GUANGDONG SHENGYI SCI. TECH CO., LTD. Patent applications |
Patent application number | Title | Published |
20140107256 | THERMOSET RESIN COMPOSITION AND ITS USE - The present invention discloses a thermoset resin composition including epoxy resin other than brominated epoxy resin, styrene maleic anhydride copolymer and additive-type flame retardant. The thermoset resin composition also includes an active ester. The thermoset resin composition is used to prepare resin sheet, resin coated copper, prepreg, laminate, copper clad laminate and printed wiring board, and so on. Said thermoset resin composition remarkably reduces the probability of delamination for the PCB laminate, and overcomes drawback of the tetrabromobisphenol A to introduce dielectric properties which will deteriorate the system. The obtained resin composition has good thermal stability and moisture-heat resistance, low dielectric constant and dielectric loss angle tangent, and good flame resistance. | 04-17-2014 |
20140057094 | COMPOSITE MATERIAL, HIGH-FREQUENCY CIRCUIT BASEBOARD MADE THEREFROM AND PRODUCTION METHOD THEREOF - Disclosed is a composite material, a high-frequency circuit baseboard made therefrom and a production method thereof. The composite material comprises: a dispersed emulsion of fluoropolymer with a low dielectric loss; a porous, expanded polytetrafluoroethylene film; | 02-27-2014 |
20130295388 | EPOXY RESIN COMPOSITION AND COPPER CLAD LAMINATE MANUFACTURED BY USING SAME - The present invention relates to an epoxy resin composition and a copper clad laminate manufactured by using same. The epoxy resin composition comprises the following components and weight percentages thereof: epoxy resin 20-70%, curing agent 1-30%, accelerator 0-10%, fluororesin micropowder filler 1-60% and inorganic filler 0-60%, and further comprises a suitable amount of solvent. The copper clad laminate manufactured by using the epoxy resin composition comprises a prepreg and copper foils covering two sides of the prepreg, the prepreg comprising a reinforced material and the epoxy resin composition, which is adhered to the reinforced material after dipping and drying. The copper clad laminate manufactured by using the epoxy resin composition has excellent comprehensive performance, low water absorption, conductive anodic-filament resistance and good processability and meets requirements for processing an assembling of printed circuit boards. | 11-07-2013 |
20130284358 | Halogen-Free Resin Composition And Method For Fabricating Halogen-Free Copper Clad Laminate Using The Same - The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same. The halogen-free resin composition comprises the following components: reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000, a polybenzoxazine resin, a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, a filler, and a benzene or ketone solvent. The method for fabricating a halogen-free copper clad laminate comprises: Step 1: dissolving reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000 in a benzene or ketone solvent, adding a polybenzoxazine resin after dissolution, and mixing by stirring, to prepare a solution for use; Step 2: adding a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, and a filler to the solution for use, and stirring uniformly, to obtain a colloidal solution; Step 3: evenly coating the prepared colloidal solution to E-glass cloth with an even surface and baking, to produce a B-stage partially cured prepreg; and Step 4: cutting the B-stage partially cured prepreg into a suitable size according to the size of a compressor, precisely overlaying, placing a copper foil on and under the laminated B-stage partially cured Prepregs, and pressing in a vacuum hot pressing machine, to obtain a halogen-free copper clad laminate. | 10-31-2013 |
20110053447 | HALOGEN-FREE RESIN COMPOSITION WITH HIGH FREQUENCY DIELECTRIC PROPERTY, AND PREPREG AND LAMINATE MADE THEREFROM - The present invention relates to a halogen-free resin composition with high frequency dielectric property, and a prepreg and a laminate made therefrom. The halogen-free resin composition with high frequency dielectric property comprises, calculating according to the parts by weight of organic solids: (A) 10-50 parts by weight of copolymer of styrene-maleic anhydride; (B) 10-50 parts by weight of at least one compound having dihydrobenzoxazine ring; (C) 10-50 parts by weight of at least one polyepoxide; (D) 5-30 parts by weight of at least one phosphorus-containing flame retardant. Prepregs and laminates made from the resin composition have low dielectric constant, low dielectric dissipation factor, high glass transition temperature, high heat resistance, low moisture adsorption, and the technological operation is simple. | 03-03-2011 |
20100258340 | Composite material and high-frequency circuit substrate made therefrom - The invention relates to a composite material and a high-frequency circuit substrate made from the composite material. The composite material includes: a thermosetting composition in an amount of 20 to 70 by weight with respect to the composite material, a fiberglass cloth processed by coupling agent; a powder filler; a fire retardant and a cure initiator. The thermosetting composition includes a resin with molecular weight thereof being less than 11,000, and a low-molecular-weight solid allyl resin. The resin is composed of carbon and hydrogen element. More than 60 percent of the resin is vinyl. The high-frequency circuit substrate made from the composite material comprises: a plurality of prepregs mutually overlapped and copper foils respectively covered on both sides of overlapped prepregs, wherein each prepreg is made from the composite material. The composite material of the present invention realizes easy manufacture of the prepreg and high bonding of the copper foil. The high-frequency circuit substrate made from the composite material has low dielectric constant, low dielectric loss tangent, and excellent heat resistance, and is convenient for process operation. Therefore, the composite material is suitable for making the circuit substrate. | 10-14-2010 |