| FARADAY TECHNOLOGY, INC. Patent applications |
| Patent application number | Title | Published |
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| 20120091002 | ELECTROLYTIC SYSTEM AND METHOD FOR CONCENTRATING AN AQUEOUS PARTICULATE SUSPENSON - An electrolytic method and apparatus for the concentration and collection of suspended particulates from solutions is disclosed. In one embodiment, the solution is an aqueous solution and the suspended particles are algae particles. The electrolytic cell contains at least an anode and a cathode, and in one embodiment contains a plurality of anodes and cathodes. While not bound by theory, the electrolytic method and apparatus is based on the electrophoretic movement of algae particles suspended in an aqueous solution under the influence of an electric field. In one embodiment the electric field is a pulsed wavefrom with unidirectional voltage or current pulses. In another embodiment, the electric field is a pulsed waveform with bidirectional voltage or current pulses. | 04-19-2012 |
| 20120091000 | ELECTROLYTIC SYSTEM AND METHOD FOR FILTERING AN AQUEOUS PARTICULATE SUSPENSION - An electrolytic filtration method and apparatus for the concentration and collection of suspended particulates from aqueous solutions is disclosed. The electrolytic cell contains at least an anode and a cathode, and in one embodiment contains a plurality of anodes and cathodes. The electrolytic cell also contains a filter, and in one embodiment the filter is a moving belt filter. While not bound by theory, the electrolytic filtration method and apparatus is based on the electrophoretic movement of algae particles suspended in an aqueous solution away from the filter under the influence of an electric field. In one embodiment the electric field is a pulsed waveform with unidirectional voltage or current pulses. In another embodiment, the electric field is a pulsed waveform with bidirectional voltage or current pulses. | 04-19-2012 |
| 20110017608 | ELECTROCHEMICAL ETCHING AND POLISHING OF CONDUCTIVE SUBSTRATES - A method for electrochemically etching a metal layer through an etch-resist layer pattern using a non-active electrolyte solution is described. The method is particularly useful in fabrication of advanced fuel delivery systems for land-based power generation turbines and aerospace turbine engines; of components for advanced thermal management in aerospace electronic devices and in cooling channels; of stents used in medicine; and of microchannels for sensors, chemical reactors, and dialysis and the like. In one embodiment of the invention the metal layer is copper and the non-active electrolyte solution is a mixture of sodium nitrate and sodium chloride and a pulse electric current is employed to accomplish the electrochemical etching. | 01-27-2011 |
| 20090205953 | ELECTROPLATING CELL WITH HYDRODYNAMICS FACILITATING MORE UNIFORM DEPOSITION ACROSS A WORKPIECE DURING PLATING - An apparatus for establishing more uniform deposition across one or more faces of a workpiece in an electroplating process. The apparatus employs eductors in conjunction with a flow dampener member and other measures to provide a more uniform current distribution and a more uniform metal deposit distribution as reflected in a coefficient of variability that is lower than conventional processes. | 08-20-2009 |
