| HAMAMATSU PHOTONICS K.K. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120135608 | SUBSTRATE PROCESSING METHOD - A substrate processing method for forming a space extending along a predetermined line in a silicon substrate includes a first step of converging a laser light which is an elliptically-polarized light having an ellipticity other than 1 at the substrate so as to form a plurality of modified spots within the substrate along the line and construct a modified region including the modified spots, and a second step of anisotropically etching the substrate so as to advance an etching selectively along the modified region and form the space in the substrate. In the first step, the light is converged at the substrate such that a moving direction of the light with respect to the substrate and a direction of polarization of the light form an angle of less than 45° therebetween, and the modified spots are made align in a plurality of rows along the line. | 05-31-2012 |
| 20120135607 | SUBSTRATE PROCESSING METHOD - A substrate processing method for forming a space extending along a predetermined line in a silicon substrate includes a first step of converging a laser light which is an elliptically-polarized light having an ellipticity other than 1 at the substrate so as to form a plurality of modified spots within the substrate along the line and produce a modified region including the modified spots, and a second step of anisotropically etching the substrate so as to advance an etching selectively along the modified region and form the space in the substrate. In the first step, the light is converged at the substrate such that a moving direction of the light with respect to the substrate and a direction of polarization of the light form an angle of 45° or greater therebetween, and the modified spots are made align in one row along the line. | 05-31-2012 |
| 20120135606 | LASER PROCESSING METHOD - A laser processing method of converging laser light into an object to be processed made of silicon so as to form a modified region and etching the object along the modified region so as to form the object with a through hole comprises an etch resist film producing step of producing an etch resist film resistant to etching on an outer surface of the object; a laser light converging step of converging the laser light at the object after the etch resist film producing step so as to form the modified region along a part corresponding to the through hole in the object and converging the laser light at the etch resist film so as to form a defect region along a part corresponding to the through hole in the etch resist film; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole. | 05-31-2012 |
| 20120135602 | METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE - A method for manufacturing a semiconductor device having a cooling mechanism comprises a modified region forming step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a modified region within the object along a line to form a modified region, an etching step of anisotropically etching the object after the modified region forming step so as to advance the etching selectively along the first modified region and form a flow path for circulating a coolant as a cooling mechanism within the object, and a functional device forming step of forming a functional device on one main face side of the object. | 05-31-2012 |
| 20120135585 | METHOD FOR MANUFACTURING CHIP - A method for manufacturing a chip constituted by a functional device formed on a substrate comprises a functional device forming step of forming the functional device on one main face of a sheet-like object to be processed made of silicon; a first modified region forming step of converging a laser light at the object so as to form a first modified region along the one main face of the object at a predetermined depth corresponding to the thickness of the substrate from the one main face; a second modified region forming step of converging the laser light at the object so as to form a second modified region extending such as to correspond to a side edge of the substrate as seen from the one main face on the one main face side in the object such that the second modified region joins with the first modified region along the thickness direction of the object; and an etching step of selectively advancing etching along the first and second modified regions after the first and second modified region forming steps so as to cut out a part of the object and form the substrate. | 05-31-2012 |
| 20120134380 | QUANTUM CASCADE LASER - A quantum cascade laser is configured to include a semiconductor substrate, and an active layer that is provided on the substrate and has a cascade structure formed by alternately laminating emission layers and injection layers by multistage-laminating unit laminate structures each consisting of the quantum well emission layer and the injection layer, and generates light by intersubband transition in a quantum well structure. In a laser cavity structure for light with a predetermined wavelength generated in the active layer, a front reflection film with a reflectance of not less than 40% and not more than 99% for laser oscillation light is formed on the front end face that becomes a laser beam output surface, and a back reflection film with a reflectance higher than that of the front reflection film for the laser oscillation light is formed on the back end face. | 05-31-2012 |
| 20120132460 | LAMINATED WIRING BOARD - In a multilayer wiring board 1, a low resistance silicon substrate | 05-31-2012 |
| 20120131958 | LASER PROCESSING METHOD - A laser processing method of converging a laser light into an object to be processed made of glass so as to form a modified region and etching the object along the modified region so as to form a through hole in the object comprises a browning step of discoloring at least a part of the object by browning; a laser light converging step of forming the modified region in the discolored part of the object by converging the laser light into the object after the browning step; and an etching step of etching the object after the laser light converging step so as to advance the etching selectively along the modified region and form the through hole. | 05-31-2012 |
| 20120129359 | LASER PROCESSING METHOD - A laser processing method comprises a laser light converging step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a modified region within the object, and an etching step of anisotropically etching the object so as to thin the object to a target thickness and advancing the etching selectively along the modified region so as to form the object with a through hole tilted with respect to a thickness direction of the object after the laser light converging step, wherein the laser light converging step forms a first modified region as the modified region in a part corresponding to the through hole in the object and a second modified region as the modified region extending parallel to the thickness direction and joining with the first modified region in a part to be removed upon thinning by the anisotropic etching in the object, and wherein the etching step advances the etching selectively along the second modified region and then along the first modified region while thinning the object and completes forming the through hole when the object is at the target thickness. | 05-24-2012 |
