the first portion at the second edge. The distance from a substrate to an arbitrary point on the first portion increases with increasing distance from the medium facing surface to the arbitrary point. The angle of inclination of the first portion taken at the arbitrary point with respect to a direction perpendicular to the medium facing surface increases stepwise or continuously with increasing distance from the medium facing surface to the arbitrary point. The angle of inclination taken at the first edge is greater than zero degree. The second portion extends in a direction substantially perpendicular to the medium facing surface. | 03-05-2009 |
| 20090056121 | Method of manufacturing electronic component package - An electronic component package includes: a main body including a plurality of layer portions that are stacked and that have their respective side surfaces, the main body having a side surface including the side surfaces of the layer portions; and wiring disposed on the side surface of the main body. Each of the layer portions has at least one electronic component chip and a plurality of electrodes disposed on the side surface of the layer portion. A method of manufacturing the electronic component package includes the steps of fabricating a main body aggregate including a plurality of pre-main-body portions each of which is to become the main body later, the pre-main-body portions being arranged in one direction orthogonal to the direction of stacking of the plurality of layer portions; forming the wiring for each of the pre-main-body portions of the main body aggregate; and cutting the main body aggregate after the formation of the wiring so as to separate the plurality of pre-main-body portions from each other so that each of them becomes the main body and a plurality of electronic component packages are thereby formed. | 03-05-2009 |
| 20090045162 | THIN FILM MAGNETIC HEAD AND MANUFACTURING METHOD THEREOF - A thin film magnetic head has a configuration in which a main magnetic pole film having a magnetic pole end portion on a medium opposing surface (ABS) side facing a magnetic disk, a write shield film facing the magnetic pole end portion so as to form a recording gap film on the medium opposing surface side, and a thin film coil wound around at least a part of the write shield film are laminated. Further, the thin film magnetic head has an upper yoke magnetic pole film whose size is larger than that of the main magnetic pole film at a part more distant from the ABS than the recording gap film, and this upper yoke magnetic pole film is bonded to the side of the main magnetic pole film close to the thin film coil. In the upper yoke magnetic pole film, an end portion on the ABS side is retracted in a direction apart from the ABS in accordance with an increase in film thickness which is measured from the surface of the main magnetic pole film. | 02-19-2009 |
| 20090042143 | Thin-film magnetic head structure, method of manufacturing the same, and thin-film magnetic head - A method of manufacturing a thin-film magnetic head structure comprises the steps of preparing an insulating layer | 02-12-2009 |
| 20090040655 | Thin-film magnetic head structure, method of manufacturing the same, and thin-film magnetic head - A method of manufacturing a thin-film magnetic head structure comprises the steps of preparing an insulating layer | 02-12-2009 |
| 20090032494 | Thin film magnetic head structure, method of making same and thin film magnetic head - A thin-film magnetic head structure has a configuration adapted to manufacture a thin-film magnetic head configured such that a main magnetic pole layer including a magnetic pole tip on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole tip so as to form a recording gap layer on the medium-opposing surface side, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated. The magnetic pole tip of the main magnetic pole layer includes an even width portion having a substantially even width along an extending direction. | 02-05-2009 |
| 20090026603 | Electronic component package and method of manufacturing same - An electronic component package includes: a base having a top surface and a side surface; and a plurality of layer portions stacked on the top surface of the base, each of the layer portions including at least one electronic component chip. The base includes a plurality of external connecting terminals, and a retainer for retaining the plurality of external connecting terminals. Each of the external connecting terminals has an end face located at the side surface of the base. At least one of a plurality of electronic component chips that the plurality of layer portions include is electrically connected to at least one of the external connecting terminals. | 01-29-2009 |
| 20090017198 | Thin-film magnetic head, method of manufacturing the same, head Gimbal assembly, and hard disk drive - A thin-film magnetic head has a laminated construction comprising a main pole layer having a magnetic pole tip on a side of the medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole tip forming a recording gap layer, on the side of the medium-opposing surface, and a thin-film coil wound around at least a portion of the write shield layer. The thin-film magnetic head has an upper yoke pole layer having a larger size than the portion of the main pole layer which is more distant from the medium-opposing surface than the recording gap layer, wherein the upper yoke pole layer is joined to the side of the main pole layer which is near the thin-film coil. | 01-15-2009 |
