| ESEC AG Patent applications |
| Patent application number | Title | Published |
|---|
| 20110214819 | Method For Detaching And Removing A Semiconductor Chip From A Foil - The detachment and removal of a semiconductor chip from a foil occurs in accordance with the invention in three phases. In the first phase there is a partial detachment of the semiconductor chip from the foil with mechanical means, but without the participation of a chip gripper. In the second phase the semiconductor chip is further detached from the foil, with the semiconductor chip being held by the chip gripper. In the third phase the chip gripper is lifted and moved away. | 09-08-2011 |
| 20100315655 | Method And Device For Measuring A Height Difference - Determination of the height difference between a first reference point and a second reference point, at least one of the two reference points lying on a semiconductor chip, which is mounted on a substrate, comprises the steps | 12-16-2010 |
| 20100233369 | Method Of Forming A Paste Pattern - A method of forming a paste pattern on a surface of a body comprises moving a writing nozzle delivering the paste relatively to the surface of the body along a sequence of segment lines following each other. Each segment line has a start point and an end point and at least one of the segment lines has a section with a curvature. The curvature of each segment line having a section with a curvature changes continuously. Said moving comprises stopping the writing nozzle at the end point of each segment line. | 09-16-2010 |
| 20100107405 | Die-Ejector - A die ejector comprises a chamber which can be subjected to vacuum and comprises a cover plate having a hole, a plurality of plates which are arranged in the interior of the chamber, protrude into the first hole and are jointly and also individually displaceable in a direction extending perpendicularly or in an oblique way in relation to the surface of the cover plate, and drive means in order to displace the plates. The drive means comprise a drive mechanism which comprises a motor and a pin which can be moved along a predetermined path and which is movable by the motor between two positions back and forth. Each of the plates comprises a path-like opening. The pin is guided through the path-like opening of each of the plates. The path-like opening is different from plate to plate in such a way that the plates are displaced in a predetermined sequence in the mentioned direction when the pin is moved along the path. | 05-06-2010 |
| 20100040449 | Apparatus For Mounting A Flip Chip On A Substrate - The invention relates to an apparatus for mounting semiconductor chips as flip chip on a substrate. The apparatus comprises means for supplying the semiconductor chips, a pick-and-place system with a bonding head with a chip gripper, a flipping apparatus with a gripper and two cameras. The first camera is used for determining the actual position of the semiconductor chip that is provided by the said means for mounting before the flipping apparatus receives the semiconductor chip, and it is used to determine the actual position of the flip chip received by the chip gripper of the bonding head once the flipping apparatus has transferred the semiconductor chip. The apparatus comprises an optical switch in accordance with the invention, e.g., a rotatably held mirror which is located in the field of view of the first camera. In operation, the mirror is rotated simultaneously with the gripper of the flipping apparatus, but only by half the angle. | 02-18-2010 |
