| FUJIMI, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110258938 | Aluminum oxide particle and polishing composition containing the same - Aluminum oxide particles are provided that include primary particles each having a hexahedral shape and an aspect ratio of 1 to 5. The aluminum oxide particles preferably have an average primary particle size of 0.01 to 0.6 μm. The aluminum oxide particles preferably have an alpha conversion rate of 5 to 70%. Further, the aluminum oxide particles preferably have an average secondary particle size of 0.01 to 2 μm, and the value obtained by dividing the 90% particle size of the aluminum oxide particles by the 10% particle size of the aluminum oxide particles is preferably 3 or less. The aluminum oxide particles are used, for example, as abrasive grains in the applications of polishing semiconductor device substrates, hard disk substrates, or display substrates. | 10-27-2011 |
| 20110217845 | Polishing Composition and Polishing Method Using The Same - A polishing composition is disclosed containing a nonionic active agent with a molecular weight of 1,000 or more and less than 100,000 and an HLB value of not less than 17, a basic compound, and water. The nonionic active agent is preferably an oxyalkylene homopolymer or a copolymer of different oxyalkylenes. The polishing composition may further contain at least one of silicon dioxide and a water-soluble polymer. The polishing composition is used, for example, in polishing the surface of semiconductor substrates such as silicon wafers. | 09-08-2011 |
