GLOBALFOUNDERS Singapore Pte. Ltd.
GLOBALFOUNDERS Singapore Pte. Ltd. Patent applications | ||
Patent application number | Title | Published |
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20140264733 | DEVICE WITH INTEGRATED PASSIVE COMPONENT - Semiconductor devices and methods for forming a semiconductor device are presented. The semiconductor device includes a die which includes a die substrate having first and second major surfaces. The semiconductor device includes a passive component disposed below the second major surface of the die substrate. The passive component is electrically coupled to the die through through silicon via (TSV) contacts. | 09-18-2014 |