| 20120129348 | LASER PROCESSING METHOD - A laser processing method of converging laser light into an object to be processed made of silicon so as to form a modified region and etching the object along the modified region so as to form the object with a through hole comprises a laser light converging step of converging the laser light at the object so as to form the modified region along a part corresponding to the through hole in the object; an etch resist film producing step of producing an etch resist film resistant to etching on an outer surface of the object after the laser light converging step; and an etching step of etching the object so as to advance the etching selectively along the modified region and form the through hole after the etch resist film producing step; while the laser light converging step exposes the modified region to the outer surface of the object. | 05-24-2012 |
| 20120127460 | INTEGRATING CIRCUIT AND LIGHT-DETECTION DEVICE - A photodetecting device | 05-24-2012 |
| 20120125893 | LASER PROCESSING METHOD - In a method comprising a modified region forming step of converging a laser light at a sheet-like object to be processed made of silicon so as to form a plurality of modified spots within the object along a modified region forming line tilted in a first lateral direction with respect to a thickness direction of the object and the plurality of modified spots construct a modified region, and an etching step of anisotropically etching the object after the modified region forming step so as to advance the etching selectively along the modified region and form the object with a space extending obliquely with respect to the thickness direction, the modified region forming step forms the plurality of modified spots such that the modified spots adjacent to each other at least partly overlap each other when seen in the first lateral direction. | 05-24-2012 |
| 20120125892 | LASER PROCESSING METHOD - A laser processing method for forming a hole in a sheet-like object to be processed made of silicon comprises a depression forming step of forming a depression in a part corresponding to the hole on a laser light entrance surface side of the object, the depression opening to the laser light entrance surface; a modified region forming step of forming a modified region along a part corresponding to the hole in the object by converging a laser light at the object after the depression forming step; and an etching step of anisotropically etching the object after the modified region forming step so as to advance the etching selectively along the modified region and form the hole in the object; wherein the modified region forming step exposes the modified region or a fracture extending from the modified region to an inner face of the depression. | 05-24-2012 |
| 20120125887 | METHOD FOR MANUFACTURING LIGHT-ABSORBING SUBSTRATE AND METHOD FOR MANUFACTURING MOLD FOR MAKING SAME - A method for manufacturing a light-absorbing substrate having a surface with depressions and projections comprises a first step of irradiating a substrate with a laser light so as to form a plurality of modified regions arranged two-dimensionally along a surface of the substrate within the substrate and cause at least one of each modified region and a fracture generated from the modified region to reach the surface of the substrate and a second step of etching the surface of the substrate after the first step so as to form depressions and projections on the surface of the substrate. | 05-24-2012 |
| 20120120225 | MICROSCOPE SYSTEM AND METHOD - A method for determining a position of an area of an object within the complete object, wherein the image of the area of the object is contained within a field of view of a microscope. The method comprises acquiring high magnification image data representing an image of the field of view of the microscope, typically from a digital camera attached to the microscope; processing the high magnification image data to reduce the resolution thereof; comparing the processed high magnification image data with portions of the low magnification image data, and determining said position based on the results of said comparison. | 05-17-2012 |
| 20120119334 | LASER MACHINING METHOD AND CHIP - While reliably cutting an object to be processed, the strength of the resulting chips is improved. An object to be processed | 05-17-2012 |
| 20120113534 | IMMERSION LENS HOLDING DEVICE - A solid immersion lens supporting device includes a lens holder | 05-10-2012 |
| 20120111495 | METHOD FOR CUTTING OBJECT TO BE PROCESSED - A silicon substrate | 05-10-2012 |
| 20120104066 | METHOD FOR CUTTING PROCESSING TARGET - A rear face | 05-03-2012 |
| 20120103948 | LASER MACHINING DEVICE AND LASER MACHINING METHOD - A laser processing device ( | 05-03-2012 |
| 20120099010 | SOLID-STATE IMAGE PICKUP DEVICE - A solid-state image pickup device | 04-26-2012 |
| 20120098997 | BLINKING-SIGNAL DETECTING DEVICE - A blinking-signal device | 04-26-2012 |
| 20120097857 | RADIATION DETECTING UNIT - An object is to prevent occurrence of an insensitive zone to radiation in parallel arrangement of multiple units. This radiation detecting unit | 04-26-2012 |
| 20120091890 | PHOTOMULTIPLIER TUBE - The photomultiplier tube | 04-19-2012 |
| 20120091889 | PHOTOMULTIPLIER TUBE - The photomultiplier tube | 04-19-2012 |
| 20120091351 | SCINTILLATOR FOR NEUTRON DETECTION AND NEUTRON MEASUREMENT DEVICE - A neutron measurement apparatus | 04-19-2012 |
| 20120091316 | PHOTOMULTIPLIER TUBE - The photomultiplier tube | 04-19-2012 |
| 20120091107 | LASER MACHINING METHOD - An object to be processed | 04-19-2012 |
| 20120077315 | SEMICONDUCTOR SUBSTRATE CUTTING METHOD - A wafer having a front face formed with a functional device is irradiated with laser light while positioning a light-converging point within the wafer with the rear face of the wafer acting as a laser light incident face, so as to generate multiphoton absorption, thereby forming a starting point region for cutting due to a molten processed region within the wafer along a line. Consequently, a fracture can be generated from the starting point region for cutting naturally or with a relatively small force, so as to reach the front face and rear face. Therefore, when an expansion film is attached to the rear face of the wafer by way of a die bonding resin layer after forming the starting point region for cutting and then expanded, the wafer and die bonding resin layer can be cut along the line. | 03-29-2012 |
| 20120077296 | LASER PROCESSING METHOD AND METHOD FOR MANUFACTURING LIGHT-EMITTING DEVICE - A plurality of modified parts are formed at a first formation pitch for a line arranged along the M-plane of a single-crystal sapphire substrate to construct a modified region and cause a fracture occurring from the modified region to reach a principal surface of the single-crystal sapphire substrate. A plurality of modified parts are formed at a second formation pitch narrower than the first formation pitch for a line arranged along the A-plane of the single-crystal sapphire substrate to construct a modified region and cause a fracture occurring from the modified region to reach the principal surface of the single-crystal sapphire substrate. Along the lines, a knife edge is pressed against a wafer from the side of the single-crystal sapphire substrate opposite from the principal surface of the single-crystal sapphire substrate where the fractures have reached, to cut the wafer along the lines. | 03-29-2012 |
