| EVERLIGHT ELECTRONICS CO., LTD. Patent applications |
| Patent application number | Title | Published |
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| 20130045655 | White-Light Emitting Device And Preparation Method And Application Of The Same - A white-light emitting device and its preparation method are provided. The white-light emitting device comprises an ultraviolet (UV) light emitting diode (LED) chip, a first phosphor, and a second phosphor, wherein the UV LED chip generates a first radiation; the first phosphor is composed of Zn(C | 02-21-2013 |
| 20130033167 | Phosphor Composition And White Light Emitting Device Using The Same - A phosphor composition and a white light emitting device using the same are disclosed. The white light emitting device includes a blue light emitting diode and a phosphor composition disposed on the blue light emitting diode, wherein the phosphor composition includes a yellow lanthanum silicon nitride, a yellow β-SiAlON and a red CaAlSiN, and the weight proportion of the yellow lanthanum silicon nitride, the yellow β-SiAlON and the red CaAlSiN is 1:1:0.3˜0.45. | 02-07-2013 |
| 20130032850 | Light-Emitting Diode Mounted On Transparent Conductive Layers And Manufacturing Method Thereof - A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is formed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so that the LED chip is electrically connected to the metal circuit. | 02-07-2013 |
| 20120326202 | Photoelectric Transmitting Or Receiving Device And Manufacturing Method Thereof - A photoelectric transmitting or receiving device comprises a substrate, a first conductive layer, a second conductive layer and a photoelectric transducing chip. The substrate has an upper surface and a recess and is made of a composite material. The first conductive layer and the second conductive layer are formed by using laser to activate the composite material of the substrate. The first conductive layer is disposed on the bottom surface of the recess, and is extended outwardly along the inner lateral wall of the recess and the upper surface of the substrate. The second conductive layer is electrically insulated from the first conductive layer and is extended outwardly along the upper surface of the substrate. The photoelectric transducing chip is disposed on the bottom surface of the recess and electrically connected to the first conductive layer and to the second conductive layer, respectively. | 12-27-2012 |
| 20120314422 | Light Emitting Diode Bulb - A light emitting diode bulb comprises a heat sink, an insulator cover, a light emitting device package, a plurality of conductive terminals, a driving circuit, a holder, a metal screw thread, and an electrode. The light emitting device package, disposed between the insulator cover and heat sink, is covered by the insulator cover which exposes a portion of the light emitting device package. The conductive terminals are connected with the insulator cover and extend outwardly to be connected with the light emitting device package. The driving circuit converts an AC signal into a DC signal and includes upper conductive rods and lower conductive rods. The conductive rods are connected with the conductive terminals. The holder is connected with the metal screw thread and heat sink. The metal screw thread is connected electrically to one of the lower conductive rods. The electrode is connected electrically to the other lower conductive rods. | 12-13-2012 |
| 20120305975 | Dissipation Module For A Light Emitting Device And Light Emitting Diode Device Having The Same - A light emitting diode device is provided. The light emitting diode device comprises a composite substrate and a light emitting diode disposed on the composite substrate. The composite substrate comprises a first carbon fiber composite layer which is able to conduct heat rapidly in the direction of carbon fiber, such that the heat generated from the light emitting diode module can be dissipated rapidly. | 12-06-2012 |
| 20120305967 | Flip Chip Type Light Emitting Diode and Manufacturing Method Thereof - The present disclosure provides a flip chip type light emitting diode which comprises a substrate and a light emitting diode chip. The substrate comprises a body, a plurality of third pads, a fourth pad, a first electrode, a second electrode, a plurality of first vias, and a second via. The body has a first surface and a second surface opposite to the first surface. The third pads and the fourth pad are disposed on the first surface of the body. The first electrode and the second electrode are disposed on the second surface of the body. The first vias traverse through the body and are each electrically coupled to a respective one of the third pads and the first electrode. The second via traverses through the body and is electrically coupled to the fourth pad and the second electrode. | 12-06-2012 |
| 20120305771 | Proximity Sensor Packaging Structure And Manufacturing Method Thereof - The present invention pertains to a proximity sensor packaging structure, which comprises a substrate, two first electrically conductive layers and a plurality of second electrically conductive layers that are disposed on the substrate. The substrate has first and second grooves that are respectively defined by a bottom surface and an interior sidewall. Each electrically conductive layer extends from a bottom surface of the first groove, along the interior sidewall of the first groove and in an opposite direction relative to the other first electrically conductive layer, to an exterior sidewall of the substrate. The second electrically conductive layers include first and second electrically conductive portions. The first electrically conductive portion is disposed on a central region of the bottom surface of the second groove. The second electrically conductive portion extends from the bottom surface of the second groove, along the interior sidewall thereof, to the exterior sidewall of the substrate. | 12-06-2012 |
| 20120281416 | Optical Lenses and Lamps Containing Said Optical Lenses - An optical lens and a lamp containing such optical lens suitable for use in commercial refrigerators are provided. The lamp has an overall long shape. The optical lens produces a bat-wing type of lighting distribution. The optical lens comprises a light incident surface and a light exit surface. The light incident surface comprises a sawtooth-like structure having a plurality of sawtooth-like protrusions. Each of the sawtooth-like protrusions respectively comprises a peak, and a respective valley exists between every two neighboring sawtooth-like protrusions. The distances between the light exit surface and the valleys between every respective two neighboring sawtooth-like protrusions are approximately the same. The sawtooth-like structure of the optical lens helps produce the bat-wing type of lighting distribution. The thickness is generally uniform throughout the optical lens. The optical lens can be manufactured by the extrusion process and has advantages comprising continuous production, high efficiency, simple operation and low cost. | 11-08-2012 |
| 20120281241 | TILT SENSOR - A tilt sensor includes a body, a light emitting diode (LED), a first photosensitive element, a second photosensitive element, and a moving element. The body can tilt in a plurality of tilt directions. The LED is disposed at the body for providing a light beam. The first photosensitive element is disposed at the body and at the opposite side of the LED. The second photosensitive element is disposed at the body and at another side of the LED. The moving element is disposed at the body. When the body tilts toward different tilt directions, the moving element moves toward different directions so that different light receiving situations are produced. | 11-08-2012 |
| 20120279078 | Tilt Sensor - A tilt sensor capable of sensing tilt in multiple directions includes a backplane, a base, a cover, and a moving component. A light emitting component and light sensing components are disposed on the backplane. The base, disposed on the backplane, includes a recess the bottom of which having a plurality of through-holes. The through-holds expose the light emitting and light sensing components. The cover, disposed on the base, covers the recess. The moving component, disposed in the recess and between the base and the cover, includes a shelter portion where center of gravity of the moving component is located. The moving component moves in directions toward which the tilt sensor is titled, and the shelter portion covers some of the through-holes and blocks light to or from the light emitting and light sensing components. The moving component is highly sensitive and not subject to malfunction caused by friction-induced static electricity. | 11-08-2012 |
| 20120273833 | Light Emitting Diode Package - A light emitting diode (LED) package including a carrier, a housing, at least one LED chip and at least one electrostatic discharge protector (ESD protector) is provided. The housing encapsulating a portion of the carrier has at least one first opening, at least one second opening and a barricade. The barricade separates the first opening from the second opening. The first opening and the second opening expose a first surface of the carrier. The LED chip is disposed on the first surface of the carrier, located in the first opening, and electrically connected to the carrier. The ESD protector is disposed on the first surface of the carrier, located in the second opening, and electrically connected to the carrier. | 11-01-2012 |