| 20090002884 | Magnetic head for perpendicular magnetic recording and method of manufacturing same - An encasing section that accommodates a pole layer includes an encasing layer having an encasing groove, and a nonmagnetic film disposed in the encasing groove at a position between the encasing layer and the pole layer. The pole layer includes a track width defining portion and a wide portion. The distance from a medium facing surface to the boundary between the track width defining portion and the wide portion is within a range of 10 to 300 nm. The track width defining portion has a first side surface and a second side surface, while the wide portion has a third side surface contiguous to the first side surface, and a fourth side surface contiguous to the second side surface. The encasing layer has a first wall surface and a second wall surface that form the encasing groove. The distance between the third side surface and the first wall surface is smaller than the distance between the first side surface and the first wall surface, and the distance between the fourth side surface and the second wall surface is smaller than the distance between the second side surface and the second wall surface. | 01-01-2009 |
| 20090000093 | Capacitor and method of manufacturing the same and capacitor unit - The present invention has a configuration which allows manufacturing a capacitor comprising a first electrode layer, conductive first convex sections layered on a surface of the first electrode layer, a first dielectric layer formed on a surface of the first convex sections and a surface of the first electrode layer, and a second electrode layer formed so as to be superimposed on the first convex sections and the first electrode layer via the first dielectric layer. | 01-01-2009 |
| 20080317969 | Method of manufacturing magnetic head for perpendicular magnetic recording - A pole layer has an end located in a medium facing surface, the end having: a first side close to a substrate; a second side located opposite to the first side; a third side connecting an end of the first side to an end of the second side; and a fourth side connecting the other end of the first side to the other end of the second side. The second side defines a track width. The end of the pole layer located in the medium facing surface has a width that decreases toward the first side. The pole layer is disposed in a groove of a pole-layer-encasing layer made of a nonmagnetic insulating material, with a nonmagnetic conductive film provided between the encasing layer and the pole layer. The pole layer incorporates: a first layer located closer to the surface of the groove; and a second layer located farther from the surface of the groove. | 12-25-2008 |
| 20080316653 | Magnetic head for perpendicular magnetic recording and method of manufacturing same - A magnetic head includes: a pole layer; a nonmagnetic layer disposed on part of the top surface of the pole layer; a gap layer disposed on the pole layer and the nonmagnetic layer; and a shield disposed on the gap layer. The top surface of the pole layer includes: a first portion having a first edge located in a medium facing surface and a second edge opposite thereto; and a second portion located farther from the medium facing surface than the first portion and connected to the first portion at the second edge. The first portion is inclined with respect to a direction orthogonal to the medium facing surface so that the distance from a substrate increases with increasing distance from the medium facing surface. The nonmagnetic layer has a bottom surface touching the second portion, and this bottom surface has an edge located at the second edge. | 12-25-2008 |
| 20080314146 | Sensing unit and method of making same - In a sensing unit according to the present invention, a movable portion of a spring portion is supported floatably above a recessed portion formed in a substrate. Thus, the movable portion is capable of oscillating in any direction parallel to the substrate surface. Moreover, the movable portion is capable of oscillating in the thickness direction of the substrate such that the amplitude of a center side end portion thereof reaches a maximum. A sensor portion is provided on the movable portion. As a result, the sensing unit according to the present invention has a higher degree of freedom in terms of the measurement direction than a conventional sensing unit that oscillates in only one direction. | 12-25-2008 |
| 20080313882 | Sensing unit and method of making same - In a sensing unit according to the present invention, a spring portion having a support portion and a movable portion is conductive. A signal of a sensor portion provided on the movable portion of the spring portion is transmitted via the spring portion. Hence, the sensing unit according to the present invention has a simple constitution with a small number of components, and a wire does not necessarily have to be provided for each sensor portion. As a result, a reduction in manufacturing cost, simplification of the manufacturing process, and so on are achieved. | 12-25-2008 |
| 20080295328 | Method of manufacturing electronic component package - In a method of manufacturing an electronic component package, first, a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages are formed by plating on a top surface of a substrate to thereby fabricate a wafer. The wafer includes a plurality of pre-base portions that will be separated from one another later to become bases of the respective electronic component packages. Next, at least one electronic component chip is bonded to each of the pre-base portions of the wafer. Next, electrodes of the electronic component chip are connected to the external connecting terminals. Next, the electronic component chip is sealed. Next, the wafer is cut so that the pre-base portions are separated from one another and the plurality of bases are thereby formed. | 12-04-2008 |