| 20120067857 | LASER PROCESSING METHOD - A laser processing method for preventing particles from occurring from cut sections of chips obtained by cutting a silicon wafer is provided. An irradiation condition of laser light L for forming modified regions | 03-22-2012 |
| 20120061785 | SEMICONDUCTOR LIGHT DETECTING ELEMENT AND MANUFACTURING METHOD THEREFOR - A photodiode PD | 03-15-2012 |
| 20120061356 | LASER MACHINING DEVICE AND LASER MACHINING METHOD - The controllability of modified spots is improved. A laser processing apparatus | 03-15-2012 |
| 20120043883 | FLASH LAMP - In a flash lamp | 02-23-2012 |
| 20120038016 | BACK-ILLUMINATED SOLID-STATE IMAGE PICKUP DEVICE - In a back-illuminated solid-state image pickup device including a semiconductor substrate | 02-16-2012 |
| 20120025102 | RADIATION IMAGE CONVERSION PANEL AND METHOD FOR PRODUCING SAME - In a radiation image conversion panel ( | 02-02-2012 |
| 20120025089 | X-RAY IMAGING DEVICE - An X-ray imaging device | 02-02-2012 |
| 20120025086 | RADIATION DETECTION DEVICE - A radiation detection device includes a first radiation detector that is positioned on the upstream side of a radiation incident direction and detects radiation in a low-energy range, and a second radiation detector that is positioned on the downstream side and detects radiation in a high-energy range. In such a configuration, a pixel width p | 02-02-2012 |
| 20120025085 | ION DETECTOR - An ion detector for detecting positive ions and negative ions, includes a housing provided with an ion entrance to make the positive ions and the negative ions enter, a conversion dynode which is disposed in the housing and to which a negative potential is applied, a scintillator which is disposed in the housing and has an electron incident surface which is opposed to the conversion dynode and into which secondary electrons emitted from the conversion dynode are made incident, a conductive layer which is formed on the electron incident surface and to which a positive potential is applied, and a photodetector which detects light emitted by the scintillator in response to incidence of the secondary electrons. | 02-02-2012 |
| 20120018834 | LINEAR IMAGE SENSOR - In a linear image sensor | 01-26-2012 |
| 20120018621 | SIGNAL PROCESSING DEVICE AND PHOTODETECTION DEVICE - In a signal processing device of an embodiment, an integration circuit accumulates a charge from a photodiode in an integrating capacitor element, and outputs a voltage value according to the amount of charge. A comparator circuit, when the voltage value from the integration circuit has reached a reference value, outputs a saturation signal. A charge injection circuit, in response to the saturation signal, injects an opposite polarity of charge into the integrating capacitor element. A counter circuit performs counting based on the saturation signal. A holding circuit holds the voltage value from the integration circuit. An amplifier circuit outputs a voltage value that is K times (where K>1) larger than the voltage value held by the holding circuit. An A/D converter circuit sets a voltage value that is K times larger than the reference value as the maximum input voltage value, that is, a full-scale value, and outputs a digital value corresponding to the voltage value from the amplifier circuit. | 01-26-2012 |
| 20120014402 | LASER MODULE - A laser module LM is provided with a quantum cascade laser | 01-19-2012 |
| 20120012753 | SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME, RADIOLOGICAL IMAGING APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF TESTING SOLID-STATE IMAGING DEVICE - A solid-state imaging device according to one embodiment includes a plurality of signal output units. Each of the plurality of signal output units includes a first input terminal electrode group that includes a plurality of terminal electrodes for inputting a reset signal, a hold signal, a horizontal start signal, and a horizontal clock signal and a first output terminal electrode that provides output signals. The solid-state imaging device further includes a second input terminal electrode group that includes a plurality of terminal electrodes for receiving the reset signal, the hold signal, the horizontal start signal, and the horizontal clock signal, a plurality of switches that switch an electrode group which is connected with integrating circuits, holding circuits, and a horizontal shift register between the first input terminal electrode group and the second input terminal electrode group, and a second output terminal electrode. | 01-19-2012 |
| 20120007149 | SOLID IMAGING DEVICE - In a solid-state imaging device | 01-12-2012 |
| 20120006799 | LASER PROCESSING METHOD AND CHIP - An object to be processed can be cut highly accurately along a line to cut. | 01-12-2012 |
| 20120006797 | LASER BEAM WORKING MACHINE - A cylindrical lens ( | 01-12-2012 |
| 20120002091 | SOLID-STATE IMAGE PICKUP DEVICE - A solid-state imaging device | 01-05-2012 |
| 20120001081 | SOLID-STATE IMAGING DEVICE AND METHOD OF MANUFACTURING THE SAME, RADIOLOGICAL IMAGING APPARATUS AND METHOD OF MANUFACTURING THE SAME, AND METHOD OF TESTING SOLID-STATE IMAGING DEVICE - A solid-state imaging device according to an embodiment includes a plurality of signal output units. Each of the plurality of signal output units includes an input terminal electrode group including terminal electrodes for inputting a reset signal, a hold signal, a horizontal start signal, and a horizontal clock signal and an output terminal electrode for providing an output signal. The solid-state imaging device further includes common lines that are provided across the plurality of signal output units. A terminal electrode for the reset signal and a terminal electrode for the hold signal are connected to the corresponding common lines through the corresponding switches. | 01-05-2012 |
| 20110317237 | LIGHT CONTROL DEVICE AND LIGHT CONTROL METHOD - A light control device | 12-29-2011 |
| 20110316200 | METHOD OF CUTTING OBJECT TO BE PROCESSED, METHOD OF CUTTING STRENGTHENED GLASS SHEET AND METHOD OF MANUFACTURING STRENGTHENED GLASS MEMBER - A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line. | 12-29-2011 |
| 20110309060 | METHOD OF CUTTING OBJECT TO BE PROCESSED - A method of cutting an object to be processed comprises the steps of irradiating an object to be processed with a laser light which is an elliptically-polarized light having an ellipticity other than 1 such that a direction of polarization of the laser light intersects a line to cut the object and a thickness direction of the object, while locating a converging point of the laser light within the object, so as to form a modified region within the object along the line and generate a fracture from the modified region in the thickness direction of the object, and causing the fracture to reach front and rear faces of the object so as to cut the object along the line. | 12-22-2011 |
| 20110306182 | METHOD OF CUTTING SEMICONDUCTOR SUBSTRATE - Multiphoton absorption is generated, so as to form a part which is intended to be cut | 12-15-2011 |
