| EXAX INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20100263917 | Preparing Method for Printed Circuit Boards by Directing Printing and Printed Circuit Boards Prepared by the Method - A method of preparing printed circuit boards (PCB) or flexible printed circuit boards (FPCB) by direct printing includes: 1) a step of printing a pattern on substrate with a paste composition including conductive particles, polyamic acid as binder and solvent; 2) a step of baking the printed substrate to imidize the polyamic acid; and 3) a step of electro-plating the printed substrate. Printed circuit boards (PCB) or flexible printed circuit boards (FPCB) are produced by applying an addition method of direct printing while to simplify processes, to save time and cost, and to minimize waste. | 10-21-2010 |
| 20100133484 | Paste Composition for Forming Heat-Resistant Conductive Patterns on Substrate - A paste composition for forming heat-resistant and electrically conductive patterns on substrate by direct printing includes conductive particles, polyamic acid, and solvent. The paste composition can form solderable electric circuits or solderable antenna on substrate, especially on flexible sheets by direct printing to simplify processes, to save time and cost, and to minimize waste. | 06-03-2010 |
| 20090090273 | Silver Organo-Sol Ink for Forming Electrically Conductive Patterns - The present invention relates to solution type silver organo-sol ink for forming electrically conductive patterns. The present invention provides silver organo-sol ink of solution type for forming electrically conductive pattern comprising effective amount of silver CO to C16 aliphatic carboxylate saturated or unsaturated, linear or branched, unsubstituted or substituted with amino, nitro and/or hydroxy group(s) having 1 to 3 carboxyl groups or silver aromatic carboxylate; and organic solvent. By the present invention, silver organo-sol inks of solution type basically having higher content of silver for various reducing or metallizing temperatures are obtained. The solution type ink of the present invention can be used for forming conductive patterns in flat panel display such as plasma display panel(PDP) to reduce the numbers of steps for pattern forming. Some of the solution type ink of the present invention can be used for forming conductive patterns on a milder substrate such as thermoset plastic at a lower reducing temperature. | 04-09-2009 |
