GUANGZHOU FANG BANG ELECTRONICS CO., LTD. Patent applications |
Patent application number | Title | Published |
20150201535 | ELECTROMAGNETIC WAVE SHIELDING FILM AND METHOD FOR PRODUCING A CIRCUIT BOARD COMPRISING THE SHIELDING FILM - The present invention discloses an electromagnetic wave shielding film, comprising at least one electromagnetic shielding layer. A printed circuit board comprising the shielding film, is formed by tightly connecting the electromagnetic wave shielding film with the printed circuit board in the direction of thickness, wherein a ground layer is disposed on said printed circuit board. A method for producing the circuit board, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the adhesive film layer by a rough surface of the electromagnetic shielding layer, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) piercing the shielding film by an electrically conductive substance, to achieve grounding. Or, including the following steps: (1) hot-pressing and curing the electromagnetic shielding film with the circuit board in the direction of thickness; (2) forming through holes or blind holes in the circuit board; (3) metallizing the holes, to achieve grounding. The adhesive film layer of the shielding film of the present invention contains no conductive particle, so that the cost and the insertion loss are reduced, and the development demand of high-speed and high-frequency of the electronic products is met. | 07-16-2015 |
20150030878 | ULTRATHIN SHIELDING FILM OF HIGH SHIELDING EFFECTIVENESS AND MANUFACTURING METHOD THEREOF - The present application provides an ultrathin shielding film of high shielding effectiveness, comprising two or more solid shielding layers. An electrically-conductive adhesive layer is coated onto the outer surface at one side of the solid shielding layers, and one or more insulation film layers are formed on the outer surface at the other side of the solid shielding layers. A carrier film layer is provided on the outer surface of the insulation film layers. A protective film covers the lower surface of the electrically-conductive adhesive layer. The present application further discloses a manufacturing method of an ultrathin shielding film of high shielding effectiveness. The present application has the following advantages: the two or more ultrathin complete solid shielding layers are provided, which are capable of repeatedly reflecting and adsorbing high-frequency interference signals, and meanwhile, excessive charges are conducted into a ground layer, so that the high shielding effectiveness is realized; tests show that, at a frequency over 300 MHz, the shielding effectiveness can reach 60 dB or more; meanwhile, the ultrathin solid shielding layer is capable of providing great bending performance, so that the requirements of an electronic product for lightness and thinness are met. | 01-29-2015 |