| EPISIL TECHNOLOGIES INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20110057262 | SEMICONDUCTOR DEVICE - A semiconductor device including a substrate, an epitaxial layer, a first sinker, a transistor, a diode unit, a first buried layer, and a second buried layer is provided. When the semiconductor device is operated at the high voltage, the highly large substrate current due to the external load is avoided through the diode unit disposed in the semiconductor device of an embodiment consistent with the invention. Furthermore, according to the design of the semiconductor device, the issue of the narrow input voltage range is improved, and interference of the semiconductor device with the other semiconductor devices is prevented. | 03-10-2011 |
| 20090061582 | MANUFACTURING METHOD OF NON-VOLATILE MEMORY - A manufacturing method of a non-volatile memory includes first providing a substrate for defining multiple pairs of active regions; forming a control gate in one of each pair of the active regions of the substrate; sequentially forming a gate oxide layer, a conductor layer, and a patterned mask layer on the substrate, wherein the patterned mask layer exposes a portion of the conductor layer; forming a first dielectric layer on the exposed portion of the conductor layer; removing the patterned mask layer; removing the conductor layer without covering the first dielectric layer, and using the remained conductor layer as the floating gate; forming a second dielectric layer on sidewalls of the floating gate; forming an erase gate above the floating gate and correspondingly above the control gate, and forming a source region and a drain region in the other one of each pair of the active regions | 03-05-2009 |
| 20090059679 | ERASING METHOD OF NON-VOLATILE MEMORY - An erasing method of a non-volatile memory is provided. The non-volatile memory includes a control gate disposed in a substrate, a floating gate, a gate oxide layer disposed between the floating gate and the substrate, a source region disposed in the substrate, a drain region disposed in the substrate, a first dielectric layer disposed on the floating gate, a second dielectric layer disposed on sidewalls of the floating gate, and an erase gate. The erasing method includes applying a first voltage on the control gate, applying a second voltage on the drain, applying a third voltage on the source, applying a fourth voltage on the erase gate, and applying a fifth voltage on the substrate, such that electrons are drawn from the floating gate to the erase gate to be erased. | 03-05-2009 |
