| Gebr. Schmid GmbH & Co. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110232751 | METHOD FOR MACHINING THE SURFACE OF A WAFER FOR PRODUCING A SOLAR CELL, AND WAFER - In a method for the treatment of the surface of a wafer for producing a solar cell, onto which wafer an antireflection and passivation layer has been applied onto a p-doped layer in a step preceding the method, the surface is treated in a processing step and then a subsequent metallization on the surface of the wafer for producing contacts for the solar cell takes place. This processing step is for passivation or for removal of the p-doped layer in the region of disturbances such as scratches, defect sites, pinholes and inhomogeneous regions in the antireflection and passivation layer. It is thus possible to avoid metal depositions at these disturbances. | 09-29-2011 |
| 20110209324 | METHOD FOR DETACHING WAFERS FROM A WAFER CARRIER AND DEVICE FOR THIS PURPOSE - In a method for detaching wafers from a carrier unit, the wafers being formed by sawing a wafer block fastened to the carrier unit by gluing, and the wafers themselves still being glued on one side, the carrier unit with the wafers is introduced into an ungluing unit along a uniform movement plane. It remains therein and is enclosed in an ungluing basin by movable wall parts. Solvent for ungluing is applied into the ungluing basin and onto the wafers after the formation and closing of the ungluing basin to dissolve the glued bond and subsequently detach the wafers from the carrier unit. | 09-01-2011 |
| 20110162709 | METHOD FOR THE TREATMENT OF SUBSTRATES, SUBSTRATE AND TREATMENT DEVICE FOR CARRYING OUT SAID METHOD - In a method for the treatment of substrates ( | 07-07-2011 |
| 20110124149 | METHOD AND DEVICE FOR COATING A CARRIER FOR THIN-FILM SOLAR CELLS | 05-26-2011 |
| 20110114168 | Method for the Selective Doping of Silicon and Silicon Substrate Treated Therewith - A method for the selective doping of silicon of a silicon substrate ( | 05-19-2011 |
| 20110070397 | METHOD FOR FASTENING A SILICON BLOCK ON A SUPPORT INTENDED THEREFOR AND CORRESPONDING ARRANGEMENT - In order to fasten a silicon block on a support for improved further handling, fibre material is introduced into an adhesive joint between the silicon block and the support. The fibre material is impregnated with adhesive and consists of glass fibres. The silicon block is then positioned on the support. The fibre material assures that the adhesive joint is not pressed together too far and is more stable. | 03-24-2011 |
| 20110008145 | METHOD OF, AND APPARATUS FOR, SEPARATING WAFERS FROM A WAFER STACK - In a method of separating wafers ( | 01-13-2011 |
| 20100311247 | Method and Device for Treating Silicon Wafers - A method and device for treating silicon wafers. In a first step, the silicon wafers ( | 12-09-2010 |
| 20100126829 | Holding Means, Device and Method for Transporting Substrates, in Particular Printed Circuit Boards - In order to transport printed circuit boards ( | 05-27-2010 |
| 20100012185 | Method for the Manufacture of a Solar Cell and the Resulting Solar Cell - In a method for the production of a solar cell, a flat aluminium layer is applied to the back of a solar cell substrate. The aluminium is alloyed into the silicon substrate by the effect of the temperature and forms an aluminium BSF. The remaining aluminium that has not been alloyed into the silicon is subsequently removed. The aluminium BSF is transparent to light. | 01-21-2010 |
| 20080311298 | Device, System and Method for Treating the Surfaces of Substrates - The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafers on a transport plane, which is determined by the transport rollers, and at least one conveyor device which wets the silicon wafer with an aqueous process medium. The conveyor device is arranged in such a manner below the transport plane that it touches the transport plane for wetting the substrate surface, which is oriented in the downward direction, with a process medium. The conveyor device is in direct contact with the substrate surface and is a roller with a larger diameter at its two ends for contacting the marginal areas at the underside of the silicon wafers for wetting them with the process medium. | 12-18-2008 |
| 20080295863 | METHOD AND DEVICE FOR PROCESSING OR TREATING SILICON MATERIAL - A method for processing or treating silicon material in carrying out a cleaning or purification process comprises the following steps: wetting bulk silicon material, facing a first direction with a first liquid process medium, automatic changing of an orientation of the bulk silicon material by turning bulk silicon material with a turning device and wetting the bulk silicon material in the altered orientation with the first liquid medium. After that, the bulk silicon material is cleaned in a corresponding cleaning device. | 12-04-2008 |
| 20080241378 | Device and Method for Treating the Surfaces of Substrates - The invention relates to a device for treating the surfaces of silicon wafers, comprising transport rollers for transporting the silicon wafer, and at least one conveyor device which wets the surface of the silicon wafer with an aqueous medium on a transport plane which is determined by the transport rollers. The conveyor device is configured such that it can apply the process medium to the surface of the silicon wafer, which is oriented in a downward manner and which is arranged on the transport plane. Several suction pipes for suctioning gaseous or mist-like distributed process mediums from the area surrounding the conveyor device are provided. The suction pipes are arranged in the vertical direction below the transport plane. | 10-02-2008 |
