| General Dynamics Advanced Information Systems Patent applications |
| Patent application number | Title | Published |
|---|
| 20120026705 | INTERPOSER LEAD - An interposer lead provides a connection between an integrated circuit and a circuit board. The interposer lead includes a first leg for interfacing with the circuit board. The interposer lead also includes a second leg disposed generally parallel to the first leg for interfacing with an IC electrical lead extending from the integrated circuit. A connecting portion operatively connects the first leg and the second leg. The interposer lead further includes a lip extending non-parallel from the second leg for limiting movement of the IC electrical lead on the second leg. | 02-02-2012 |
| 20110157855 | INTEGRATED CIRCUITS HAVING LEAD CONTACTS AND LEADLESS CONTACT PADS CONNECTED TO A SURFACE OF A PRINTED WIRING BOARD, AND METHODS FOR CONNECTING THE SAME - A method is provided for connecting an integrated circuit to a surface of a printed wiring board. The integrated circuit includes lead contacts and leadless contact pads. A first solder paste is applied to the leadless contact pads of the integrated circuit, and preformed conductive pieces are placed on the first solder paste. The preformed conductive pieces are slugs that have, for example, a cylindrical shape or a rectangular cross-section. The preformed conductive pieces are heated and brought into electrical contact with the leadless contact pads. The lead contacts are formed into gull wings. The bases of the preformed conductive pieces are generally aligned in a plane, and the bases of the gull wings are substantially coplanar with the plane such that they collectively generally define a contact plane. A second solder paste is applied on the surface, and the bases of the gull wings and the preformed conductive pieces are soldered to the second solder paste on the surface so that the integrated circuit is in electrical contact with the surface through both the leadless contact pads and the lead contacts. The preformed conductive pieces comprise a conductive material (e.g., a copper alloy) that has a higher melting point than the first solder paste and the second solder paste such that the preformed conductive pieces do not melt during heating or soldering that is described above. | 06-30-2011 |
| 20110110606 | System and method for rotating images - A system and method for rotating a source image by a first non-zero angle is provided. The method includes: defining a template for the source image, the template representing a rotation of the source image about an axis of the source image by second angle, where the second angle is the negative of the first non-zero angle; determining overlap between the template and the source image; separating the template into a plurality of strips covering at least the area of overlap; and for each strip: indentifying an initial pixel in the source image within the strip and storing the image data of the initial pixel; storing the image data of all remaining pixels within both the strip and the overlap in a database format in which the all remaining pixels is defined by a Y and X offset from the initial pixel. | 05-12-2011 |
| 20110101075 | Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards - A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface. | 05-05-2011 |
| 20100307815 | Spliced cable with overmolded water proof coating and method for making the same - A cable and corresponding method for making a cable are provided. The cable includes an outer jacket of polyethylene surrounding a plurality of conductive wires. Each one of the plurality of insulated conductive wires comprises a conductive core and an insulating layer surrounding the conductive core, the insulating layer being made of cross-linked polyethylene. | 12-09-2010 |
| 20100284073 | System and method for mounting a polarizer - A mounted polarizer and corresponding assembly method is provided. The mounted polarizer includes a substrate, and a polarizer with a plurality of parallel wires mounted on a supporting base. An epoxy binds the polarizer to the substrate, such that the plurality of parallel wires is mounted between the substrate and the supporting base, and the epoxy is in direct contact with the plurality of wires. The substrate, the epoxy and the supporting base all have a substantially matching refractive index. The mounted polarizer substantially transmits one polarization of light, and substantially blocks transmission of another polarization of light. | 11-11-2010 |
| 20090250506 | Apparatus and methods of attaching hybrid vlsi chips to printed wiring boards - A method for preparing an integrated circuit for connection to a surface, the integrated circuit including lead contacts and leadless contacts, is provided. The method includes providing the integrated circuit, applying a first solder paste to the leadless contacts, forming solder balls on the applied solder paste, heating the solder balls, thereby removing at least a portion of the first solder paste and bringing the solder balls into electrical contact with the leadless contacts, the base of the solder balls being generally aligned in a plane, and bending the lead contacts into gull wings, with the base of the gull wings being substantially coplanar with the plane. The base of the gull wings and the base of the at least one of the solder balls collectively generally define a contact plane for potential future contact with the surface. | 10-08-2009 |
| 20090022245 | Low latency analog QAM coherent demodulation algorithm - A digital demodulation method for a quadrature amplitude modulated signal uses a phase locked loop to generate a local carrier signal. The phase locked loop uses a feedback signal derived from one or more demodulated signals of interest. The loop has a filter characteristic with a stop band within the information bandwidth(s) of the information signal(s). The preferred method generates an error signal from DC components of in-phase and quadrature-phase baseband signals. DC components are preferably isolated using a low-latency, AC rejection filter. | 01-22-2009 |