| 20110304751 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device | 12-15-2011 |
| 20110303999 | SEMICONDUCTOR LIGHT-DETECTING ELEMENT - Prepared is an n | 12-15-2011 |
| 20110303823 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device of one embodiment includes a light receiving section including of a plurality of pixels | 12-15-2011 |
| 20110303646 | LASER WORKING METHOD - An object to be processed is restrained from warping at the time of laser processing. A modified region M | 12-15-2011 |
| 20110300691 | WORKPIECE CUTTING METHOD - Fractures ( | 12-08-2011 |
| 20110299654 | SOLID-STATE IMAGE PICKUP APPARATUS AND X-RAY INSPECTION SYSTEM - A solid-state image pickup apparatus | 12-08-2011 |
| 20110299097 | FILM THICKNESS MEASUREMENT DEVICE AND MEASUREMENT METHOD - A film thickness measurement apparatus | 12-08-2011 |
| 20110298958 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device according to one embodiment is a multi-port solid-state imaging device, and includes an imaging region and a plurality of units. The imaging region includes a plurality of pixel columns. The units generate signals based on charges from the imaging region. Each of the units has an output register, a plurality of multiplication registers, and an amplifier. The output register transfers a charge from one or more corresponding pixel columns out of the plurality of pixel columns. The multiplication registers are provided in parallel, and receive the charge from the output register to generate multiplied charges individually. The amplifier generates a signal based on the multiplied charges from the multiplication registers. | 12-08-2011 |
| 20110298914 | MICROSCOPE SYSTEM - A microscope system is constructed by a light guiding optical system | 12-08-2011 |
| 20110298076 | PHOTODIODE AND PHOTODIODE ARRAY | 12-08-2011 |
| 20110291218 | PHOTODIODE AND PHOTODIODE ARRAY - A photodiode array PDA | 12-01-2011 |
| 20110291216 | IMAGE SENSOR - In an image sensor | 12-01-2011 |
| 20110291213 | PHOTODIODE MANUFACTURING METHOD AND PHOTODIODES - A semiconductor substrate | 12-01-2011 |
| 20110286486 | QUANTUM CASCADE LASER - A quantum cascade laser is configured to include a semiconductor substrate, and an active layer provided on the substrate and having a cascade structure formed by multistage-laminating unit laminate structures | 11-24-2011 |
| 20110284766 | LIGHT IRRADIATION DEVICE AND LIGHT MEASUREMENT DEVICE - The present invention relates to a light irradiation apparatus and the like which can reduce background light noise from a plurality of wells provided on a microplate. The light irradiation apparatus comprises a microplate ( | 11-24-2011 |
| 20110274128 | LASER BEAM WORKING MACHINE - A cylindrical lens ( | 11-10-2011 |
| 20110273759 | LIGHT CONTROL DEVICE AND LIGHT CONTROL METHOD - A light control device | 11-10-2011 |
| 20110273603 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device | 11-10-2011 |
| 20110272557 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device | 11-10-2011 |
| 20110267679 | LIGHT MODULATING DEVICE AND LASER PROCESSING DEVICE - A light modulating device ( | 11-03-2011 |
| 20110266644 | SEMICONDUCTOR PHOTODETECTION ELEMENT - A semiconductor photodetection element SP has a silicon substrate | 11-03-2011 |
| 20110266261 | LASER MACHINING DEVICE - A laser machining device which can suppress the aberration of a laser beam converged into an object to be machined is provided. The laser machining device ( | 11-03-2011 |
| 20110254989 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device | 10-20-2011 |
| 20110249253 | TOTAL REFLECTION TERAHERTZ WAVE MEASUREMENT DEVICE - A total reflection terahertz wave measuring apparatus | 10-13-2011 |
| 20110242642 | TERAHERTZ WAVE GENERATION DEVICE - A terahertz wave generating apparatus | 10-06-2011 |
| 20110241154 | OPTICAL SENSOR - In an infrared sensor ( | 10-06-2011 |
| 20110235035 | SPECTROMETER - A spectrometer is provided with an integrating sphere | 09-29-2011 |
| 20110229008 | SAMPLE IDENTIFICATION DEVICE AND SAMPLE IDENTIFICATION METHOD - A cell stethoscope | 09-22-2011 |
| 20110224931 | METHOD FOR MEASURING SCATTERING ABSORBER AND DEVICE FOR MEASURING SCATTERING ABSORBER - Acquired is the internal information of a scattering medium more accurately and easily, with the influence of an instrumental function taken into account, even where noise is contained in a measurement waveform. | 09-15-2011 |
| 20110222827 | FIBER OPTIC PLATE AND METHOD FOR PRODUCING THE SAME | 09-15-2011 |
| 20110220956 | SILICON LIGHT-EMITTING ELEMENT - A silicon light-emitting element includes a first conductivity type silicon substrate | 09-15-2011 |
| 20110216312 | SEMICONDUCTOR INSPECTION DEVICE AND INSPECTION METHOD - For a semiconductor device S, an inspection is performed in a zero-bias state by use of electromagnetic waves generated by irradiation of pulsed laser light, and an inspection range is set with reference to layout information of the semiconductor device S to perform two-dimensional scanning by inspection light L | 09-08-2011 |
| 20110205547 | OBSERVATION DEVICE, AND OBSERVATION METHOD - The observation device | 08-25-2011 |
| 20110205537 | SPECTROMETER - A spectrometer | 08-25-2011 |
| 20110193269 | ABERRATION-CORRECTING METHOD, LASER PROCESSING METHOD USING SAID ABERRATION-CORRECTING METHOD, LASER IRRADIATION METHOD USING SAID ABERRATION-CORRECTING METHOD, ABERRATION-CORRECTING DEVICE AND ABERRATION-CORRECTING PROGRAM - In an aberration-correcting method according to an embodiment of the present invention, in an aberration-correcting method for a laser irradiation device | 08-11-2011 |
| 20110186913 | SOLID STATE IMAGING DEVICE WITH ELECTRON MULTIPLYING FUNCTION - In a solid state imaging device with an electron multiplying function, in a section normal to an electron transfer direction of a multiplication register EM, an insulating layer | 08-04-2011 |
| 20110181929 | LASER PROCESSING DEVICE AND LASER PROCESSING METHOD - A laser processing device | 07-28-2011 |
| 20110176656 | SOLID-STATE IMAGE PICKUP DEVICE - A solid-state image pickup device | 07-21-2011 |
| 20110164247 | SPECTRAL MODULE - A spectral module | 07-07-2011 |
| 20110146055 | METHOD FOR MANUFACTURING SPECTROMETER - First, a box | 06-23-2011 |
| 20110141255 | X-RAY IMAGING SYSTEM FOR MEDICAL USE - A solid-state image pickup apparatus | 06-16-2011 |
| 20110135057 | SOLID-STATE IMAGE PICKUP DEVICE - A solid-state image pickup device | 06-09-2011 |
| 20110122408 | SPECTRAL MODULE - The present invention provides a highly reliable spectral module. The spectral module ( | 05-26-2011 |
| 20110121192 | SCINTILLATOR, METHOD FOR MANUFACTURING SCINTILLATOR, AND RADIATION DETECTOR - A radiation detector is provided with a scintillator | 05-26-2011 |
| 20110116091 | SPECTRAL MODULE - In a spectral module | 05-19-2011 |
| 20110113828 | PROCESS FOR FUSING GLASS - When fusing glass members | 05-19-2011 |
| 20110098962 | SPECTROMETER, SPECTROMETRY, AND SPECTROMETRY PROGRAM - A spectroscopic measurement apparatus | 04-28-2011 |
| 20110095191 | RADIATION DETECTOR - In an X-ray line sensor | 04-28-2011 |
