FJ COMPOSITE MATERIALS CO., LTD.
Fuji-shi, Shizuoka, JP
|FJ COMPOSITE MATERIALS CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20100059271||Electronic Component Storing Package and Electronic Apparatus - An electronic component storing package which generates a large quantity of heat during operation and an electronic apparatus storing such an electronic component are provided. In the electronic component storing package and the electronic apparatus, a heat dissipating member (||03-11-2010|
|20080277047||FRP HONEYCOMB STRUCTURE AND METHOD FOR MANUFACTURING THE SAME - The present invention provides an FRP honeycomb structure which is used as a base structure material for various base structures and which offers appropriate rigidity and compression strength while reducing the weight of the entire structure. The present invention provides an FRP honeycomb structure HA formed by assembling together a plurality of FRP core units CU having the same cross sectional shape so that outer sides of the units are abutted against one another, and hardening the assembled FRP core units CU using a resin material, as well as a method for manufacturing an FRP honeycomb structure HA, the method comprising a core unit forming step of constructing an FRP braid layer||11-13-2008|
Patent applications by FJ COMPOSITE MATERIALS CO., LTD.