| 20080277376 | Method of manufacturing magnetic head, and magnetic head sub-structure - A method of manufacturing magnetic heads comprises the step of: fabricating a magnetic head substructure by forming a plurality of components of the magnetic heads on a single substrate, wherein a plurality of rows of pre-head portions that will be the respective magnetic heads later are aligned in the substructure; and fabricating the magnetic heads by separating the pre-head portions from one another through cutting the substructure. In the step of fabricating the substructure, a plurality of indicators are formed, each of the indicators serving as a reference for indicating the location of a region ABS in which the medium facing surfaces of the magnetic heads are to be formed. | 11-13-2008 |
| 20080274271 | Thin-film magnetic head structure adapted to manufacture a thin-film head having a base magnetic pole part, a york magnetic pole part, and an intervening insulative film - A thin-film magnetic head structure has a configuration adapted to manufacture a thin-film magnetic head configured such that a main magnetic pole layer including a magnetic pole end part on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole end part so as to form a recording gap layer on the medium-opposing surface side, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated. The main magnetic pole layer includes a base magnetic pole part comprising the magnetic pole end part and a base depression distanced farther from the medium-opposing surface than the magnetic pole end part, and an embedded magnetic pole part buried in the base depression and joined to the base magnetic pole part. The thin-film magnetic head structure includes a yoke magnetic pole part joined to the base magnetic pole part and embedded magnetic pole part at a position distanced farther from the medium-opposing surface than the recording gap layer, and an intervening insulative film disposed between the embedded magnetic pole part and yoke magnetic pole part at a position distanced farther from the medium-opposing surface than the recording gap layer. | 11-06-2008 |
| 20080254208 | Thin film magnetic head structure adapted to manufacture a thin film magnetic head - A thin-film magnetic head structure has a configuration adapted to manufacture a thin-film magnetic head configured such that a main magnetic pole layer including a magnetic pole end part on a side of a medium-opposing surface opposing a recording medium, a write shield layer opposing the magnetic pole end part so as to form a recording gap layer on the medium-opposing surface side, and a thin-film coil wound about the write shield layer or main magnetic pole layer are laminated. The main magnetic pole layer has an end face joint structure where respective end faces of the magnetic pole end part and a yoke magnetic pole part having a size greater than that of the magnetic pole end part are joined to each other, and a surface with a flat structure on a side closer to the thin-film coil. | 10-16-2008 |
| 20080239567 | Magnetic head for perpendicular magnetic recording and method of manufacturing same - A pole layer has a track width defining portion and a wide portion. The pole layer has: first and second side surfaces located opposite to each other in a first region extending from a medium facing surface to a position at a distance of 10 to 300 nm from the medium facing surface; third and fourth side surfaces located in a second region other than the first region; a fifth side surface located at the boundary between the first and second regions and connecting the first and third side surfaces to each other; and a sixth side surface located at the boundary between the first and second regions and connecting the second and fourth side surfaces to each other. The distance between the first and second side surfaces taken in the track width direction decreases with decreasing distance from the top surface of the substrate. The angle formed by the third and fourth side surfaces with respect to the direction orthogonal to the top surface of the substrate is smaller than that formed by the first and second side surfaces with respect to the direction orthogonal to the top surface of the substrate. | 10-02-2008 |
| 20080197484 | Method of manufacturing electronic component package, and wafer and substructure used for manufacturing electronic component package - In a method of manufacturing an electronic component package, first, there is fabricated a wafer incorporating a plurality of sets of external connecting terminals corresponding to a plurality of electronic component packages, and a retainer for retaining the plurality of sets of external connecting terminals, the wafer including a plurality of pre-base portions that will be separated from one another later to be bases of the electronic component packages. Next, at least one electronic component chip is bonded to each of the pre-base portions of the wafer. Next, electrodes of the electronic component chips are connected to the external connecting terminals. Next, the electronic component chips are sealed. Next, the wafer is cut so that the pre-base portions are separated from one another and the plurality of bases are thereby formed. | 08-21-2008 |