| 20110095174 | Charged-particle detector - This ion detector includes an MCP and a plurality of planar dynodes respectively having a plurality of slits. The plurality of planar dynodes are stacked via spacers parallel to an electron output plane of the MCP, and the first stage planar dynode is opposed parallel to the electron output plane. In accordance with this ion detector, it is possible to obtain output signals having the linearity reaching mV order, and to shorten its pulse width to approximately 600 ps. | 04-28-2011 |
| 20110089825 | PHOTOCATHODE - The present invention aims at providing a photocathode which can improve various characteristics. In a photocathode | 04-21-2011 |
| 20110088430 | FUSION-BONDING PROCESS FOR GLASS - When melting a glass layer | 04-21-2011 |
| 20110080545 | REFLECTION TYPE OPTICAL MODULATION DEVICE - A reflection type liquid crystal device (reflection type light modulation device) | 04-07-2011 |
| 20110075260 | GRATING DEVICE AND METHOD OF FABRICATING THE SAME - In a grating device ( | 03-31-2011 |
| 20110075143 | SPECTRAL MODULE AND METHOD FOR MANUFACTURING SPECTRAL MODULE - The present invention provides a highly reliable spectral module. When light L | 03-31-2011 |
| 20110075005 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device | 03-31-2011 |
| 20110073980 | LIGHT DETECTING APPARATUS - A light detecting apparatus is provided with a semiconductor substrate, a first electrode layer, and a second electrode layer. The semiconductor substrate has a first conductivity type first semiconductor region, and a second conductivity type second semiconductor region formed on the first semiconductor region and constituting a photodiode based on a pn junction formed between the first semiconductor region and the second semiconductor region. The first electrode layer is arranged above the second semiconductor region so as to be opposed to the second semiconductor region and is electrically connected to the second semiconductor region. The second electrode layer is arranged above the first electrode layer so as to be opposed to the first electrode layer and forms a capacitance component connected to the photodiode, between the first electrode layer and the second electrode layer. | 03-31-2011 |
| 20110072855 | GLASS FUSION METHOD - After a glass layer | 03-31-2011 |
| 20110067448 | FUSION-BONDING PROCESS FOR GLASS - A part of a glass layer | 03-24-2011 |
| 20110065165 | METHOD FOR CULTURING PLANKTONIC MICROALGAE - The present invention relates to a method for culturing planktonic microalgae, comprising: culturing planktonic microalgae with a culture substrate containing a visible light transmissive fiber with a hydrophilic surface, where a space diameter between the fibers is from 10 μm to 500 μm. | 03-17-2011 |
| 20110064662 | KIT FOR PRODUCING MOLECULAR PROBE FOR PET SCREENING FOR DRUG DISCOVERY - Disclosed is a kit for use in the production of a molecular probe for PET drug screening for the purpose of producing a compound containing a short-lived radionuclide for PET applications. Specifically disclosed is a kit comprising a compound represented by the formula (I), (II) or (III) or a salt thereof. In the formulae, X | 03-17-2011 |
| 20110064195 | SOLID-STATE IMAGE PICKUP APPARATUS AND X-RAY INSPECTION SYSTEM - A solid-state image pickup apparatus 1A includes a photodetecting section | 03-17-2011 |
| 20110064113 | LASER LIGHT SOURCE - A laser light source | 03-17-2011 |
| 20110063624 | BIOINSTRUMENTATION APPARATUS - A bioinstrumentation apparatus irradiates light onto a measured region of a subject, detects diffused light to acquire internal information on the measured region, and includes: a container holding a light transmitting medium; a light irradiation unit including a plurality of light emitting ends fixed to the container and irradiating a first light and a second light that mutually differ in wavelength onto the measured region that is immersed in the medium; a light detection unit including a plurality of light detecting ends fixed to the container and detecting the diffused light from the measured region; and a computing unit computing the internal information based on an output signal from the light detection unit; the wavelength of the first light being a wavelength at which an absorption coefficient of the measured region and a mean value of absorption coefficient of the medium are substantially equal, the wavelength of the second light being a wavelength at which the absorption coefficient of the measured region is greater than the mean value of the absorption coefficient of the medium, and the computing unit computing the internal information based on an output signal related to diffused light of the first light and computing boundary information between the measured region and the medium based on an output signal related to diffused light of the second light. | 03-17-2011 |
| 20110058655 | TARGET FOR X-RAY GENERATION, X-RAY GENERATOR, AND METHOD FOR PRODUCING TARGET FOR X-RAY GENERATION - A target for X-ray generation has a substrate and a target portion. The substrate is comprised of diamond and has a first principal surface and a second principal surface opposed to each other. A bottomed hole is formed from the first principal surface side in the substrate. The target portion is comprised of a metal deposited from a bottom surface of the hole toward the first principal surface. An entire side surface of the target portion is in close contact with an inside surface of the hole. | 03-10-2011 |
| 20110037149 | METHOD OF CUTTING A WAFER-LIKE OBJECT AND SEMICONDUCTOR CHIP - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed. | 02-17-2011 |
| 20110031377 | SOLID-STATE IMAGING DEVICE - A multi-port solid-state imaging device of one embodiment includes an imaging region and a plurality of units. The imaging region contains a plurality of pixel columns. The units are arrayed in a direction in which the pixel columns are arrayed, and generate signals based on charges from the imaging region. Each unit has an output register, a multiplication register, and an amplifier. The output register transfers a charge from one or more corresponding pixel columns. The multiplication register receives the charge from the output register to generate a multiplied charge. The amplifier generates a signal based on the multiplied charge from the multiplication register. The solid-state imaging device contains a region where the units are provided, and a first dummy region and a second dummy region located on both sides in the above-mentioned direction of the region. In each of the first dummy region and the second dummy region, a multiplication register and an amplifier are provided. | 02-10-2011 |
| 20110027972 | METHOD OF CUTTING A SUBSTRATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed. | 02-03-2011 |
| 20110027971 | METHOD OF CUTTING A SUBSTRATE, METHOD OF PROCESSING A WAFER-LIKE OBJECT, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed. | 02-03-2011 |
| 20110026556 | QUANTUM CASCADE LASER - A quantum cascade laser is configured to include a semiconductor substrate and an active layer which is provided on the substrate and has a cascade structure formed by multistage-laminating unit laminate structures | 02-03-2011 |
| 20110024855 | PHOTODETECTOR - An infrared detector ( | 02-03-2011 |
| 20110024721 | SEMICONDUCTOR LIGHT EMITTING DEVICE - A semiconductor light emitting device including a semiconductor substrate and an active layer which is formed on the substrate and has a cascade structure formed by multistage-laminating unit laminate structures | 02-03-2011 |
