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FUJI ELECTRONIC CO., LTD.

FUJI ELECTRONIC CO., LTD. Patent applications
Patent application numberTitlePublished
20120074542SEMICONDUCTOR DEVICE - A semiconductor device, in which a control circuit board is mountable outside a sheath case and a power semiconductor element is placeable inside the sheath case, includes a metal step support, a shield plate and a metal ring. The support includes a base portion implanted in the sheath case, a connection portion which extends from an end of the base portion, and a step portion formed at a boundary between the base portion and the connection portion. The shield plate is disposed over the step portion such that the connection portion of the support pierces the shield plate. An end of the metal ring protrudes from an end of the connection portion over the shield plate. The semiconductor device is adapted such that the control circuit board is mounted over the protruded end of the metal ring and is fixed onto the connection portion by an engagement member.03-29-2012
20110306191METHOD OF MANUFACTURING SUPER-JUNCTION SEMICONDUCTOR DEVICE - A method of manufacturing a super-junction semiconductor device facilitates increasing the epitaxial growth rate without increasing the manufacturing steps greatly. In substitution for the formation of alignment mark in the surfaces of the second and subsequent non-doped epitaxial layers, patterning for forming a new alignment mark is conducted simultaneously with the resist pattering for selective ion-implantation into the second and subsequent non-doped epitaxial layers in order to form the new alignment mark at a position different from the position, at which the initial alignment mark is formed, and to form the new alignment mark in every one or more repeated epitaxial layer growth cycles.12-15-2011