| GENERAL MEMS CORPORATION Patent applications |
| Patent application number | Title | Published |
|---|
| 20100303271 | SILICON MICROPHONE PACKAGE - A silicon microphone package is provided, including an integrated microphone die having opposing first and second surfaces, a first cover member formed over the first surface of the integrated microphone die to form a first chamber therebetween, and a second cover member formed over the second surface of the integrated microphone die to form a second chamber therebetween. | 12-02-2010 |
| 20100183181 | MINIATURE MEMS CONDENSER MICROPHONE PACKAGES AND FABRICATION METHOD THEREOF - MEMS microphone packages and fabrication methods thereof are disclosed. A MEMS microphone package includes a cavity that houses a MEMS sensing element, an IC chip and other passive elements supported by a common substrate. The cavity is formed by a top cover member, a housing wall surrounds and supports the top cover member and the common substrate supports the housing wall. A conductive casing encloses and surrounds the cavity, and is electrically connected to a common analog ground lead on a PCB board. The top cover member and the housing wall are non-conductive. And the conductive casing is not connected directly to the ground leads of the package. An acoustic absorption layer is sandwiched between the conductive casing and the cavity which is formed by the top cover member, the housing wall and the substrate. | 07-22-2010 |
| 20080212807 | Micromachined Acoustic Transducers - The present invention relates to an acoustic transducer that includes one or more capsules, side walls and a backing plate. Each capsule contains a cavity formed by the side walls and a plurality of film stacks. Each film stack has one or more membranes that can be a piezoelectric layer. Two or more of the film stacks that form the first cavity faces each other. A film stack and the backing plate face each other and form the wall of a second cavity. The transducers of this invention have a broadband response, can radiate sounds uni-directionally, and produce high quality sounds at low frequencies and at high intensities. They can be driven by AC signals. They can be fabricated using conventional integrated circuit manufacturing processes and therefore can be mass produced easily and inexpensively. | 09-04-2008 |