| 20110024607 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device | 02-03-2011 |
| 20110021004 | METHOD OF CUTTING A SUBSTRATE, METHOD OF CUTTING A WAFER-LIKE OBJECT, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed. | 01-27-2011 |
| 20110019795 | SOLID-STATE IMAGER AND X-RAY CT APPARATUS INCLUDING SAME - A solid-state imager has a structure for capturing a high-resolution image even if any of the read wiring and the column-selection wiring is disconnected. The solid-state imager ( | 01-27-2011 |
| 20110018419 | MICRO CHANNEL PLATE - An MCP has a rectangular plate shape and has a porous part, to which a plurality of pores (channels) penetrating in the thickness direction are disposed, and a poreless part including a solid glass or the like to which the channels are not provided on the both sides of the porous part. Then, on both surfaces of the MCP, an input side electrode and an output side electrode are respectively formed so as to cover the poreless parts on the both surfaces while sandwiching the porous part. | 01-27-2011 |
| 20110007768 | QUANTUM CASCADE LASER - A quantum cascade laser is configured so as to include a semiconductor substrate and an active layer which is provided on the substrate and has a cascade structure including multistage-laminated unit laminate structures | 01-13-2011 |
| 20110000897 | LASER WORKING METHOD, LASER WORKING APPARATUS, AND ITS MANUFACTURING METHOD - An object to be processed | 01-06-2011 |
| 20100328445 | MICROSCOPE SYSTEM - A microscope system is constructed by a light guiding optical system | 12-30-2010 |
| 20100327416 | Laser beam machining method, laser beam machining apparatus, and laser beam machining product - It is an object to provide a laser beam machining method which can easily cut a machining target. The laser beam machining method irradiates laser light while positioning a focus point at the inside of a machining target to thereby form a treated area based on multiphoton absorption along a planned cutting line of the machining target inside the machining target and also form a minute cavity at a predetermined position corresponding to the treated area in the machining target. | 12-30-2010 |
| 20100321675 | OBSERVATION DEVICE - An observation device | 12-23-2010 |
| 20100316185 | SOLID IMAGING DEVICE AND X-RAY CT DEVICE INCLUDING THE SOLID IMAGING DEVICE - The present invention relates to a solid-state imaging device, etc. having a structure for capturing a high-resolution image even when any row selecting wiring is disconnected. The solid-state imaging device ( | 12-16-2010 |
| 20100315634 | SPECTROMETER - In a state that the body portion | 12-16-2010 |
| 20100315633 | SPECTROSCOPY MODULE - Alignment marks | 12-16-2010 |
| 20100311313 | WORKING OBJECT GRINDING METHOD - A working object grinding method capable of grinding a working object reliably is provided. A working object | 12-09-2010 |
| 20100309479 | INTERFERENCE MEASURING DEVICE - An interference measuring device | 12-09-2010 |
| 20100309432 | EYEBALL MOTION MEASUREMENT APPARATUS - An eye movement measurement apparatus | 12-09-2010 |
| 20100295979 | SOLID-STATE IMAGING DEVICE - A solid-state imaging device | 11-25-2010 |
| 20100295976 | SOLID-STATE IMAGING DEVICE AND FRAME DATA CORRECTING METHOD - The present invention relates to a solid-state imaging device, etc., which makes it possible to obtain an image with higher resolution by properly correcting pixel data even when any one of row selecting wirings is disconnected. A solid-state imaging device ( | 11-25-2010 |
| 20100290107 | FIBER OPTICAL DEVICE AND METHOD OF DRIVING THE SAME - A fiber optical device | 11-18-2010 |
| 20100270277 | LASER MACHINING DEVICE AND LASER MACHINING METHOD - A laser machining device | 10-28-2010 |
| 20100258539 | MACHINING INFORMATION SUPPLY EQUIPMENT AND SUPPLY SYSTEM - A processing information supply apparatus 10 is prepared for a laser processing apparatus for forming a modified region, which becomes a starting point of cutting, along a line to cut within an object to be processed by irradiating the object with laser light while locating a light-converging point within the object. The processing information supply apparatus | 10-14-2010 |
| 20100253218 | PHOTOCATHODE, ELECTRON TUBE, AND PHOTOMULTIPLIER TUBE - In the photocathode, an underlayer made of a crystalline material containing La | 10-07-2010 |
| 20100249477 | Method of Rapid Methylation, Kit for Preparing PET Tracer and Method of Producing PET Tracer - It is intended to provide a method of rapid methylation of an aromatic compound or an alkenyl compound, which is capable of obtaining an aromatic compound or an alkenyl compound labeled with a methyl group or a fluoromethyl group under a mild condition rapidly in high yield using an organic boron compound whose toxicity is not so high as a substrate; a kit for preparing a PET tracer to be used in the same, and a method of producing a PET tracer using the same. In an aprotic polar solvent, methyl iodide or X—CH2F (wherein X is a functional group which can be easily released as an anion), an organic boron compound in which an aromatic ring or an alkenyl group is attached to boron are subjected to cross-coupling in the presence of a palladium(0) complex, a phosphine ligand, and a base. | 09-30-2010 |
| 20100246776 | X-RAY IMAGE ACQUIRING APPARATUS - The present invention relates to an X-ray image acquiring apparatus having a structure for improving the quality of an image signal representing an X-ray image captured. The X-ray image section ( | 09-30-2010 |
| 20100245646 | SOLID STATE IMAGING DEVICE - A solid state imaging device | 09-30-2010 |
| 20100243887 | MASS SPECTROMETER - A mass spectrometer that allows easy replacement of an MCP (microchannel plate) and is enabled to secure orthogonality between an incident surface of the MCP and an ion track at high accuracy is provided. A flight tube | 09-30-2010 |
| 20100240159 | MANUFACTURING METHOD OF SEMICONDUCTOR LASER ELEMENT - Starting point regions for cutting | 09-23-2010 |
| 20100227453 | LASER PROCESSING METHOD - A laser processing method which can securely prevent particles from attaching to chips obtained by cutting a planar object is provided. When applying a stress to an object to be processed | 09-09-2010 |
| 20100225221 | ELECTRON MULTIPLER AND ELECTRON DETECTOR - An electron multiplier that can easily obtain characteristics according to a purpose is provided. By bonding a marginal portion | 09-09-2010 |
| 20100220839 | IMAGING DEVICE - An intraoral sensor | 09-02-2010 |
| 20100220312 | BLOOD EXAMINATION APPARATUS - This blood examination apparatus examines cancer cells mixed in an examination object which is flowing blood, and includes: a flow cell through which the examination object is made to flow; an imaging optical system which light output from the examination object in an examination region in the flow cell enters, the imaging optical system forming an image of the light on a first image plane; a first Fourier transformation optical system which optically two-dimensionally Fourier-transforms the image formed on the first image plane by the imaging optical system to form the Fourier-transformed image on a second image plane; a spatial light filter which selectively allows a portion in a certain range around an optical axis of the first Fourier transformation optical system of the image formed on the second image plane by the first Fourier transformation optical system to pass through; and a second Fourier transformation optical system which optically two-dimensionally Fourier-transforms the portion which has passed through the spatial light filter of the image formed on the second image plane by the first Fourier transformation optical system to form the Fourier-transformed image on a third image plane. | 09-02-2010 |
