HAESUNG DS CO., LTD
HAESUNG DS CO., LTD Patent applications | ||
Patent application number | Title | Published |
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20150266835 | BLEED-OUT PREVENTING AGENT, COMPOSITION FOR PREVENTING BLEED-OUT INCLUDING THE SAME, AND METHOD OF PREVENTING BLEED-OUT - Provided are a bleed-out preventing agent and a composition for preventing bleed-out including the same. | 09-24-2015 |
20150194323 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE SUBSTRATE MANUFACTURED USING THE SAME - A method of manufacturing a semiconductor package substrate has a simplified process and an upper and lower pattern alignment problem is solved. A semiconductor package substrate is manufactured by the method. The method of manufacturing a semiconductor package substrate includes forming a first groove in one surface of a base substrate of a conductive material, filling the first groove with resin, and etching another surface of the base substrate to expose the resin filling the first groove. | 07-09-2015 |