| 20120268941 | Light Emitting Diode Lamp and Assembling Method Thereof - A light emitting diode lamp according to an embodiment of the present disclosure includes a heat dissipation structure, a light emitting diode (LED) light source and a driver. The LED light source is thermally disposed over and electrically insulated from the heat dissipation structure. The LED light source includes at least one lateral surface on which an electrode is disposed. The driver is disposed under and electrically insulated from the heat dissipation structure. The driver includes an extended portion that is electrically coupled to the electrode by penetrating through the heat dissipation structure. | 10-25-2012 |
| 20120267667 | Light-Emitting Device Package Structure - A light-emitting device package structure includes a leadframe, a light-emitting device disposed on the leadframe, a plurality of wires electrically connecting the leadframe and the light-emitting device, and an encapsulant covering the light-emitting device, the wires and a part of the leadframe. The encapsulant has a gas space therein, and the gas space is disposed on the light-emitting device, wherein the gas space includes at least one gas. | 10-25-2012 |
| 20120235186 | Color-Temperature-Tunable Device - A color-temperature-tunable device comprises a first light emitting diode (LED) chip group comprising at least one first blue LED chip that emits a first light having a first peak wavelength, a second LED chip group comprising at least one second blue LED chip that emits a second light having a second peak wavelength different from the first peak wavelength, and a wavelength converting layer above at least a portion of the first LED chip group and a portion of the second LED chip group. The first LED chip group and the second LED chip group are driven by a first driving current and a second driving current, respectively. | 09-20-2012 |
| 20120223353 | Light-Emitting Diode Structure - A light-emitting diode structure includes a base with a recessed portion, a light-emitting chip and a light-transmissive block. The light-emitting chip disposed in the recessed portion of the base and emits a light beam. The light-transmissive block disposed on the base covers the recessed portion and the light-emitting chip, so that the light beam emitted from the light-emitting chip is radiated outwardly via the light-transmissive block. The light-transmissive block is a flat-top multilateral cone including a bottom surface, a top surface, and several side surfaces connected to and located between the bottom surface and the top surface. A slot with a bottom portion is formed on the top surface of the light-transmissive block. | 09-06-2012 |
| 20120211791 | LED Packaging Structure and Fabricating Method Thereof - A light emitting diode (LED) packaging structure includes a base, a LED chip, a gel-blocking structure and a phosphor layer. The LED chip disposed on the base and electrically connected to the base. The LED chip having a substrate and a semiconductor layer formed on the substrate. The gel-blocking structure is disposed on the substrate of the LED chip and surrounding the semiconductor layer. The phosphor layer is filled within a space defined by the gel-blocking structure, the substrate and the semiconductor layer. The present invention also discloses a fabricating method of the LED packaging structure. | 08-23-2012 |
| 20120181564 | Phosphor Coating Method for Fabricating Light Emitting Semiconductor Device and Applications Thereof - In one aspect, a light emitting unit comprises: a first semiconductor layer having a first electric property; a second semiconductor layer having a second electric property disposed over the first semiconductor layer; an active layer disposed between the first semiconductor layer and the second semiconductor layer; a first electrode disposed on the second semiconductor layer; a second electrode disposed under the first semiconductor layer; and a phosphor layer disposed on the first semiconductor layer. The phosphor layer covers the active layer and the second semiconductor layer. The first electrode is exposed out of the phosphor layer. | 07-19-2012 |
| 20120176052 | Light-Emitting Diode Drive Control Circuit - The present invention provides a light-emitting diode (LED) drive control circuit having an input terminal and an output terminal. The input terminal and a switching device are coupled in series between power supply terminals. The output terminal is coupled to an LED. The switching device includes a single-pole double-throw switch. A first branch of the single-pole double-throw switch is a wire. A second branch of the single-pole double-throw switch includes a resistor and an indicator in series. The circuit includes a semiconductor switch that is either on or off. When the single-pole double-throw switch is switched to the first branch, the semiconductor switch is on and turns on the LED. When the single-pole double-throw switch is switched to the second branch, the semiconductor switch is off and turns off the LED. The circuit can effectively turn the LED on and off to avoid power leakage and slight emission of light. | 07-12-2012 |
| 20120176047 | Lighting Apparatus and Light Emitting Diode Device Thereof - The present invention provides a light emitting diode (LED) device. The LED device include a driver, a first LED coupled in series with the driver, and an impedance-providing component coupled in parallel with the first LED and in series with the driver. The impedance-providing component provides a shunt impedance having a value that varies in positive proportion with a variation in an ambient temperature. The driver is respectively coupled in series with the first LED and the at least one impedance-providing component. The driver provides a drive current divided to flow through the first LED and the at least one impedance-providing component according to the shunt impedance and the internal impedance. | 07-12-2012 |
| 20120168804 | Light Emitting Diode Package and Fabrication Method Thereof - A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression. | 07-05-2012 |
| 20120144683 | Tilt Sensor - A tilt sensor comprises a multi-layer circuit board, a holder, a first light-sensing component, a second light-sensing component, a light-emitting component, and a movable component. The multi-layer circuit board comprises a first layer board and a second layer board disposed on the first layer board. The second layer board comprises first, second, and third holding spaces each of which exposing a respective portion of the first layer board. The holder is disposed on the second layer board and has a containing recess connecting the first, second, and third holding spaces. A bottom surface of the containing recess is reflective. The first and second light-sensing components and the light-emitting component are disposed on the first layer board and in the first, second, and third holding spaces, respectively. The light-emitting component emits a light beam toward the bottom surface of the containing recess. The movable component is disposed in the containing recess. | 06-14-2012 |
| 20120140487 | Lighting Apparatus - A lighting apparatus including a base, a circuit board, a light emitting unit, and a locking element is provided. The circuit board has a first surface and a second surface opposite to the first surface, and includes a through hole communicating the first and second surfaces. The circuit board is carried by the base with the second surface resting on the base. The light-emitting element is disposed on the first surface of the circuit board. The locking element comprises resilient hooks each of which including a resilient support, passing through the through hole with a first end of the resilient support connected to the based, and a hook head, connected to a second end of the resilient support opposite to the first end. The hook head is suitable for hooking the first surface of the circuit board. | 06-07-2012 |
| 20120098735 | Digit Display - Various embodiments of a digit display are provided. In one aspect, a digit display comprises at least one display unit. The at least one digit unit comprises twenty-eight character segments that are arranged in a manner including a quadrilateral, a cross, and four X-shaped arrangements. The quadrilateral is formed by eight of the twenty-eight character segments with two character segments on each of four sides of the quadrilateral. The cross is formed by four of the twenty-eight character segments and dividing the quadrilateral into four quadrants. Each of the four X-shaped arrangements is disposed in a respective one of the four quadrants and formed by respective four of the twenty-eight character segments. | 04-26-2012 |
| 20120080703 | Light Emitting Diode Package Structure and Manufacturing Method Thereof - An LED package structure comprises a substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The substrate has a first surface and a second surface opposite to the first surface. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The at least one electrically conductive element traverses the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the at least one electrically conductive element. | 04-05-2012 |
| 20120080702 | Light Emitting Diode Package Structure and Manufacturing Method Thereof - In one aspect, an LED package structure comprises a fluorescent substrate, a first electrically conductive pattern, a second electrically conductive pattern, at least one electrically conductive element, and an LED chip. The fluorescent substrate has a first surface and a second surface opposite the first surface. The fluorescent substrate comprises a mixture of a fluorescent material and a glass material. The first electrically conductive pattern is disposed on the first surface. The second electrically conductive pattern is disposed on the second surface. The electrically conductive element passes through the fluorescent substrate and connects the first and second electrically conductive patterns. The LED chip is disposed on the second surface and has a light extraction surface that connects the second electrically conductive pattern. The LED chip is electrically coupled to the first electrically conductive pattern via the electrically conductive element. | 04-05-2012 |
