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ETHERTRONICS, Inc.

ETHERTRONICS, Inc. Patent applications
Patent application numberTitlePublished
20110221638INTERNAL LC ANTENNA FOR WIRELESS COMMUNICATION DEVICE - An L-shape Corner (LC) Antenna uses an L shaped antenna on the corner of a circuit board of a wireless device. The low band element is positioned and designed to be resonate along the long edge of the adjacent ground plane while the high band element (H) is positioned and designed to be resonate along the short edge of the adjacent ground plane. The PCB (printed circuit board) of the wireless device that the antenna is integrated into can provide the ground plane function. The single antenna element provides two separate radiating sections that allow for optimization of low and high band resonances that are often required to service the cellular and other wireless frequency bands. The two radiating sections of the antenna provide different polarizations for the two resonances that assist in de-coupling the two resonances from each other. Both antenna elements can be an Isolated Magnetic Dipole (IMD) antenna; conversely, one of the two antenna elements can be an IMD element.09-15-2011
20110012800ANTENNA WITH ACTIVE ELEMENTS - A multi-frequency antenna comprising an IMD element, one or more active tuning elements and one or more parasitic elements. The IMD element is used in combination with the active tuning and parasitic elements for enabling a variable frequency at which the antenna operates, wherein, when excited, the parasitic elements may couple with the IMD element to change an operating characteristic of the IMD element.01-20-2011
20100283691SPATIAL FILTER FOR NEAR FIELD MODIFICATION IN A WIRELESS COMMUNICATION DEVICE - A spatial filter is developed for specific absorption rate (SAR) reduction in a wireless device. A conductive element is designed to modify the near field distribution of an antenna operating in a wireless device. This reduces SAR while minimizing degradation of antenna efficiency at one or several frequency bands that the antenna is designed to operate over. Lumped reactance can be designed into the conductive element to generate low pass, band pass, and/or high pass frequency characteristics. Distributed reactance can be designed into the conductive element to replace or to work in conjunction with the lumped reactance. Active components can be designed into the conductive element to provide dynamic tuning of the frequency response of the conductive element.11-11-2010
20100259457MULTI-FREQUENCY, NOISE OPTIMIZED ACTIVE ANTENNA - A multi-frequency, noise optimized active antenna consisting of one or several actively tuned antennas optimized over incremental bandwidths and capable of tuning over a large total bandwidth. One or multiple impedance transformers are connected to the antennas at an optimal location, with the transformers acting to reduce the impedance for optimal coupling to a transceiver/receiver. Active components can be incorporated into the antenna structures to provide yet additional extension of the bandwidth along with increased optimization of antenna performance over the frequency range of the antenna. The radiating elements can be co-located with a ferrite material and/or active components coupled to the element to tune across a wide frequency range.10-14-2010
20100259456MULTI-LAYER REACTIVELY LOADED ISOLATED MAGNETIC DIPOLE ANTENNAA - A multi-layer reactively loaded isolated magnetic (IMD) dipole with improved bandwidth and efficiency characteristics to be used in wireless communications and other applicable systems. The multi-layer IMD antenna comprises a first element positioned above a ground plane, a second element positioned above a ground plane and coupled to the first portion. Reactive components are integrated into one or both elements to optimize the frequency response of the antenna. The range of frequencies covered to be determined by the shape, size, and number of elements in the physical configuration of the components. Portions of or the entire ground plane can be removed beneath the elements.10-14-2010
20090231206LOW COST INTEGRATED ANTENNA ASSEMBLY AND METHODS FOR FABRICATION THEREOF - A conductive layer is applied to a thermoformed plastic component to form an integrated antenna assembly. The conductive layer is on a flexible layer and adhered or attached to the rigid thermoformed plastic carrier. Features are designed into the thermoformed plastic carrier to provide electrical contacts from the conductive layer to the circuit board of the communication device and to mechanically attach the carrier to the circuit board. Multiple conductive layers can be applied to a multi-layered thermoformed structure to form a multi-antenna assembly.09-17-2009

Patent applications by ETHERTRONICS, Inc.