Genesis Photonics Inc.
|Genesis Photonics Inc. Patent applications|
|Patent application number||Title||Published|
|20130056776||PLATE - A plate including a substrate, a metal reflection layer and an oxidation protection layer is provided. The substrate has a first surface and a second surface opposite to the first surface. The metal reflection layer is disposed on the first surface of the substrate. The oxidation protection layer covers the metal reflection layer. The metal reflection layer is disposed between the oxidation protection layer and the first surface of the substrate. At least one light emitting diode chip is adapted to eutectic bonding on the plate.||03-07-2013|
|20130037796||Light-Emitting Device and Method for Manufacturing the Same - A light-emitting device includes a first cladding layer, a light-emitting layer, a second cladding layer, an epitaxial structure including an indium-containing oxide, and an electrode unit for supplying external electricity, The electrode unit includes a first electrode disposed to be electrically connected to the first cladding layer, and a second electrode disposed above the epitaxial structure to be electrically connected to the second cladding layer through the epitaxial structure such that the external electricity is permitted to be transmitted to the light-emitting layer through the first and second electrodes. A method for manufacturing the light-emitting device is also disclosed.||02-14-2013|
|20120205707||LIGHT-EMITTING DIODE PACKAGE - A light-emitting diode package includes: a frame unit, and at least one light-emitting diode chip including a chip body and a contact layer disposed between the chip body and the frame unit. One of the frame unit and the contact layer contains a magnetic material, and the other one of the frame unit and the contact layer contains a material capable of being magnetically attracted to the magnetic material.||08-16-2012|
|20120205703||Light-Emitting Diode Package Device and Method for Making the Same - A light-emitting diode package device includes: a base unit defining a packaging space; a light-emitting diode die that is disposed inside the packaging space to electrically connect to the base unit and that is capable of emitting light; and an encapsulant that is filled in the packaging space to encapsulate the light-emitting diode die and that includes an upper surface to be exposed to external environment, and a plurality of microstructures formed on the upper surface.||08-16-2012|
|20110139167||Nail Care Device - A nail care device includes a covering part, a light-emitting component, and a light-emitting control module. The covering part is configured for covering a tip of a digit of a limb. The light-emitting component is disposed in the covering part in a manner that light emitted by the light-emitting component irradiates a nail on the tip of the digit covered by the covering part. The light-emitting control module is coupled to the light-emitting component and is operable to control operation of the light-emitting component.||06-16-2011|
|20100165677||Electronic device having a circuit protection unit - An electronic device includes a circuit protection unit providing over-current protection to a main circuit and including a series connection of first and second current limiting circuits, and a normally-open branch circuit coupled in parallel to the first current limiting circuit and operable to conduct when a voltage across the first current limiting circuit reaches a first predetermined threshold voltage not greater than an endure voltage of the first current limiting circuit. Prior to conduction of the branch circuit, the first current limiting circuit maintains a current flowing therethrough at a first limit value when a current flowing through the main circuit reaches the first limit value. Upon conduction of the branch circuit, the second current limiting circuit maintains a current flowing therethrough at a second limit value greater than the first limit value when the current flowing through the main circuit reaches the second limit value.||07-01-2010|
Patent applications by Genesis Photonics Inc.