| FICO B.V. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110197727 | Device and Method for Sawing Electronic Components - The invention relates to a device for separating electronic components, provided with: sawing means and positioning means, wherein between the positioning means and the sawing means at least one transfer position is defined for the purpose of transferring positioned electronic components. The invention further comprises a separating device for electronic components, provided with: sawing means, inspection means, and sorting means, wherein between the inspection means and the sorting means at least one transfer position is defined for the purpose of transferring separated electronic components. Finally, the invention also relates to a method for separating electronic components. | 08-18-2011 |
| 20110113645 | Device and Method for Drying Separated Electronic Components - The invention relates to a device for at least partially drying separated electronic components comprising: a carrier for the electronic components; a moisture-absorbing material; and a holder covered with the moisture-absorbing material, wherein the holder and the carrier are displaceable relative to each other such that the electronic components for drying can be brought into contact with the moisture-absorbing material. | 05-19-2011 |
| 20100230855 | Plunger, Encapsulating Device And Method For Sealing A Fitting Of A Plunger On A Plunger Housing - The invention relates to a plunger for feeding encapsulating material to a mould cavity, comprising at least one peripheral groove recessed into the cylinder casing of the plunger whereby a material part is placed in the groove which only partly fills the groove. The invention also related to a device for encapsulating electronic components mounted on a carrier. In addition, the invention also relates to a method for sealing a fitting of a plunger housing, which plunger is adapted to feed encapsulating material under pressure to a mould cavity. | 09-16-2010 |
| 20100159672 | METHOD AND DEVICE FOR CLEANING ELECTRONIC COMPONENTS PROCESSED WITH A LASER BEAM - The present invention relates to a method for processing with a laser beam and cleaning electronic components, wherein at least one new boundary surface is formed on an electronic component with the laser beam. The invention also relates to a device for processing and cleaning electronic components, comprising at least: a laser source for generating a laser beam, and at least one carrier for supporting an assembly of unseparated electronic components, wherein the carrier and the laser beam are displaceable relative to each other. | 06-24-2010 |
| 20090115098 | Mould Part and Method for Encapsulating Electronic Components - The invention relates to a mould part for applying in a device for encapsulating electronic components mounted on a carrier, comprising: at least one mould cavity recessed into a contact side, a contact surface at least partially enclosing the mould cavity for medium-tight connection to the carrier of the electronic component, a feed channel for encapsulating material recessed into the contact surface and connecting to the mould cavity, a first outlet channel for gas, and an extraction space recessed into the contact surface. The invention also relates to a device for encapsulating electronic components mounted on a carrier and to a method for encapsulating electronic components mounted on a carrier. | 05-07-2009 |
| 20080277825 | Method and Device for Controllable Encapsulation of Electronic Components - The invention relates to a method for encapsulating electronic components mounted on a carrier, comprising the processing steps of: A) heating encapsulating material, B) displacing the encapsulating material to a mould cavity, C) filling the mould cavity, and D) curing the encapsulating material in the mould cavity. The temperature regulation of the encapsulating material takes place during separate sections of the path covered by the encapsulating material by creating different temperature zones at least partially separated from each other thermally by means of at least one temperature carrier. The invention also relates to a device for encapsulating electronic components mounted on a carrier. | 11-13-2008 |
