FARADAY TECHNOLOGY, INC.
|FARADAY TECHNOLOGY, INC. Patent applications|
|Patent application number||Title||Published|
|20150114847||ELECTROCHEMICAL SYSTEM AND METHOD FOR ELECTROPOLISHING HOLLOW METAL BODIES - A method and system for electrochemically machining a hollow body of a metal or a metal alloy. An electrode is positioned within a hollow body including a metal or metal alloy, where the hollow body has a variable internal diameter. The hollow body is oriented vertically, with the electrode oriented vertically therein. The hollow body is at least partially filled with an aqueous, acidic electrolyte solution, the electrolyte solution being devoid of hydrofluoric acid and having a viscosity less than 15 cP. An electric current is passed between the hollow body and the electrode, where the electric current includes a plurality of anodic pulses and a plurality of cathodic pulses, and where the cathodic pulses are interposed between at least some of the anodic pulses.||04-30-2015|
|20140018244||ELECTROCHEMICAL SYSTEM AND METHOD FOR ELECTROPOLISHING SUPERCONDUCTIVE RADIO FREQUENCY CAVITIES - An electrochemical finishing system for super conducting radio frequency (SCRF) cavities including a low viscosity electrolyte solution that is free of hydrofluoric acid, an electrode in contact with the electrolyte solution, the SCRF cavity being spaced apart from the electrode and in contact with the electrolyte solution and a power source including a first electrical lead electrically coupled to the electrode and a second electrical lead electrically coupled to the cavity, the power source being configured to pass an electric current between the electrode and the workpiece, wherein the electric current includes anodic pulses and cathodic pulses, and wherein the cathodic pulses are interposed between at least some of the anodic pulses. The SCRF cavity may be vertically oriented during the finishing process.||01-16-2014|
|20130220819||ELECTRODEPOSITION OF CHROMIUM FROM TRIVALENT CHROMIUM USING MODULATED ELECTRIC FIELDS - A layer of chromium metal is electroplated from trivalent chromium onto an electrically conducting substrate by immersing the substrate and a counter electrode in a electroplating bath and passing a modulated electric current between the electrodes. In one embodiment, the current contains pulses that are cathodic with respect to said substrate and in another embodiment the current contains pulses that are cathodic and pulses that are anodic with respect to said substrate. The cathodic pulses have a duty cycle greater than about 80%.||08-29-2013|
|20120091002||ELECTROLYTIC SYSTEM AND METHOD FOR CONCENTRATING AN AQUEOUS PARTICULATE SUSPENSON - An electrolytic method and apparatus for the concentration and collection of suspended particulates from solutions is disclosed. In one embodiment, the solution is an aqueous solution and the suspended particles are algae particles. The electrolytic cell contains at least an anode and a cathode, and in one embodiment contains a plurality of anodes and cathodes. While not bound by theory, the electrolytic method and apparatus is based on the electrophoretic movement of algae particles suspended in an aqueous solution under the influence of an electric field. In one embodiment the electric field is a pulsed wavefrom with unidirectional voltage or current pulses. In another embodiment, the electric field is a pulsed waveform with bidirectional voltage or current pulses.||04-19-2012|
|20120091000||ELECTROLYTIC SYSTEM AND METHOD FOR FILTERING AN AQUEOUS PARTICULATE SUSPENSION - An electrolytic filtration method and apparatus for the concentration and collection of suspended particulates from aqueous solutions is disclosed. The electrolytic cell contains at least an anode and a cathode, and in one embodiment contains a plurality of anodes and cathodes. The electrolytic cell also contains a filter, and in one embodiment the filter is a moving belt filter. While not bound by theory, the electrolytic filtration method and apparatus is based on the electrophoretic movement of algae particles suspended in an aqueous solution away from the filter under the influence of an electric field. In one embodiment the electric field is a pulsed waveform with unidirectional voltage or current pulses. In another embodiment, the electric field is a pulsed waveform with bidirectional voltage or current pulses.||04-19-2012|
|20110017608||ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATES - A method for electrochemically etching a metal layer through an etch-resist layer pattern using a non-active electrolyte solution is described. The method is particularly useful in fabrication of advanced fuel delivery systems for land-based power generation turbines and aerospace turbine engines; of components for advanced thermal management in aerospace electronic devices and in cooling channels; of stents used in medicine; and of microchannels for sensors, chemical reactors, and dialysis and the like. In one embodiment of the invention the metal layer is copper and the non-active electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching.||01-27-2011|
|20090205953||ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DEPOSITION ACROSS A WORKPIECE DURING PLATING - An apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes.||08-20-2009|
Patent applications by FARADAY TECHNOLOGY, INC.