Harima Chemicals, Inc.
|Harima Chemicals, Inc. Patent applications|
|Patent application number||Title||Published|
|20120308792||RED FLUORESCENCE CONVERSION COMPOSITION AND RED FLUORESCENCE CONVERSION FILM - A red fluorescence conversion composition includes a color conversion material (A) which absorbs light in a blue region and emits light having a fluorescence emission maximum in yellow-orange regions; a color conversion material (B) which absorbs light in the yellow-orange regions and emits light having a fluorescence emission maximum in the red region; and a matrix resin (C) for dispersing the color conversion materials (A) and (B). The color conversion material (A) is a condensed polycyclic compound made of a 5-membered ring compound having a conjugated system, and a 6-membered ring compound having a conjugated system with the 5-membered ring compound. The 5-membered ring compound contains at least one kind of atom selected from a hetero atom, a selenium atom, and a boron atom. A red fluorescence conversion film is made of the composition.||12-06-2012|
|20120291922||SOLDER PASTE - A solder paste according to an aspect of the invention includes, within a flux, an activator that has a dibasic acid with a molecular weight of 250 or less, a monobasic acid with a molecular weight of 150 or greater and 300 or less, and a dibasic acid with a molecular weight of 300 or greater and 600 or less; and at least one resin additive selected from the group consisting of high-density polyethylenes and polypropylenes. The solder paste has the resin additive in an amount of 4% by weight or greater and 12% by weight or less when the total amount of the flux is taken as 100% by weight, and has a viscosity of||11-22-2012|
|20120291921||FLUX FOR SOLDER PASTE, AND SOLDER PASTE - A flux for a solder paste according to an aspect of the invention includes an acrylic resin obtained by radically copolymerizing a (meth)acrylate having a C||11-22-2012|
|20120175020||LOW SILVER SOLDER ALLOY AND SOLDER PASTE COMPOSITION - A low silver solder alloy of the present invention comprises 0.05-2.0% by mass of silver; 1.0% by mass or less of copper; 3.0% by mass or less of antimony; 2.0% by mass or less of bismuth; 4.0% by mass or less of indium; 0.2% by mass or less of nickel; 0.1% by mass or less of germanium; 0.5% by mass or less of cobalt (provided that none of the copper, the antimony, the bismuth, the indium, the nickel, the germanium, and the cobalt is 0% by mass); and the residue is tin. According to the present invention, the long-term reliable low silver solder alloy is provided, wherein the low silver solder alloy permits the cost reduction by decreasing the Ag content, and has the excellent stretch, melting point, and strength, and also has the high fatigue resistance (thermal fatigue resistance).||07-12-2012|
|20120073741||ADHESIVE COMPOSITION - An adhesive composition for forming an adhesive layer for temporarily fixing a substrate, such as a wafer, to a support when processing the substrate, the adhesive composition including a resin (A) produced by polymerizing a monomer component containing a cycloolefin-based monomer, at least one terpene-based resin, rosin-based resin, or petroleum resin (resin B), and an organic solvent capable of dissolving the resins (A) and (B). The resin (A) has a glass transition point of 60° C. or higher, the resin (B) has a softening point of 80 to 160° C. and a molecular weight of 300 to 3000, and the blending ratio of the resin (A) to the resin (B) is (A):(B)=80:20 to 55:45 (mass ratio).||03-29-2012|
|20100270365||SOLDER PASTE COMPOSITION HAVING SOLDER POWDER, FLUX AND METALLIC POWDER - The present invention relates to a solder paste composition used for precoating an electrode surface with solder. A first solder paste composition is contains a solder powder and a flux, and a metallic powder made by metallic species different from metallic species constituting the solder powder and metallic species constituting the electrode surface in a rate of 0.1% by weight or more and 20% by weight or less based on a total amount of the solder powder. When these solder paste compositions are evenly applied onto an electronic circuit substrate for precoating, such a solder that does not generate any swollen portion, solder-lacking portion and variability in a height thereof can be formed irrespective of a shape of a pad.||10-28-2010|
|20100252144||SOLDERING FLUX AND SOLDER PASTE COMPOSITION - There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80% by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder.||10-07-2010|
|20100243717||SOLDERING FLUX, SOLDER PASTE COMPOSITION AND SOLDERING METHOD - Provided is a soldering flux in which the volatilized amount in reflowing is reduced to enable soldering with a small environmental load while suppressing the stickiness of the flux residue to ensure a high reliability, as well as a solder paste composition and a soldering method using the same. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an organic acid anhydride being liquid form at 20° C. or higher and a polyhydric alcohol being liquid form at 20° C. or higher, and when the acid value and the content of the organic acid anhydride is AV (mgKOH/g) and W||09-30-2010|
|20090297882||Brazing filler metal, brazing filler metal paste, and heat exchanger - A brazing filler metal includes quaternary alloy powder and copper powder. The quaternary allow powder consists of from 0.1 to 27.4 mass percent tin, from 0.8 to 5.1 mass percent nickel, from 2.2 to 10.9 mass percent phosphorous and a balance including copper and any unavoidable impurity. The brazing filler metal can be used in a form of paste by being mixed with an organic binder and an organic solvent. The brazing filler metal and the brazing filler metal can be used for joining members made of copper or copper alloy, such as members of a heat exchanger.||12-03-2009|
|20090165893||PASTE COMPOSITION FOR ALUMINUM BRAZING - A paste composition for aluminum brazing of the invention contains 40 to 65% by weight of a metal powder for brazing (a), 5 to 35% by weight of a fluoride type flux (b), 1 to 10% by weight of a methacrylic acid ester type polymer (c), and 10 to 40% by weight of an organic solvent (d); and the component (d) is a hydrocarbon type organic solvent having no aromatic ring and no hydroxyl group and the composition is in a paste-like state having a viscosity of 6,000 to 200,000 mPa·s at 23° C. and accordingly, the storage stability and applicability (practically, discharge property and pressure stability by using a dispenser) and brazing property can be improved in good balance.||07-02-2009|
Patent applications by Harima Chemicals, Inc.