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Future-Shape GmbH

Future-Shape GmbH Patent applications
Patent application numberTitlePublished
20110027520METHOD FOR PRODUCING A FLOOR COVERING SUBSTRATE AND METHOD FOR PRODUCING A SUBSTRATE LAYER FOR A FLOOR COVERING SUBSTRATE COMPRISING AT LEAST ONE ELECTRONIC CONSTRUCTION ELEMENT INTEGRATED THEREIN - A method for producing a floor covering substrate is provided, wherein at least one electronic device is embedded within a layer, which includes at least one curable material; wherein the at least one electronic device is embedded in a substrate layer and/or on a substrate layer; wherein the substrate layer, including the electronic device, is embedded in a layer, which includes at least one curable material; wherein the substrate layer that includes a porous or meshed structure or a reinforcement fabric, which is penetrable for the at least one curable material.02-03-2011