| GOLDEN SUN NEWS TECHNIQUES CO., LTD. Patent applications |
| Patent application number | Title | Published |
|---|
| 20130118716 | HEAT SINK HAVING HEAT-DISSIPATING FINS CAPABLE OF INCREASING HEAT-DISSIPATING AREA - A heat sink having heat-dissipating fins capable of increasing heat-dissipating area-includes a heat pipe and the heat-dissipating fins. The heat pipe has a heat-absorbing section and a heat-releasing section. The heat-dissipating fin has a lower plate and an upper plate. The upper plate is bent to be overlapped on the lower plate, thereby forming a heat-dissipating path (b) therebetween. The lower plate and the upper plate are provided with a through-hole respectively in such a manner that these two through-holes correspond to each other. The heat-releasing section of the heat pipe penetrates the through-holes of the heat-dissipating fins successively. In this way, the heat-dissipating area in the same height can be increased, thereby improving the heat-dissipating efficiency of the heat sink. | 05-16-2013 |
| 20130098584 | HEAT CONDUCTING STRUCTURE WITH COPLANAR HEATED PORTION, MANUFACTURING METHOD THEREOF, AND HEAT SINK THEREWITH - A heat conducting structure, a heat sink with the heat conducting structure, and a manufacturing method of the heat conducting structure are disclosed. The manufacturing method includes the steps of providing a first mold ( | 04-25-2013 |
| 20130094201 | Heat Dissipating Structure Of LED Circuit Board And LED Lamp Tube Comprised Thereof - A heat dissipating structure of an LED circuit board includes an LED circuit board having a plurality of soldering points. The soldering points of the LED circuit board are covered by a coating layer including Nanoparticles and a bonding agent. The coating layer has the characteristics of high emitting rate, temperature resistance, and conductivity insulation. On the other hand, the coating layer can increase the contacting areas of the soldering points with the air to enlarge the heat dissipation area of the LED circuit board. The LED circuit board covered by the coating layer is placed in an LED lamp tube to provide good heat dissipation effect. | 04-18-2013 |
| 20110197596 | Heat-Dissipating Device For Supplying Cold Airflow - A heat-dissipating device ( | 08-18-2011 |