| 20120032216 | Light Emitting Diode Package Structure - Embodiments of a light emitting diode (LED) package structure are provided. In one aspect, an LED package structure includes a base, at least one LED chip, a blocking plate, and a transparent cover plate. The LED chip is disposed on and electrically coupled to the base. The blocking plate is disposed on the base and surrounds the LED chip. The blocking plate has an opening for exposing the LED chip. The blocking plate comprises a light-absorbing material that is opaque. The transparent cover plate is disposed on the blocking plate and covers the opening of the blocking plate. | 02-09-2012 |
| 20110308851 | Circuit Substrate and Light Emitting Diode Package - A circuit substrate including a base layer and a plurality of lead units arranged as an array is provided, wherein the base layer has a plurality of through grooves, and the lead units are disposed on the base layer. Each of the lead units includes a common terminal and at least three leads. The common terminal is capable of being divided into a plurality of electrodes connected with each other. The leads are extended outwards from the edge of the common terminal, and each of the leads is extended outwards from the edge of one of the electrodes. The through grooves expose the common terminals of the lead units. | 12-22-2011 |
| 20110297976 | Illumination Module - An illumination module including a substrate and a plurality of first and second LED chips is provided. The substrate has a plurality of device bonding areas, and each of device bonding areas has two sub-device bonding areas. Each sub-device bonding area has a first, second, and common route. The first routes surround the outer peripheries of each device bonding area. The second routes are located between the two sub-device bonding areas. The common routes are located between the first and second routes. The first LED chips located at the common routes are electrically connected to each other. The second LED chips located at the first and second routes respectly are electrically connected to each other. | 12-08-2011 |
| 20110278639 | LED Package Structure - An LED package structure comprises an LED chip and a fuse electrically connected to the LED chip in series. The fuse has a low melting point such that the fuse melts under a high current to form an open circuit to prevent the high current from flowing through the LED chip. | 11-17-2011 |
| 20110266589 | Light Emitting Diode Package Structure and Manufacturing Method Therefor - A light emitting diode (LED) package and a manufacturing method therefor are disclosed. In one aspect, a manufacturing method of a light emitting diode package may: heat a first light transmission insulation material to cause the first light transmission insulation material to become a sticky member; connect a lead frame to the sticky member; perform a chip-bonding step that bonds at least one light-emitting diode chip on the sticky member using a light transmission glue; encapsulate the at least one light-emitting diode chip with a second light transmission insulation material; and perform a drying step that forms the sticky member and the second light transmission insulation material into shape. | 11-03-2011 |
| 20110260203 | LIGHT EMITTING DIODE STRUCTURE AND FABRICATION METHOD THEREOF - A light emitting diode structure including a light emitting device layer, a patterned dielectric layer, a first ohmic contact layer, a conductive layer, a first electrode layer and a second electrode layer is provided. The light emitting device layer has a first surface and a second surface opposite to the first surface. The patterned dielectric layer disposed on the first surface has a plurality of openings exposing a portion of the light emitting device layer. The first ohmic contact layer is disposed on the patterned dielectric layer and connected with the first light emitting device layer through the openings. The conductive layer is disposed on the first ohmic contact layer. The first electrode layer is disposed on the conductive layer, and the conductive layer is located between the first ohmic contact layer and the second electrode layer. A fabrication method of the light emitting diode structure is also provided. | 10-27-2011 |
| 20110255030 | Light Emitting Diode Module - Various embodiments of a lighting module are described. In one aspect, a lighting module comprises a metal support, a circuit board, and a plurality of light emitting diodes. The metal support has a recess, sidewalls, and a plurality of holes on the sidewalls. The circuit board is fastened on a bottom portion of the recess of the metal support and has two long sides, two short sides, and a respective plurality of flanges on each of the two long sides. The flanges are inserted into the holes of the metal support to compact the circuit board and the metal support. The light emitting diodes are disposed on the circuit board. | 10-20-2011 |
| 20110254028 | Light Emitting Diode - The present disclosure provides a light emitting diode. The light emitting diode includes a substrate having a first surface and an opposite second surface. At least one light emitting diode chip is disposed on the first surface of the ceramic substrate. A plurality of thermal metal pads are disposed on the second surface of the substrate, wherein the thermal metal pads are electrically isolated from the at least one light emitting diode chip. | 10-20-2011 |
| 20110254025 | Light-Emitting Diode Packaging Structure and Module and Assembling Method Thereof - A light-emitting diode packaging structure comprises a light-emitting diode and first and second metal plates on which the light-emitting diode is mounted. The light-emitting diodes includes first and second electrode leads, the second electrode lead having first and second contact surfaces on an outer edge of the second electrode lead. The first metal plate includes at least one clamping portion that clamps and fixes the first electrode lead on the first metal plate. The second metal plate includes at least first and second clamping portions. The first contact surface of the second electrode lead contacts the first clamping portion, and the second contact surface of the second electrode lead contacts the second clamping portion, such that the light-emitting diode is fixed on the second metal plate in at least two dimensions parallel to a primary surface of the second metal plate on which the light-emitting diodes is mounted. | 10-20-2011 |
| 20110254024 | Circuit Structure of Package Carrier and Multi-Chip Package - A multi-chip package comprises a plurality of chip pads and a plurality of LED chips. The chip pads are arranged in an M×N array, M and N each a positive integer greater than 1. A peripheral area of each chip pad comprises a respective first bonding pad, a respective second bonding pad, and a respective third bonding pad arranged in sequence in a clockwise direction. A first orientation of the respective first to third bonding pads in a first row of the N rows differs from a second orientation of the respective first to third bonding pads in a second row of the N rows by 90 degrees. Each of the LED chips is disposed on a respective one of the chip pads and electrically connected to two of the respective first to third bonding pads on a same side of the respective LED chip. | 10-20-2011 |
| 20110248646 | POWER SUPPLY UNIT, LIGHT EMITTING APPARATUS AND DIMMING METHOD THEREOF - A power supply unit with a dimming function which is adapted for a light emitting apparatus including a power system is provided. The power supply unit includes at least one output channel, a power stage, a detecting unit, and a micro controller unit (MCU). The power stage receives a first output of the power system and provides a first signal. The detecting unit detects a second output of the power system and provides a second signal. The MCU receives the first signal and the second signal, controls the at least one output channel, and is programmed to set a dimming ratio for the at least one output channel according to the first signal and the second signal. Furthermore, a light emitting apparatus and a dimming method are also provided. | 10-13-2011 |
| 20110248289 | LIGHT EMITTING DIODE PACKAGE, LIGHTING DEVICE AND LIGHT EMITTING DIODE PACKAGE SUBSTRATE - A light emitting diode (LED) package includes a LED package substrate, first LED chips and second LED chips. The LED package substrate includes a substrate, a first bonding pad, second bonding pads and a third bonding pad. The first, second and third bonding pads are disposed on the substrate. The second bonding pads are arranged in an array. The first and third bonding pads are located adjacent respectively to first and last column of the array. The first LED chips are die-bonded on the first bonding pad and wire-bonded respectively to the second bonding pads arranged in first column of the array. The second LED chips are die-bonded on the second bonding pads respectively. In each row except last column, each second LED chip is wire-bonded to the second bonding pad arranged in next column. The second LED chips located in last column are wire-bonded to the third bonding pad. | 10-13-2011 |
| 20110242807 | LIGHT COVER AND ILLUMINATING APPARATUS APPLYING THE SAME - A light cover and an illuminating apparatus applying the same are provided. The illuminating apparatus comprises the light cover and a plurality of light sources. The light cover comprises a substrate provided with a plurality of recesses on a front surface and a plurality of lenses integrated with the substrate and respectively located in the recesses. The lenses are oriented in a same direction. The light sources are disposed corresponding to the lenses. Each of the light sources is adapted to emit a light. Each of the lenses is adapted to receive the light and transform the light into a predefined light output. | 10-06-2011 |