| 20100219359 | SIGNAL WAVEFORM MEASURING APPARATUS AND MEASURING METHOD - A signal waveform measuring apparatus | 09-02-2010 |
| 20100215063 | PULSE LASER APPARATUS - The pulse laser light source | 08-26-2010 |
| 20100214563 | SPECTROSCOPIC MODULE - The spectroscopy module | 08-26-2010 |
| 20100214401 | FIBER OPTIC PLATE, AND PALM PRINT AND FINGER PRINT READING APPARATUS - [Object] To enable to obtain a clear output image when a palm print is taken. | 08-26-2010 |
| 20100213838 | PHOTOMULTIPLIER TUBE - Electrons are prevented from being made incident onto an insulation part between dynodes to improve a withstand voltage. The photomultiplier tube | 08-26-2010 |
| 20100213837 | PHOTOMULTIPLIER TUBE - Electrons are prevented from being made incident onto an insulation part of a casing between dynodes to improve a withstand voltage. The photomultiplier tube | 08-26-2010 |
| 20100208259 | SPECTROSCOPIC MODULE - The spectroscopy module | 08-19-2010 |
| 20100208258 | SPECTROSCOPE - The spectrometer | 08-19-2010 |
| 20100208257 | SPECTROSCOPIC MODULE - In the spectroscopy module | 08-19-2010 |
| 20100208113 | SOLID STATE IMAGING DEVICE - A solid state imaging device | 08-19-2010 |
| 20100203707 | SUBSTRATE DIVIDING METHOD - A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate | 08-12-2010 |
| 20100203678 | SEMICONDUCTOR SUBSTRATE CUTTING METHOD - A semiconductor substrate cutting method which can efficiently cut a semiconductor substrate having a front face formed with a functional device together with a die bonding resin layer is provided. | 08-12-2010 |
| 20100202479 | HEAT SINK, LASER APPARATUS PROVIDED WITH SUCH HEAT SINK, AND LASER STACK APPARATUS - A heat sink has a first flat plate, a partition plate, and a second flat plate. The first flat plate has an upper surface in which a first recess is formed. The second flat plate has a lower surface in which a second recess is formed, and an upper surface on which a semiconductor laser element is mounted. These recesses form a part of a refrigerant channel. The partition plate has a lower surface covering the first recess, an upper surface covering the second recess, and at least one through hole having the first recess communicated with the second recess. The first flat plate and the second flat plate both have a first coefficient of thermal expansion. The partition plate has a second coefficient of thermal expansion lower than the first coefficient of thermal expansion. | 08-12-2010 |
| 20100202041 | OBSERVING DEVICE AND METHOD - When a semiconductor device | 08-12-2010 |
| 20100201966 | BACK-ILLUMINATED DISTANCE MEASURING SENSOR AND DISTANCE MEASURING DEVICE - Two charge quantities (Q | 08-12-2010 |
| 20100200550 | LASER PROCESSING METHOD - A modified region | 08-12-2010 |
| 20100195110 | MEASUREMENT INSTRUMENT OF OPTICAL CHARACTERISTICS FOR SAMPLE FLOWING IN PASSAGE - An optical property measurement apparatus | 08-05-2010 |
| 20100194937 | SOLID STATE IMAGING DEVICE - A solid state imaging device | 08-05-2010 |
| 20100194621 | AD CONVERTER CIRCUIT AND OPTICAL SENSOR - The A/D converting circuit | 08-05-2010 |
| 20100194309 | CONTROLLER FOR DISCHARGE LAMP AND LIGHT SOURCE DEVICE - A control circuit for a discharge lamp, which can improve the lighting performance of the discharge lamp while realizing low power consumption, and a light source device are provided. The resistance value of the variable resistor (R | 08-05-2010 |
| 20100188728 | OPTICAL MODULE - An optical module | 07-29-2010 |
| 20100188564 | IMAGING DEVICE HOLDING STRUCTURE AND IMAGING DEVICE - A holding structure | 07-29-2010 |
| 20100188424 | IMAGE OUTPUTTING SYSTEM, IMAGE OUTPUTTING METHOD, AND IMAGE OUTPUTTING PROGRAM - The present invention is aimed at easily providing an image which is in focus at any position in the image to be an observation target of a user and is free from misalignment in the image in a virtual microscope or the like. | 07-29-2010 |
| 20100185187 | LIGHT IRRADIATION APPARATUS - The light irradiation device | 07-22-2010 |
| 20100184271 | LASER PROCESSING METHOD AND CHIP - An object to be processed can be cut highly accurately along a line to cut. | 07-22-2010 |
| 20100181912 | LIGHT SOURCE DEVICE, DISCHARGE LAMP AND ITS CONTROL METHOD - At an initial stage of a discharge start, a shield electrode is connected to a ground potential via a bidirectional voltage trigger switch. Thereafter, when an electrical charge within the shield electrode flows to the ground potential, by being triggered with this potential, both terminals of the bidirectional voltage trigger switch are disconnected therebetween. Thus, at an initial stage of discharge, charging of the shield electrode is suppressed to suppress a decline in discharge, and in a sustained discharge, destabilization due to an unwanted discharge from the shield electrode to the anode can be suppressed, and using such an electrode automatically allows improving the lighting performance of a discharge lamp. | 07-22-2010 |
| 20100178751 | LASER PROCESSING METHOD AND SEMICONDUCTOR CHIP - A laser processing method is provided, which, even when a substrate formed with a laminate part including a plurality of functional devices is thick, can cut the substrate and laminate part with a high precision. | 07-15-2010 |
| 20100176100 | LASER PROCESSING METHOD AND LASER PROCESSING APPARATUS - A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed. | 07-15-2010 |
| 20100172035 | SOLID IMMERSION LENS HOLDER - A solid immersion lens holder | 07-08-2010 |
| 20100163751 | SCINTILLATOR PANEL - Comprising a first step of supporting a substrate formed with a scintillator on at least three protrusions of a target-support element disposed on a vapor deposition table so as to keep a distance from said vapor deposition table; a second step of introducing said vapor deposition table having said substrate supported by said target-support element into a vapor deposition chamber of a CVD apparatus; and a third step of depositing an organic film by CVD method onto all surfaces of said substrate, provided with said scintillator, introduced into said vapor deposition chamber. | 07-01-2010 |
| 20100159496 | EVALUATION METHOD FOR PHOTOSYNTHESIS SAMPLE, EVALUATION SYSTEM FOR PHOTOSYNTHESIS SAMPLE, AND EVALUATION PROGRAM FOR PHOTOSYNTHESIS SAMPLE - An object of the present invention is to appropriately and easily evaluate a photosynthetic function of a photosynthetic sample contained in an evaluation sample. | 06-24-2010 |
| 20100156644 | RADIATION DETECTOR - A detecting unit ( | 06-24-2010 |
