| Gebr. Schmid GmbH Patent applications |
| Patent application number | Title | Published |
|---|
| 20120118329 | METHOD AND DEVICE FOR CLEANING SUBSTRATES ON A CARRIER - In the case of a device and a method for cleaning substrates on a carrier, to the underside of which the substrates are fastened so as to be parallel to and slightly apart from one another, the carrier has in its interior a plurality of longitudinal channels, which run parallel to one another. As a result of the sawing of the wafers, they merge, via openings, into interstices between the substrates. As a result of a relative movement, an elongate tube, from which cleaning fluid is let out, is introduced into one of the longitudinal channels, the relative movement being achieved substantially through moving of the carrier. | 05-17-2012 |
| 20120097188 | Method and Apparatus for Treating Substrates - In the case of a method and an apparatus for treating substrates, resist layers are removed from the substrates by spraying with process solution. The substrates are sprayed with the process solution first in a main stripping module and then in a post-stripping module and the said process solution collects in containers under the modules. At least one container is respectively provided for each module. The process solution is collected in the main stripping module in two containers and first fed directly into a second container, which is largely separated from the first container by a wall, which is liquid-permeable in a region significantly below the surface level of the process solution. Process solution is taken from the first container without froth and returned once again into the cycle of the process for wetting the substrates. | 04-26-2012 |
| 20120064300 | Carrier for a Silicon Block and Method for Producing Such a Carrier and Arrangement - A silicon block is firmly connected to a carrier for being moved together for further working by sawing, cleaning or the like. The carrier consists of plastic, for example of glass-fibre-reinforced plastic, and has in its interior a number of continuous longitudinal channels. These longitudinal channels are sawn into, and so cleaning fluid can then be introduced into the intermediate space between the sawn-up wafers in order to flush out sawing remains. | 03-15-2012 |
| 20120034725 | METHOD FOR TEXTURING SILICON WAFERS, TREATMENT LIQUID THEREFOR, AND USE - In a method for the treatment of silicon wafers in the production of solar cells, a treatment liquid is applied to the surface of the silicon wafers for the purpose of texturization thereof. The treatment liquid contains, as additive, ethyl hexanol or cyclohexanol in an amount ranging from 0.5% to 3%, by weight. | 02-09-2012 |