| 20110235338 | LIGHT EMITTING DEVICE AND LENS THEREOF - A lens and a light emitting device applying the same are provided. The lens has a first profile along a first cross-section and a second profile along a second cross-section perpendicular to the first cross-section. The first profile is asymmetric with respect to the second cross-section, and the second profile is symmetric with respect to the first cross-section. A contour center of a light emergent surface of the lens is located on an intersection of the first cross-section and the second cross-section. The light emergent surface comprises a first curved surface and a second curved surface being connected with each other at the second cross-section. Furthermore, a curvature of the first curved surface and a curvature of the second curved surface are discontinuous at the contour center. The light emitting device applies the lens for receiving a light emitted from a light source and provides an asymmetric light output. | 09-29-2011 |
| 20110227118 | Light Emitting Diode Package Structure and Manufacturing Method Thereof - A light emitting diode package structure is disclosed. The LED package structure includes a carrier, an LED chip, a first molding compound and a second molding compound. The LED chip is disposed on the carrier. The first molding compound overlays the LED chip, wherein the first molding compound is mixed up with a fluorescent material. The second molding compound overlays the first molding compound. | 09-22-2011 |
| 20110198663 | STRUCTURE OF LIGHT EMITTING DIODE AND METHOD TO ASSEMBLE THEREOF - A structure of a light emitting diode is provided. In one aspect, a light emitting diode structure comprises a light emitting diode, a conductive frame, and a substrate. The conductive frame is electrically connected to the light emitting diode and has a fixing hole connecting a first side of the conductive frame and a second side of the conductive frame opposite the first side. The fixing hole has a ladder-shaped inner sidewall with a first radius of the inner sidewall adjacent the first side smaller than a second radius of the inner sidewall adjacent the second side. The substrate has a conductive pillar that is received in the fixing hole by entering the fixing hole from the first side of the conductive frame and deformed such that the conductive pillar adheres to the ladder-shaped inner sidewall of the fixing hole. | 08-18-2011 |
| 20110193493 | LIGHT EMITTING DIODE LIGHTING APPARATUS - A light emitting diode (LED) lighting apparatus is provided. The LED lighting apparatus includes a first LED unit and a rectification circuit. The rectification circuit includes a second LED unit. The first LED unit is disposed on a direct current (DC) path. The first LED unit can be used to emit a first light. The rectification circuit is coupled to an alternating current (AC) power source and the first LED unit. The rectification circuit can be used to provide a DC power signal to the DC path. The second LED unit is disposed on a first AC path and coupled between the AC power source and the DC path. The second LED unit can be used to emit a second light to mix the first light for generating a third light. | 08-11-2011 |
| 20110193061 | Light Emitting Diode Device Having Uniform Current Distribution and Method for Forming the Same - Embodiments of the present disclosure relate to a novel semiconductor. In one aspect, the semiconductor may include a transparent layer having a first surface, a first doped layer, a second doped layer, and an active layer. The first doped layer may be formed over the first surface of the transparent layer and have a plurality of first-type electrodes formed thereon. The second doped layer may be formed over the first surface of the transparent layer and have a plurality of second-type electrodes formed thereon. The active layer may be formed between the first doped layer and the second doped layer. A distance between at least one of the first-type electrodes and a nearest other one of the first-type electrodes may be greater than each of respective distances between the at least one of the first-type electrodes and more than two of the second-type electrodes. | 08-11-2011 |
| 20110176321 | LED Lamp Manufacturing Method - An improved LED lamp manufacturing method and an improved LEP lamp device are described. In one aspect, an LEP lamp device includes an LED lamp bulb, a pair of electrical cables electrically coupled to the LED lamp bulb, and a main body. The main body encloses part of the LED lamp bulb, part of the pair of cables, a connection between the LED lamp bulb, and the pair of electrical cables. The main body includes a first plastic member and a second plastic member coupled to the first plastic member. Each of the first plastic member and second plastic member has a respective pair of cable grooves. The first plastic member or the second plastic member, or both, have one or more welding lines along an edge and between the respective pair of cable grooves. | 07-21-2011 |
| 20110175135 | Circuit Board For LED - A submount comprising a chip mounting area, a first bonding pad and a connecting portion is provided. An LED chip is mounted on the chip mounting area. The first bonding pad is electrically connected to an electrode of the LED chip. The connecting portion has a first hollow portion and is disposed between the chip mounting area and the first bonding pad. The first hollow portion is located between the chip mounting area and the first bonding pad. The first hollow portion is located in a central region of the connecting portion. | 07-21-2011 |
| 20110149576 | ILLUMINATING DEVICE - An illuminating device includes a case, a heat sink block, an LED array, two waterproof plastic sheets and two covers. The case has a fluid inlet, a fluid outlet and two partition grooves. The heat sink block has a carrying platform and a fluid channel. The fluid channel is conformally disposed in the partition grooves and communicated with the fluid inlet and the fluid outlet. The LED array is located on the carrying platform. The waterproof plastic sheets respectively overlay the fluid inlet and the fluid outlet. The waterproof plastic sheets have a first opening communicated with the fluid channel. The covers respectively overlay the waterproof plastic sheet and a part of the case and have a second opening corresponding to the first opening. A fluid flows through the fluid channel via the second openings and the first openings so as to discharge heat from the LED array. | 06-23-2011 |
| 20110140157 | Light-Emitting Diode Backlight Module - A light-emitting diode backlight module includes a base and a light source disposed on the base. The light source comprises a substrate, a heat sink and an LED chip. The base has a heat conductor. The heat sink of the light source is coupled between the substrate of the light source and the heat conductor of the base. The heat sink has a first part which is adjacent a first side of the substrate and a second part which is adjacent a second side of the substrate. The heat sink is in contact with the heat conductor. The LED chip is disposed on the first part of the heat sink and emits light laterally. | 06-16-2011 |
| 20110121349 | LIGHT-EMITTING DIODE AND MANUFACTURING METHOD THEREOF - A light-emitting diode (LED) and manufacturing method thereof are disclosed. The LED includes a transparent substrate, a plurality of transparent conductive layers, a plurality of metal circuits, and a LED chip. The LED chip is suitable for emitting a light and a portion of the light emits toward the transparent substrate. The manufacturing method of LED includes the following steps. First, a transparent conductive layer is formed on the transparent substrate. Next, a conductive pattern is fromed by etching transparent conductive layer. The intersection metal circuit is formed by disposing the metal on a portion of the transparent conductive layer. Finally, the LED chip is disposed on the metal circuit so tat the LED chip is electrically connected to the metal circuit. | 05-26-2011 |
| 20110114982 | PHOSPHOR COATING METHOD FOR FABRICATING LIGHT EMITTING SEMICONDUCTOR DEVICE AND APPLICATIONS THEREOF - A phosphor coating method for fabricating a light-emitting semiconductor is provided. The phosphor coating method comprises the steps as follows: First a light emitting semiconductor wafer having a plurality of die units formed thereon is provided, and a photoresist is then formed on the light emitting semiconductor wafer to cover the die units. A pattern process is conducted to form a plurality of openings associated with the die units, whereby each die can be exposed via one of the openings. Subsequently, a compound mixed with phosphor is filled into the openings. | 05-19-2011 |
| 20110109899 | METHOD OF DETERMINING NUMBER OF LIGHT SOURCES - A method of determining the number of light sources is adapted to determine the number of each kind of light sources of an illumination device. The method includes following steps. A photon number of a single light source of each kind of the light sources is calculated. Next, a number ratio of each kind of the light sources is determined according to a power ratio of each kind of the light sources and the photon number of a single light source of each kind of the light sources. Finally, the number of each kind of the light sources is determined according to the number ratio and a total number of the light sources of the illumination device. | 05-12-2011 |
