20150333040 | SEMICONDUCTOR DEVICE PACKAGE - A package for a semiconductor device having a fan-out structure in which input/output terminals are disposed adjacent to at least one first semiconductor chip and electrically connected to the at least one first semiconductor chip may include a second semiconductor chip spaced apart from the input/output terminals and be opposed to the at least one first semiconductor chip. The semiconductor device package may ensure an improved degree of integration and may improve connection stability between the input/output terminals and wirings. Accordingly, a reliability of the semiconductor device package may be enhanced. | 11-19-2015 |