ESI-PyroPhotonics Lasers, Inc. Patent applications |
Patent application number | Title | Published |
20140126041 | FIBER AMPLIFIERS AND FIBER LASERS WITH REDUCED OUT-OF-BAND GAIN - A method of operating a fiber amplifier characterized by a spectral gain curve includes providing an input signal at a signal wavelength. The signal wavelength lies within an in-band portion of the spectral gain curve extending from a first in-band wavelength to a second in-band wavelength, the in-band portion being characterized by a first amplitude range. The method also includes providing pump radiation at a pump wavelength. The pump wavelength is less than the signal wavelength. The method further includes coupling the pump radiation to the fiber amplifier and amplifying the input signal to generate an output signal. All portions of the spectral gain curve at wavelengths less than the first in-band wavelength and greater than the pump wavelength are characterized by a second amplitude less than or equal to 10 dB greater than the first amplitude range. | 05-08-2014 |
20130183046 | METHODS AND SYSTEMS FOR A PULSED LASER SOURCE EMITTING A PREDETERMINED OUTPUT PULSE PROFILE - A method of operating an optical amplifier includes determining a gain of the optical amplifier and providing a modulator drive signal to an optical signal source. The modulator drive signal is a function of the gain of the optical amplifier. The method also includes producing an input optical signal using the optical signal source. The input optical signal includes a first plurality of pulses, each of the first plurality of pulses having an amplitude related to the modulator drive signal. The method further includes coupling the input optical signal to the optical amplifier and amplifying the input optical signal using the optical amplifier to produce an output optical signal including a second plurality of pulses. | 07-18-2013 |
20130168797 | METHOD AND STRUCTURE FOR USING DISCONTINUOUS LASER SCRIBE LINES - A thin film photovoltaic device includes a substrate and a first conductive layer coupled to the substrate. The first conductive layer includes at least one first groove extending through a first portion of the first conductive layer to a portion of the substrate. The device also includes at least one semiconductor layer coupled to a remaining portion of the first conductive layer and the portion of the substrate. The at least one semiconductor layer includes a plurality of non-overlapping vias, each via extending through a portion of the at least one semiconductor layer to a portion of the first conductive layer. The device further includes a second conductive layer coupled to a remaining portion of the at least one semiconductor layer and portions of the first conductive layer. The second conductive layer includes at least one second groove extending through a portion of the second conductive layer to a portion of the at least one semiconductor layer. | 07-04-2013 |
20120111841 | METHOD AND APPARATUS FOR DRILLING USING A SERIES OF LASER PULSES - A series of laser pulses, each pulse characterized by one or more predetermined pulse characteristics including wavelength, pulse energy, inter-pulse time interval, pulse width or pulse shape, is provided to drill a hole in a material. Drilling the hole in the material is achieved by placing the series of laser pulse spots at the location wherein the hole is to be drilled. One or more characteristics of one or more laser pulses in the series is changed in order to optimize the drilling process for the hole. The ability to change the characteristics of one or more laser pulses in the series of pulses to optimize the drilling process results in holes with desired attributes and a high drilling rate. | 05-10-2012 |
20110129958 | METHOD AND APPARATUS FOR SCRIBING A LINE IN A THIN FILM USING A SERIES OF LASER PULSES - A series of laser pulses in a pulse train, each pulse with a predetermined temporal power shape, scribes a line in a thin film of material on a substrate. The predetermined temporal pulse shape has a fast risetime and fast falltime and a pulse length between 10% power points of less than 10 ns. Scribing a line in the thin film is achieved by placing the series of laser pulse spots on the line to be scribed such that there is some overlapping area between adjacent laser pulse spots along the line. The use of a series of laser pulses with the predetermined pulse shape to scribe a line in the thin film results in a better quality and cleaner scribing process compared to that achieved with a conventional pulse shape. | 06-02-2011 |