| 20110108881 | METHOD FOR MANUFACTURING LIGHT-EMITTING DIODE - A semiconductor structure is first provided. The semiconductor structure includes a sapphire substrate and a semiconductor light-emitting layer. A first surface of the semiconductor light-emitting layer covers and contacts with the sapphire substrate. Then, the semiconductor structure is fixed on a supported base. The sapphire substrate is further removed from the semiconductor structure. After that, a high heat-conductive layer is formed on the first surface of the semiconductor light-emitting layer to form a light-emitting diode. Finally, the supported base is separated from the light-emitting diode. | 05-12-2011 |
| 20110101393 | LIGHT-EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A light-emitting diode (LED) package structure includes a LED chip, an interconnecting substrate, a first conductive lead and a second conductive lead. The LED chip is provided with first and second electrical contacts formed on the same side thereof. The upper surface of the interconnecting substrate is provided with two conductive traces and first, second, third and fourth conductive pads. The first and second conductive pads are electrically connected to the third and fourth conductive pads by the two conductive traces, respectively. The first and second conductive leads are directly soldered to the third and fourth conductive pads, respectively. The LED chip is mounted onto the upper surface of the interconnecting substrate in a flip-chip configuration so that the first and second conductive pads thereof are mechanically and electrically connected to the first and second electrical contacts, respectively. | 05-05-2011 |
| 20110097944 | Connector and Light Source Apparatus - A connector adapted to be disposed on a carrier and electrically connected to the carrier is provided. The connector includes an insulating base and two electrodes. The insulating base has a first side surface, a second side surface, a bottom surface, and two through holes. The bottom surface connects the first and the second side surfaces. The through holes extend from the first side surface to the second side surface. The electrodes respectively penetrate the through holes. Each electrode has a bar portion and a bending portion extending from the bar portion. The bar portion is located in the corresponding through hole and protrudes away from the first side surface. The bending portion extends on the second side surface and toward the carrier. An end of the bending portion penetrates through the carrier and is electrically connected to the carrier. A light source apparatus is also provided. | 04-28-2011 |
| 20110080086 | WHITE-LIGHT EMITTING DEVICE AND PREPARATION METHOD AND APPLICATION OF THE SAME - A white-light emitting device and its preparation method are provided. The white-light emitting device comprises an ultraviolet (UV) light emitting diode (LED) chip, a first phosphor, and a second phosphor, wherein the UV LED chip generates a first radiation; the first phosphor is composed of Zn(C | 04-07-2011 |
| 20110074268 | LIGHT SOURCE MODULE - A light source module including a heat dissipation block, a light emitting diode (LED) package and a circuit board is provided. The heat dissipation block has a surface and the LED package is disposed on the surface of the heat dissipation block. The circuit board is electrically connected to the LED package, and the circuit board and the LED package are located at two opposite sides of the heat dissipation block respectively. | 03-31-2011 |
| 20110072674 | TILT SENSOR - A tilt sensor including a body, an LED, a first photosensitive device, a second photosensitive device, and a moving thin-element is provided. The body has a movement region, a first containing region, a second containing region, and a third containing region. The first, second, and third containing regions have an opening respectively and are connected with the movement region through the openings. The LED providing a light beam is disposed in the first containing region. The first and second photosensitive devices are disposed in the second and third containing regions respectively. When the body tilts toward different tilt directions, the moving thin-element moves in the tilt direction, allowing the light beam provided from the LED to reflect directly to the first and second photosensitive devices, or shielding the light beam provided from the LED from being transmitted to the first and second photosensitive devices. | 03-31-2011 |
| 20110072673 | TILT SENSOR - A tilt sensor including a body, a plurality of metal pad pairs, and a moving element is provided. The body is suitable for tilting in a plurality of tilt directions and has a movement region having a plurality of corners. The metal pad pairs are respectively located in at least a portion of the corners. The moving element is located in the movement region. The moving element moves to one of the corners and physically contacts with the metal pad pair located in the corner when the body tilts towards one of the tilt directions, such that the metal pads of the metal pad pair are electrically connected with each other via the moving element. | 03-31-2011 |
| 20110031106 | METHOD FOR FABRICATING LEAD FRAME OF LIGHT EMITTING DIODE - A method for fabricating lead frames of light emitting diodes (LEDs) including following steps is provided. First, a conductive frame tape is provided. The conductive frame tape includes a plurality of conductive frames arranged along an extending direction of the conductive frame tape. Each of the conductive frames has a first connection portion adapted to carry an LED chip. Next, a plurality of first sputter layers are selectively sputtered onto the conductive frame tape through at least one target, and the first sputter layers are formed on the first connection portions, respectively. | 02-10-2011 |
| 20100295460 | LIGHT EMITTING DIODE CIRCUIT - A light emitting diode (LED) circuit is provided. A light emitting diode (LED) circuit includes an alternating current (AC) source, a rectifier, a voltage-limiting circuit, and an LED module. The AC source provides an AC voltage, and the rectifier generates a first rectified voltage according to the AC voltage. An upper limit of the first rectified voltage is substantially restricted at a rated voltage by the voltage-limiting circuit, and the voltage-limiting circuit generates a second rectified voltage according to the first rectified voltage, in which the second rectified voltage is lower than the rated voltage. The LED module receives the second rectified voltage. Thereby, when the AC voltage is unstable, fluctuation of current flowing through the LED module can be substantially reduced. | 11-25-2010 |
| 20100295071 | LIGHT EMITTING DEVICE - A light emitting device includes a carrier, a light emitting element electrically connected to the carrier, a transparent plate having at least one through hole formed therein and including a flat-portion and a lens-portion and a permeable membrane structure disposed on a surface of the transparent plate. The lens-portion covers the light emitting element and has a light incident surface, a light emitting surface, a first and a second side surfaces. A first partial beam of the light beam passes through the light incident surface and leaves from the light emitting surface. A second partial beam of the light beam passes through the light incident surface and is transmitted to the first or the second side surface. The first or the second side surface reflects at least a part of the second partial beam of the light beam to be passed through the light emitting surface. | 11-25-2010 |
| 20100237775 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A method of fabricating a light emitting diode (LED) package structure is provided. A carrier and at least one LED chip having a light emitting surface and a plurality of side surfaces are provided. A first mask having at least one first opening is provided, and the first opening at least exposes the LED chip. A spray coating apparatus is provided above the first mask to perform a first spray coating process. The spray coating apparatus moves back and forth to spray a first phosphor solution over the LED chip so that the light-emitting surface and the side surfaces of the LED chip can be conformally covered by the sprayed first phosphor solution. The first phosphor solution is cured to form a first fluorescent layer by performing a curing process. A molding compound is formed to encapsulate the first fluorescent layer and a portion of the carrier. | 09-23-2010 |
| 20100237383 | Photoelectric Transmitting or Receiving Device and Manufacturing Method Thereof - A photoelectric transmitting or receiving device and the manufacturing method thereof are provided. The photoelectric transmitting device comprises a substrate, a first conductive layer, a second conductive layer and a photoelectric transducing chip. The substrate has an upper surface and a recess and is made of a composite material. The recess is defined by a bottom surface and an inner lateral wall extended upwardly from the bottom surface to the upper surface. The first conductive layer and the second conductive layer are formed by using laser to activate the composite material of the substrate. The first conductive layer is disposed on the bottom surface of the recess, and is extended outwardly along the inner lateral wall of the recess and the upper surface of the substrate. The second conductive layer is electrically insulated from the first conductive layer and is extended outwardly along the upper surface of the substrate. The photoelectric transducing chip is disposed on the bottom surface of the recess and electrically connected to the first conductive layer disposed on the bottom surface of the recess and to the second conductive layer, respectively. | 09-23-2010 |
