EVIGIA SYSTEMS, INC.
|EVIGIA SYSTEMS, INC. Patent applications|
|Patent application number||Title||Published|
|20110203347||SENSING MODULES AND METHODS OF USING - A sensing module and method for monitoring various physical parameters, and particularly environmental parameters to which a living body may be subjected, for example, impacts and shock wave pulses. The module at least one energy storage device and at least one set of electromechanical sensing elements contained in a housing. The sensing elements are responsive to an external environmental input, and each sensing element defines an open electrical path when not subjected to the input, is operable to define a closed electrical path that produces an output in response to the input if the input exceeds a threshold of the sensing element. The module generates data corresponding to the outputs of the sensing elements and records the data.||08-25-2011|
|20110009773||IMPLANTABLE SENSING MODULES AND METHODS OF USING - Implantable sensing modules and methods for monitoring various physical parameters, including physical parameters of a living body and environmental parameters to which the living body may be subjected, for example, impacts. A method for monitoring impacts to which a living body is subjected entails the use of an implantable sensing module that has a rigid housing containing at least one energy storage device and at least one electromechanical sensing element that is responsive to impacts. The module generates data corresponding to impacts to which the electromechanical sensing element is subjected, and records the data in memory. The module is preferably implanted in a living body so that the module is connected to a rigid portion of the living body, in particular, a bone or tooth.||01-13-2011|
|20100072555||WAFER BONDING METHOD AND WAFER STACK FORMED THEREBY - A wafer bonding process that compensates for curvatures in wafer surfaces, and a wafer stack produced by the bonding process. The process entails forming a groove in a surface of a first wafer, depositing a bonding stack on a surface of a second wafer, aligning and mating the first and second wafers so that the bonding stack on the second wafer contacts a bonding site on the first wafer, and then heating the first and second wafers to reflow the bonding stack. The groove either surrounds the bonding site or lies entirely within the bonding site, and the heating step forms a molten bonding material, causes at least a portion of the molten bonding material to flow into the groove, and forms a bonding structure that bonds the second wafer to the first wafer. Bonding stacks having different lateral surface areas can be deposited to form bonding structures of different heights to compensate for variations in the wafer gap.||03-25-2010|
|20100040113||METHOD AND SYSTEM FOR MONITORING ENVIRONMENTAL CONDITIONS - A sensing system, sensing method, and method of producing a sensing system capable of providing a cumulative measurement capability, such as in the form of a RFID tag capable of measuring cumulative heat and humidity for continuous monitoring of storage and shipping conditions of various goods. The system includes integrated circuitry and a plurality of sensing elements, preferably having cantilevered bimorph beams. Each sensing element is responsive to an environmental condition so as to deflect toward and away from open contacts in response to changes in the environmental condition. Each sensing element produces a digital output when it contacts and closes its open contacts. The integrated circuitry interfaces with the sensing elements so that the digital outputs of the sensing elements are processed to generate a system output of the sensing system.||02-18-2010|
|20090140356||INTEGRATED SENSOR AND CIRCUITRY AND PROCESS THEREFOR - A micromachined sensor having a capacitive sensing structure. The sensor includes a first substrate with first and second conductive layers separated by a buried insulator layer, and a member defined by the first and second conductive layers and the buried insulator layer. A first set of elements defined with the first conductive layer is connected to the member and includes first and second elements that are electrically isolated from each other by the buried insulator layer. A second set of elements is defined with the first conductive layer and capacitively coupled with the first set of elements. A second substrate is bonded to the first substrate so that the member and the first set of elements are movably supported above the second substrate. The second set of elements is anchored to the second substrate, and the first and second sets of elements are physically interconnected through the second substrate.||06-04-2009|
|20090064782||SENSOR AND SENSING METHOD UTILIZING SYMMETRICAL DIFFERENTIAL READOUT - A sensor and sensing method capable of full-differential symmetry to minimize bias drift and improve stability of the sensor output. The sensor includes a sensing element, sense electrodes capacitively coupled to the sensing element to generate capacitive outputs that vary in response to the motion of the sensing element, and a differential readout device. The sense electrodes are electrically separable into at least two pairs of differential sense electrodes. The readout device performs a sampling sequence of at least two sampling cycles during which the readout device samples the capacitive outputs of the sense electrodes and produces at least two differential outputs based on the difference between the capacitive outputs within each pair of differential sense electrodes. The readout device then calculates an average of the differential outputs of the sampling sequence to produce an output of the differential readout device, and thereafter repeats the sampling sequence and calculation.||03-12-2009|
|20090056108||BIMORPHIC STRUCTURES, SENSOR STRUCTURES FORMED THEREWITH, AND METHODS THEREFOR - A bimorphic structure responsive to changes in an environmental condition, sensor structures incorporating one or more of such bimorphic structures, and a method of forming such bimorphic structures. The sensor structure has an electrically-conductive first contact on a substrate, and a bimorph beam anchored to the substrate so that a portion thereof is suspended above the first contact. The bimorph beam has a multilayer structure that includes first and second layers, with the second layer between the first layer and the substrate. A portion of the first layer projects through an opening in the second layer toward the first contact so as to define an electrically-conductive second contact located on the beam so as to be spaced apart and aligned with the first contact for contact with the first contact when the beam sufficiently deflects toward the substrate.||03-05-2009|
Patent applications by EVIGIA SYSTEMS, INC.