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Fuchigami Micro Co., Ltd

Fuchigami Micro Co., Ltd Patent applications
Patent application numberTitlePublished
20120106084Heat Pipe, Method For Manufacturing A Heat Pipe, And A Circuit Board With A Heat Pipe Function - A heat pipe for cooling an exothermic body by the vaporization and condensation of an enclosed cooling medium is disclosed. The heat pipe comprises a flat plate-like upper plate, a flat plate-like lower plate opposed to the upper plate, and a plurality of flat plate-like intermediate plates overlaid on each other between the upper plate and the lower plate and having internal through-holes. The internal through-holes formed in each of a plurality of the intermediate plates are adapted such that only part of each through-hole is overlapped on each other to form capillary tube paths, each having a cross-sectional area smaller than the cross-sectional area of the through-hole in the flat surface direction.05-03-2012
20110214904Heat Sink, Cooling Module And Coolable Electronic Board - A heatsink is provided with a base body opposed to a heat generating body and absorbing heat from the heat generating body. Thermal resistance of that opposed portion of the base body which is opposed to the heat generating body is higher than thermal resistance of a surrounding portion surrounding the opposed portion.09-08-2011