| 20100225230 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF - A manufacturing method of a light emitting diode package structure is disclosed. First, a carrier and an LED chip are provided, wherein the LED chip is disposed on the carrier. Next, a first molding compound is provided on the LED chip, wherein the first molding compound is mixed up with a fluorescent material. Then, a first baking process to make the first molding compound in semi-cured state is performed. After that, a second molding compound is provided on the first molding compound. | 09-09-2010 |
| 20100224801 | PHOTO INTERRUPTER - A photo interrupter is provided. The photo interrupter includes a housing and a light emitting/receiving unit. The housing defines a recess portion and has a first engaging portion disposed in the recess portion. The light emitting/receiving unit has a second engaging portion. When the light emitting/receiving unit is disposed in the recess portion, the first engaging portion engages with the second engaging portion. | 09-09-2010 |
| 20100220483 | DISSIPATION MODULE FOR A LIGHT EMITTING DEVICE AND LIGHT EMITTING DIODE DEVICE HAVING THE SAME - A light emitting diode device is provided. The light emitting diode device comprises a composite substrate and a light emitting diode disposed on the composite substrate. The composite substrate comprises a first carbon fiber composite layer which is able to conduct heat rapidly in the direction of carbon fiber, such that the heat generated from the light emitting diode module can be dissipated rapidly. | 09-02-2010 |
| 20100220319 | TILT SENSOR - A tilt sensor includes a body, a light emitting device, a first photosensitive device, a second photosensitive device, and a moving element. The body can tilt in a plurality of tilt directions. The light emitting device is disposed at the body for providing a light beam. The first photosensitive device is disposed at the body and at one side of the light emitting device. The second photosensitive device is disposed at the body and at another side of the light emitting device. The moving element is disposed at the body. When the body tilts toward different tilt directions, the moving element moves toward different tilt directions so that the light beam emitted by the light emitting device directly transmits to the first photosensitive device and the second photosensitive device or is sheltered from directly transmitting to at least one of the first photosensitive device and the second photosensitive device. | 09-02-2010 |
| 20100219422 | PHOTO-COUPLER - A photo-coupler is provided. The photo-coupler comprises a light emitting chip, a light-sensing chip, a light-transmissive inner encapsulant package and an outer package. Both the light emitting chip and the light-sensing chip face the same direction, while the light-sensing chip receives a light beam emitted by the light emitting chip. The light-transmissive inner encapsulant package encloses the light emitting chip and the light-sensing chip, while the outer package encloses the light-transmissive inner encapsulant package. An interface is formed between the light-transmissive inner encapsulant package and the outer package for reflecting the light beam. A reflective curve surface adjacent to the light emitting chip is formed on the interface of the light-transmissive inner encapsulant package for reflecting and converging the first portion of the light beam to the light-sensing chip. | 09-02-2010 |
| 20100213563 | SEMICONDUCTOR OPTOELECTRONIC DEVICE AND QUAD FLAT NON-LEADED OPTOELECTRONIC DEVICE - A semiconductor optoelectronic device including a substrate, a control chip, a light-sensing chip and a molding compound is provided. The control chip is disposed on the substrate and electrically connected to the substrate. The light-sensing chip is disposed on the substrate and electrically connected to the substrate and the control chip. The molding compound encapsulates the control chip and a material of the molding compound is an insulating material doped with a non-electro-conductive magnetic conductive material. | 08-26-2010 |
| 20100213562 | QUAD FLAT NON-LEADED CHIP PACKAGE STRUCTURE - A quad flat non-leaded chip package structure includes a leadframe, a control chip, a light-sensing chip, a first bonding wire, a plurality of second bonding wires, and a molding compound. The leadframe includes a plurality of leads. Besides, the leadframe has an upper surface and a lower surface opposite to the upper surface. The control chip and the light-sensing chip are disposed on the upper surface of the leadframe. The light-sensing chip is electrically connected to the control chip through the first bonding wire. The control chip is electrically connected to the leads through the second bonding wires. The molding compound encapsulates a portion of the leadframe, the control chip, the light-sensing chip, the first bonding wire, and the second bonding wires. In addition, the molding compound fills among the leads. | 08-26-2010 |
| 20100213496 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package including a carrier, a housing, at least one LED chip and at least one electrostatic discharge protector (ESD protector) is provided. The housing encapsulating a portion of the carrier has at least one first opening, at least one second opening and a barricade. The barricade separates the first opening from the second opening. The first opening and the second opening expose a first surface of the carrier. The LED chip is disposed on the first surface of the carrier, located in the first opening, and electrically connected to the carrier. The ESD protector is disposed on the first surface of the carrier, located in the second opening, and electrically connected to the carrier. | 08-26-2010 |
| 20100213257 | OPTICAL SENSING DEVICE - An optical sensing device is suitable for detecting information on an information plane. The optical sensing device includes a light source, an optical grating and an optical detector. The light source is suitable for providing a light beam along a first axis. The light beam is illuminated on the information plane and is converted into an optical signal exiting the information plane. The optical grating has at least a split. The optical detector is suitable for receiving the optical signal to generate the information. The optical signal passes through the split of the grating and reaches the optical detector along a second axis that is positioned at an angle with respect to the first axis. | 08-26-2010 |
| 20100207143 | LIGHT EMITTING DEVICE - A light emitting device includes a carrier, a light emitting element disposed and electrically connected to the carrier, and a transparent plate disposed on the carrier and including a flat-portion and a lens-portion. The lens-portion covers the light emitting element and has a light incident surface, a light emitting surface, a first side surface and a second side surface. The light emitting element is suitable for emitting a light beam. A first partial beam of the light beam passes through the light incident surface and leaves from the light emitting surface. A second partial beam of the light beam passes through the light incident surface and is transmitted to the first side surface or the second side surface, and the first side surface or the second side surface reflects at least a part of the second partial beam of the light beam to be passed through the light emitting surface. | 08-19-2010 |
| 20100193816 | LIGHT EMITTING DIODE PACKAGE AND FABRICATION METHOD THEREOF - A light emitting diode package and a fabrication method thereof are provided. The light emitting diode package comprises a lead frame, having a frame body and a conductive layer covering the frame body. A reflector has a first portion and a second portion sandwiching the lead frame, wherein the first portion has a depression to expose the lead frame, and a light emitting diode chip is disposed on the lead frame in the depression. The fabrication method comprises forming a frame body and forming a conductive layer covering the frame body to form a lead frame. A first portion and a second portion of a reflector are formed to sandwich the lead frame, wherein the first portion has a depression to expose the lead frame. A light emitting diode chip is disposed on the lead frame in the depression. | 08-05-2010 |
| 20100193802 | SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF - A method for manufacturing a semiconductor device is provided. The method includes steps of forming a semiconductor element layer on a first substrate; bonding a second substrate to the semiconductor element layer; and replacing the first substrate with a combining substrate, wherein the combining substrate has a thermal conductivity larger than that of the first substrate. | 08-05-2010 |
| 20100188857 | OPTICAL LENS STRUCTURE - An optical lens structure is disclosed. The optical lens structure is suitable to cover a light emitting source, wherein the light emitting source is suitable to provide an illumination light. The optical lens structure includes a trench structure and two optical light-emitting surfaces. The two optical light-emitting surfaces are located at both sides opposite to each other of the trench structure and physically connect the trench structure. The illumination light from the light emitting source is transmitted from the optical light-emitting surfaces to a direction far away from the light emitting source. | 07-29-2010 |
