| H-Tech, LLC Patent applications |
| Patent application number | Title | Published |
|---|
| 20100046172 | ELECTRONICS PACKAGE INCLUDING HEAT SINK IN THE HOUSING AND RELATED METHODS - An electronics package may include a housing and electronic circuitry carried thereby. The housing may include a first metallic material having a first coefficient of thermal expansion (CTE) and having an array of openings therein. The electronics package may also include a thermally conductive body within each of the openings in the array thereof to thereby define a heat sink for the electronic circuitry. Each of the thermally conductive bodies may include a second metallic material having a second CTE substantially different from the first CTE. | 02-25-2010 |
| 20090211806 | ELECTRONIC ASSEMBLY INCLUDING RF FEEDTHROUGH CONNECTOR AND RELATED METHODS - An electronic assembly may include a housing having an opening therein and an RF feedthrough connector in the opening of the housing. The RE feedthrough connector may include a tubular body, and a plurality of displaceable protrusions carried by an upper outer surface portion of the tubular body. The plurality of displaceable protrusions may define an enlarged upper portion thereof engaging adjacent upper portions of the housing. The RF feedthrough connector may also include a sealed joint between the housing and the RF feedthrough connector. | 08-27-2009 |