| 20100156263 | DEUTERIUM LAMP - The present invention relates to a deuterium lamp with a structure to enable high-accuracy positioning with respect to a mounting object such as an analyzer. The deuterium lamp comprises a sealed container in which a light-emitting portion to emit a discharge light in a predetermined direction is stored. The sealed container is constituted by a hollow body portion in which the light-emitting portion is stored and a hollow guide portion which guides a discharge light from the light-emitting portion to a light exit window provided at its front end. The deuterium lamp further comprises an axis adjusting member fixed to the hollow guide portion while storing at least a part of the hollow guide portion and a sealing layer for fixing the hollow guide portion and the axis adjusting member to each other. In particular, the sealing layer makes it possible to fix the axis adjusting member to the hollow guide portion with the center axis of the axis adjusting member being made coincident with the emitting direction of a discharge light. Thereby, even when misalignment has occurred between the center axis of the hollow guide portion and the emitting direction of a discharge light due to a manufacturing error in manufacturing of the container, since the axis adjusting member itself is directly fixed to the mounting object, it becomes possible to fix said deuterium lamp to an analyzer or the like with the optical axis aligned at a high accuracy. | 06-24-2010 |
| 20100151202 | Laser beam machining method, laser beam machining apparatus, and laser beam machining product - It is an object to provide a laser beam machining method which can easily cut a machining target. The laser beam machining method irradiates laser light while positioning a focus point at the inside of a machining target to thereby form a treated area based on multiphoton absorption along a planned cutting line of the machining target inside the machining target and also form a minute cavity at a predetermined position corresponding to the treated area in the machining target. | 06-17-2010 |
| 20100148667 | PHOTOCATHODE, ELECTRON TUBE, FIELD ASSIST TYPE PHOTOCATHODE, FIELD ASSIST TYPE PHOTOCATHODE ARRAY, AND FIELD ASSIST TYPE ELECTRON TUBE - When light is incident to an antenna layer AA | 06-17-2010 |
| 20100142886 | OPTICAL ELEMENT MODULE AND METHOD OF MANUFACTURING THE SAME - A method of manufacturing an optical element module | 06-10-2010 |
| 20100136766 | WORKING METHOD FOR CUTTING - An object to be processed is reliably cut along a line to cut. An object to be processed is irradiated with laser light while locating a converging point at the object, so as to form a modified region in the object along a line to cut. The object formed with the modified region is subjected to an etching process utilizing an etching liquid exhibiting a higher etching rate for the modified region than for an unmodified region, so as to etch the modified region. This can etch the object selectively and rapidly along the line to cut by utilizing a higher etching rate in the modified region. | 06-03-2010 |
| 20100119040 | RADIATION DETECTION DEVICE, RADIATION IMAGE ACQUIRING SYSTEM, AND METHOD FOR DETECTING RADIATION - An X-ray image acquiring system capable of improving the detection accuracy of a foreign substance contained in a subject is provided. An X-ray image acquiring system | 05-13-2010 |
| 20100119038 | RADIATION DETECTION DEVICE, RADIATION IMAGE ACQUIRING SYSTEM, RADIATION INSPECTION SYSTEM, AND RADIATION DETECTION METHOD - A radiation image acquiring system that improves the detection accuracy of a foreign substance etc., in a subject is provided. An X-ray image acquiring system | 05-13-2010 |
| 20100111127 | QUANTUM CASCADE LASER - A quantum cascade laser includes a semiconductor substrate, and an active layer which is provided on the semiconductor substrate, and has a cascade structure in which unit laminate structures | 05-06-2010 |
| 20100104248 | FIBER OPTIC - A fiber optic includes a plurality of fibers each including a core made of core glass for propagating light and a cladding for covering an outer periphery of the core and made of cladding glass lower in refractive index than the core glass and an absorber glass arranged between the plurality of fibers and for absorbing light leaking from the plurality of fibers. The plurality of fibers are bundled and integrated. The absorber glass contains Fe | 04-29-2010 |
| 20100103962 | LIGHT SOURCE DEVICE, OBSERVATION DEVICE, AND PROCESSING DEVICE - A light source device | 04-29-2010 |
| 20100103412 | SPECTROSCOPIC MODULE - Since a spectroscopic module ( | 04-29-2010 |
| 20100102721 | ELECTRON TUBE - An electron tube of the present invention includes: a vacuum vessel including a side tube portion made of glass and a plate-like member blocking one opening of the side tube portion and made of glass; a first metal film provided on an end face of the side tube portion; a second metal film arranged facing the first metal film and provided on a marginal part of a face at a vacuum side of the plate-like member; a third metal film provided on at least one of an outer wall face of the side tube portion adjacent to the end face and a side face of the plate-like member adjacent to the marginal part; and a metal member made of a low-melting-point metal, for sealing a gap between the side tube portion and the plate-like member while contacting the first metal film, the second metal film, and the third metal film. | 04-29-2010 |
| 20100102720 | ELECTRON TUBE - An electron tube of the present invention includes: a vacuum vessel including a face plate portion and a stem portion arranged facing the face plate portion; a photocathode arranged in the vacuum vessel and formed on the face plate portion; a projection portion arranged in the vacuum vessel, extending from the stem portion toward the face plate portion, and made of an insulating material; an electron detector arranged on the projection portion, made of a semiconductor, and having a first conductivity-type region and a second conductivity-type region; and a first conductive film covering a surface of the projection portion and to be electrically connected to the first conductivity-type region. | 04-29-2010 |
| 20100102701 | ELECTRON TUBE - An electron tube of the present invention includes: a vacuum vessel including a stem portion made of quartz and formed with an opening; a lid portion connected to the stem portion via a joining member made of aluminum so as to seal the opening, having a recess portion depressed to a vacuum side in the opening, and made of Kovar; a voltage applying section arranged in the vacuum vessel; and wiring for electrically connecting the voltage applying section and the lid portion. | 04-29-2010 |
| 20100102408 | ELECTRON TUBE - An electron tube of the present invention includes: a vacuum vessel including a face plate portion made of synthetic silica and having a surface on which a photoelectric surface is provided, a stem portion arranged facing the photoelectric surface and made of synthetic silica, and a side tube portion having one end connected to the face plate portion and the other end connected to the stem portion and made of synthetic silica; a projection portion arranged in the vacuum vessel, extending from the stem portion toward the photoelectric surface, and made of synthetic silica; and an electron detector arranged on the projection portion, for detecting electrons from the photoelectric surface, and made of silicon. | 04-29-2010 |