| 20100187674 | PACKAGE SUBSTRATE STRUCTURE AND CHIP PACKAGE STRUCTURE AND MANUFACTURING PROCESS THEREOF - A chip package structure includes a substrate, chips and an elastic element. The substrate has a first surface, a second surface, a first patterned metal layer on the first surface and a second patterned metal layer on the second surface, wherein the substrate is suitable for being clipped between an upper mold chase and a lower mold chase of a package mold. The chips are disposed on the first surface, wherein the chips are suitable for being contained in containing spaces defined by the upper mold chase and the substrate. The elastic element is disposed on the second surface and surrounds the second patterned metal layer, wherein the elastic element is suitable for contacting the lower mold chase and is located between the lower mold chase and the substrate. In addition, a manufacturing process of the chip package and a package substrate structure are also provided. | 07-29-2010 |
| 20100187561 | ELECTRONIC DEVICE - An electronic device includes a carrier, a surface mounting device, and solders. The carrier has a plurality of bonding pads, and at least one of the bonding pads has a notch, such that the bonding pad has a necking portion adjacent to the notch. The surface mounting device is disposed on the carrier. Besides, the surface mounting device has a plurality of leads, and each of the leads is connected to the necking portion of one of the bonding pads, respectively. The notch of each of the bonding pads is located under one of the leads. The solders connect the bonding pads and the leads. | 07-29-2010 |
| 20100187553 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD THEREOF - An LED package structure includes a carrier substrate, a reflector and an LED chip. The reflector is disposed on the carrier substrate and includes a base, a magnesium fluoride layer and a cerium dioxide layer. The base has an opening to expose a part of the carrier substrate. The magnesium fluoride layer is disposed on the inside wall of the opening and the cerium dioxide layer is disposed on the magnesium fluoride layer. The LED chip is disposed in the opening and located on the carrier substrate. | 07-29-2010 |
| 20100187551 | LIGLIGHT EMITTING DIODE PACKAGE STRUCTURE - An LED package structure includes a carrier, a housing, an LED chip, a encapsulant and a surface treatment layer. The housing is disposed on the carrier and has an upper surface, wherein the housing and the carrier together form a chip-containing cavity. The LED chip is disposed on the carrier and located in the chip-containing cavity. The encapsulant is disposed in the chip-containing cavity and encapsulates the LED chip. The surface treatment layer is disposed on the upper surface of the housing to prevent the encapsulant from adhering to the upper surface of the housing. | 07-29-2010 |
| 20100187549 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package includes a substrate, a plurality of LED chips, and a plurality of electrode pairs. The LED chips are disposed on the substrate, and each of the LED chips is electrically isolated from one another. The electrode pairs are disposed on the substrate, and each of the electrode pairs is electrically isolated from one another. The number of the electrode pairs is equal to the number of the LED chips, and each of the electrode pairs electrically connects one of the LED chips corresponding thereto. | 07-29-2010 |
| 20100181587 | LED packaging structure and fabricating method thereof - A LED (light emitting diode) packaging structure includes a base, a LED chip, a gel-blocking structure and a phosphor layer. The LED chip disposed on the base and electrically connected to the base. The LED chip having a substrate and a semiconductor layer formed on the substrate. The gel-blocking structure is disposed on the substrate of the LED chip and surrounding the semiconductor layer. The phosphor layer is filled within a space defined by the gel-blocking structure, the substrate and the semiconductor layer. The present invention also discloses a fabricating method of the LED packaging structure. | 07-22-2010 |
| 20100176417 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME - A light emitting diode and method for fabricating the same are provided. The light emitting diode comprises a lead frame. A first material body is formed on the lead frame, wherein the first material body comprises a tip, an inner surface and an outer surface. A second material body is formed on the lead frame to completely cover the outer surface of the first material body. Particularly, the first material body comprises hydrophilic polymer and the second material body comprises hydrophobic polymer. | 07-15-2010 |
| 20100165632 | HEAT DISSIPATION DEVICE AND LUMINAIRE COMPRISING THE SAME - A heat dissipation device and a luminaire comprising the same are provided. The luminaire comprises a first circuit board, a light-emitting diode, the heat dissipation device, a circuit device, a bulb cap. The first circuit board has a first surface and a second surface opposite to the first surface. The light-emitting diode is disposed on the first surface and electrically connected to the first circuit board. The heat dissipation device comprises a fan module and a plurality of heat dissipation channels. The fan module is disposed on the second surface of the first circuit board and electrically connected to the first circuit board. The heat dissipation channels are connected to an atmosphere, wherein the fan module is adapted to generate airflow to pass the heat dissipation channels to the ambient. The circuit device is electrically connected to the first circuit board, and the bulb cap is electrically connected to the circuit device to provide power to the first circuit board and the light-emitting diode. | 07-01-2010 |
| 20100148211 | LIGHT EMITTING DIODE PACKAGE STRUCTURE - A light emitting diode (LED) package structure including a leadframe, a housing, a LED chip and a light-transmissive encapsulant is provided. The leadframe has a first electrode and a second electrode separated from each other. The housing wraps the first electrode and the second electrode and includes a recess having a bottom and a sidewall. The bottom of the recess has a cover layer covering the leadframe and having an opening exposing an end of the first electrode, an end of the second electrode and a spacer disposed therebetween and connected thereto wherein the spacer, the end of the first electrode and the end of the second electrode are substantially coplanar. The LED chip is disposed in the recess and electrically connected to leadframe. The light-transmissive encapsulant is filled in the recess. | 06-17-2010 |
| 20100148185 | FLIP-CHIP LIGHT-EMITTING DIODE DEVICE - A flip-chip light-emitting diode (LED) device is provided. The flip-chip LED device includes a substrate, an n-GaN layer, an epitaxy layer, a p-GaN layer, a first electrode, and a second electrode. The n-GaN layer is formed on a surface of the substrate. The epitaxy layer is formed on the n-GaN layer. The p-GaN layer is formed on the epitaxy layer. The first electrode has a first polarity and is formed on the p-GaN layer. The first electrode substantially covers the p-GaN layer. The second electrode is formed on the n-GaN layer and has a second polarity opposite to the first polarity. | 06-17-2010 |
| 20100133580 | LIGHT EMITTING DIODE PACKAGE STRUCTURE AND CONDUCTIVE STRUCTURE AND MANUFACTURING METHOD THEREOF - A light emitting diode package structure includes a frame, a light emitting diode chip electrically coupled to the frame, an upper packing portion covering the light emitting diode chip on the frame, and a lower packing portion circumferentially disposed on the frame for fixation and next to the upper packing portion. Lights from the light emitting diode chip are outwardly emitted through the upper packing portion. The lower packing portion is extended from and partially covered by the upper packing portion. | 06-03-2010 |
| 20100123144 | CIRCUIT STRUCTURE OF PACKAGE CARRIER AND MULTI-CHIP PACKAGE - A circuit structure of a package carrier including a plurality of chip pads, a first electrode, a second electrode, a third electrode and a fourth electrode is provided. These chip pads are arranged in an M×N array. A first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad are disposed clockwise in the peripheral area of each chip pad in sequence. The orientations of each of the first, second, third, and fourth bonding pads of the (S−1) | 05-20-2010 |
| 20100118532 | ILLUMINATION DEVICE AND LIGHT EMITTING DIODE MODULE - A light emitting diode (LED) module including a carrier, a first connector, a plurality of second connectors and a plurality of LEDs is provided. The carrier has a first edge and a plurality of second edges. The first connector is disposed on the first edge of the carrier and electrically connected to the carrier. The second connectors are disposed on the second edges and electrically connected to the carrier respectively. Each of the second connectors may correspond and be electrically connected to the first connector of the other LED module. The LEDs are disposed on the carrier and electrically connected to the carrier. | 05-13-2010 |
| 20100110703 | LIGHTING APPARATUS - A lighting apparatus including a base, a light emitting unit, and a conducting wire is provided. The base includes a bottom board and a side frame. The bottom board has a first surface, a second surface, a recess, a first through hole, and a second through hole. The recess is located at the second surface. The first through hole and the second through hole are located at the recess and pass through the bottom board. The side frame is disposed on the first surface. The light emitting unit is disposed on the first surface. An end of the conducting wire is electrically connected to the light emitting unit. The conducting wire extends from the first surface to the recess through the first through hole, and extends from the recess to an outer side of the first surface through the second through hole. | 05-06-2010 |
