| GSI GROUP CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20120083049 | SYSTEM AND METHOD FOR LASER PROCESSING AT NON-CONSTANT VELOCITIES - A method is disclosed for on-the-fly processing at least one structure of a group of structures with a pulsed laser output, The method includes the steps of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity, and applying the pulsed laser output to the at least one structure of the group of structures during the step of relatively positioning the group of structures and the pulsed laser output axis with non-constant velocity. | 04-05-2012 |
| 20110297851 | LASER PROCESSING WITH ORIENTED SUB-ARRAYS - In a system for severing conductive links by laser irradiation to repair electronic devices, multiple laser beams are deflected at high-speed to target selected links for processing by positioning laser spots in a two dimensional pattern during relative motion of a substrate and a beam delivery system. As link targeting flexibility is increased, selection may be required from a large number of addressable link pairs. Various embodiments advantageously use beam deflection and beam splitting to improve memory repair processing rates. | 12-08-2011 |
| 20110218695 | POSITION ENCODER WITH PROGRAMMABLE TRIGGER OUTPUT SIGNAL - A position encoder provides one or more trigger outputs based on position signals developed within the encoder, in addition to traditional position output signals used by other system components such as a motion controller. The trigger outputs may be used directly by a triggered device, bypassing the motion controller and obviating any separate trigger generation electronics. The trigger output(s) can be fully synchronous with the encoder's position output signal(s) with essentially no latency or jitter, increasing accuracy and providing improved system performance. The trigger functionality can be incorporated in a variety of encoder types (e.g., absolute and incremental) and technologies (optical, magnetic, inductive etc.), and used in conjunction with different position output signal formats (e.g., quadrature, serial). | 09-08-2011 |
| 20110210105 | LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION - Link processing systems and methods use controlled two dimensional deflection of a beam along an optical axis trajectory to process links positioned along and transverse to the trajectory during a pass of the optical axis along the trajectory. Predictive position calculations allow link blowing accuracy during constant velocity and accelerating trajectories. | 09-01-2011 |
| 20110108534 | METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICES - A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector. | 05-12-2011 |
| 20110062127 | LASER-BASED METHOD AND SYSTEM FOR REMOVING ONE OR MORE TARGET LINK STRUCTURES - Laser-based methods and systems for removing one or more target link structures of a circuit fabricated on a substrate includes generating a pulsed laser output at a predetermined wavelength less than an absorption edge of the substrate are provided. The laser output includes at least one pulse having a pulse duration in the range of about 10 picoseconds to less than 1 nanosecond, the pulse duration being within a thermal laser processing range. The method also includes delivering and focusing the laser output onto the target link structure. The focused laser output has sufficient power density at a location within the target link structure to reduce the reflectivity of the target link structure and efficiently couple the focused laser output into the target link structure to remove the target link structure without damaging the substrate. | 03-17-2011 |
| 20100237051 | METHOD AND SYSTEM FOR LASER PROCESSING TARGETS OF DIFFERENT TYPES ON A WORKPIECE - A method and system for laser processing targets of different types on a workpiece are provided. The method includes setting a laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more set pulse widths based on a first type of target to be processed. The method further includes setting a pulse shape of the one or more output pulses to selectively provide the one or more output pulses having the set pulse shape based on the types of targets to be processed. The method still further includes delivering the one or more output pulses having the one or more set pulse widths and the set pulse shape to at least one target of the first type. The method finally includes resetting the laser pulse width of one or more laser pulses to selectively provide one or more laser output pulses having one or more reset pulse widths based on a second type of target to be processed. | 09-23-2010 |
| 20100140239 | METHOD AND SYSTEM FOR HIGH-SPEED, PRECISE MICROMACHINING AN ARRAY OF DEVICES - A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. Beam scanning and deflection are both used to distribute beam spots to elements of an array of elements for selective processing. The deflection can be performed with a solid state deflector. | 06-10-2010 |
| 20090321396 | Method And System For High-Speed Precise Laser Trimming And Scan Lens For Use Therein - A method, system and scan lens for use therein are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched laser or an ultra-fast laser may be used. Beam shaping optics may be used to generate a flat-top beam profile. Each laser pulse has a pulse energy, a laser wavelength within a range of laser wavelengths, and a pulse duration. The wavelength is short enough to produce desired short-wavelength benefits of small spot size, tight tolerance, high absorption and reduced or eliminated heat-affected zone (HAZ) along the trim path, but not so short so as to cause microcracking. In this way, resistance drift after the trimming process is reduced. | 12-31-2009 |
| 20090095722 | LINK PROCESSING WITH HIGH SPEED BEAM DEFLECTION - The present invention relates to the field of laser processing methods and systems, and specifically, to laser processing methods and systems for laser processing multi-material devices. Systems and methods may utilize high speed deflectors to improve processing energy window and/or improve processing speed. In some embodiments, a deflector is used for non-orthogonal scanning of beam spots. In some embodiment, a deflector is used to implement non-synchronous processing of target structures. | 04-16-2009 |
| 20080303474 | SYSTEMS AND METHODS FOR CONTROLLING LIMITED ROTATION MOTOR SYSTEMS - A control system is disclosed for controlling the movement of a limited rotation motor. The control system includes a computer system and a closed-loop motor controller. The computer system is for generating command digital data including digital input commands for controlling the movement of the limited rotation motor. The closed-loop motor controller includes an input circuit for receiving the command digital data synchronous with a data input signal, a digital control system for processing the command digital data, an output circuit for providing a motor drive signal to the limited rotation motor, and a feedback circuit for providing digital feedback data to said digital control processing circuit. The digital control processing circuit providing closed-loop motor control calculations on a computation cycle that is synchronous with the data input signal. | 12-11-2008 |
| 20080284837 | METHODS AND SYSTEMS FOR THERMA-BASED LASER PROCESSING A MULTI-MATERIAL DEVICE - A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or other structures formed on the substrate are provided. The method includes providing information based on a model of laser pulse interactions with the predetermined microstructure, the substrate and the other structures. At least one characteristic of at least one pulse is determined based on the information. A pulsed laser beam is generated including the at least one pulse. The method further includes irradiating the at least one pulse having the at least one determined characteristic into a spot on the predetermined microstructure. The at least one determined characteristic and other characteristics of the at least one pulse are sufficient to locally process the predetermined microstructure without causing the undesirable changes. | 11-20-2008 |