| 20100110685 | LIGHT TUBE - A light tube including a heat sink, a light transmissive cover disposed on the heat sink, and at least one light source module is provided. A containing space is formed between the heat sink and the light transmissive cover. The light source module includes a carrier, a plurality of first light-emitting devices, a plurality of second light-emitting devices, and a plurality of non-light-emitting passive devices. The carrier is disposed on the heat sink. The first light-emitting devices are arranged on the carrier along a first straight reference line to form a first line of light-emitting devices. The second emitting devices are arranged on the carrier along a second straight reference line to form a second line of light-emitting devices. The non-light-emitting passive devices are disposed on the carrier and between the first and second lines of light-emitting devices and electrically connected to the first and the second light-emitting devices. | 05-06-2010 |
| 20100109501 | CONNECTOR AND LIGHT SOURCE APPARATUS - A connector adapted to be disposed on a carrier and electrically connected to the carrier is provided. The connector includes an insulating base and two electrodes. The insulating base has a first side surface, a second side surface, a bottom surface, and two through holes. The bottom surface connects the first and the second side surfaces. The through holes extend from the first side surface to the second side surface. The electrodes respectively penetrate the through holes. Each electrode has a bar portion and a bending portion extending from the bar portion. The bar portion is located in the corresponding through hole and protrudes away from the first side surface. The bending portion extends on the second side surface and toward the carrier. An end of the bending portion penetrates through the carrier and is electrically connected to the carrier. A light source apparatus is also provided. | 05-06-2010 |
| 20100102354 | LIGHT EMITTING DIODE PACKAGE - A light emitting diode (LED) package includes a circuit board and an LED chip. The circuit board has a top circuit layer and an insulating layer. The top circuit layer is disposed on the insulating layer, and the material of the insulating layer is selected from a group consisting of diamond, diamond like coating (DLC), AlN, BN, CrN and TiN. The LED chip is disposed on the circuit board and electrically connected with the top circuit layer of the circuit board. Since the material of the insulting layer is selected from materials with a high thermal conductivity, the heat dissipation performance and light-emitting efficiency of the LED package can be enhanced. | 04-29-2010 |
| 20090283790 | CIRCUIT SUBSTRATE AND LIGHT EMITTING DIODE PACKAGE - A circuit substrate including a base layer and a plurality of lead units arranged as an array is provided, wherein the base layer has a plurality of through grooves, and the lead units are disposed on the base layer. Each of the lead units includes a common terminal and at least three leads. The common terminal is capable of being divided into a plurality of electrodes connected with each other. The leads are extended outwards from the edge of the common terminal, and each of the leads is extended outwards from the edge of one of the electrodes. The through grooves expose the common terminals of the lead units. | 11-19-2009 |
| 20090219699 | CIRCUIT BOARD WITH COOLING FUNCTION - The manufacturing process of a circuit board includes forming a thermal interface layer on a first metal thin layer of a thermal plate. Joining a second metal layer of a main circuit board comprises at least one opening with the thermal interface layer. Then, reflowing the main circuit board with the joined thermal plate. A circuit board with a cooling function using the foregoing manufacturing process is also provided. | 09-03-2009 |
| 20090146157 | LIGHT-EMITTING DIODE PACKAGE - An LED package is provided. The LED package includes a leadframe having a pair of first electrodes and a pair of second electrodes, an LED chip disposed on the leadframe, and an encapsulant encapsulating a portion of the leadframe and the LED chip. The pair of first electrodes and the pair of second electrodes are electrically connected with the LED chip. The pair of first electrodes and the pair of second electrodes are located outside the encapsulant. The encapsulant has a top surface, a bottom surface, a first side surface and a second side surface opposite to the first side surface, wherein the pair of first electrodes extend from the first side surface to the bottom surface, and the pair of second electrodes extend from the second side surface to the bottom surface. | 06-11-2009 |
| 20090045417 | LIGHT EMITTING SEMICONDUCTOR DEVICE - A light emitting semiconductor device is provided, wherein the light emitting semiconductor device comprises a substrate, a plurality of flip chips, a heat conductive board and an insulating board. These flip chips are electrically connected on the substrate. The heat conductive board has a protruding portion used to support the substrate. The insulating board has a plurality of connecting pads and an opening, wherein the protruding portion is sheathed in the opening, so as to expose the substrate. The exposed substrate is then electrically connected to the connecting pads. | 02-19-2009 |
| 20090032822 | HIGH POWER LIGHT EMITTING DIODE - A high power light emitting diode, The high power light emitting diode comprises a light emitting diode chip, a main module, two first electrode pins, two second electrode pins, and at least one heat dissipation board. The main module has a concave and the light emitting diode chip is positioned in the concave. The first electrode pins are connected to a first side of the main module and also electrically connected to the light emitting diode chip. The second electrode pins are arranged on a second side of the main module that is relative to the first electrode pins wherein the second electrode pins and the first electrode pins are electrically opposite. The second electrode pins are electrically connected to the light emitting diode chip. The heat dissipation board is connected to a part of the main module between the first electrode pin and the second electrode pin. | 02-05-2009 |
| 20090026484 | LIGHT EMITTING DIODE DEVICE - A light emitting diode device is disclosed, and the light emitting diode device includes a base, a substrate, a lead frame, a chip, a first mixed layer and a second mixed layer. The first mixed layer and the second mixed layer respectively contain a glue and a thermal conductance insulating material, such as diamond carbon, diamond-like carbon or ceramic. The substrate and the lead frame are set on the base. The first mixed layer is formed between the chip and the substrate to fix the chip and strengthen heat dissipation. The second mixed layer is covered on the substrate and the chip to reduce the difference of the refraction index such that the total internal reflection angle is wider and the emitting efficiency is enhanced. | 01-29-2009 |
| 20090014913 | METHOD FOR FABRICATING LENS OF LIGHT EMITTING DIODE AND DEVICE THEREOF - A method for fabricating lens of light emitting diode and device thereof is disclosed, and the method includes providing a lead frame with multiple light emitting diode modules, positioning a mold releasing member on the lead frame, connecting a lens pattern device with the lead frame, injecting a resin into each lens mold, and curing the resin to lenses on the light emitting diodes modules. | 01-15-2009 |
| 20080291360 | Light emitting diode back light module - An LED back light module includes a metal support, a thermal conductive material, a circuit board and at least one light emitting diode. The metal support has a recess and a plurality of holes. The thermal conductive material has a first surface in contact with a bottom of the recess. The circuit board is disposed on a second surface of the thermal conductive material, in which the circuit board has a plurality of flanges lodged into the holes of the metal support for compacting the circuit board, the thermal conductive material and the metal support. The light emitting diode is disposed on the circuit board, in which the thermal energy generated by the light emitting diode is delivered to the metal support through the circuit board and the thermal conductive material. | 11-27-2008 |
| 20080283856 | Light-emitting diode module and the manufacturing thereof - A method for manufacturing a light-emitting diode (LED) module is provided. Plural LED package structures are formed on a substrate first. A space is located between two adjacent LED package structures. A Lens laminated plate is subsequently bonded to the LED package structures. The lens laminated plate includes plural lenses, and each lens is located right above a LED of each LED package structure. Finally, plural LED modules are formed by cutting the substrate along the space. A LED module structure is also disclosed. | 11-20-2008 |
| 20080218051 | Socket LED device - A socket LED device includes a first body, a second body, a conducting device, a heat-dissipation device and an LED module. The first body is demountably connected to the second body. The heat-dissipation device is set between the first body and the second body. The conducting device includes two conducting pins and two conducting sockets respectively located on the first connecting surface and the second connecting surface to embed with each other. The LED module is secured on the first body and includes a heat-conducting substrate touching the heat-dissipation device and a conductive portion electrically connected with the conducting pins. Therefore, the heat is gradually decreased through this kind of stacked formation. | 09-11-2008 |
