| EPCOS AG Patent applications |
| Patent application number | Title | Published |
|---|
| 20120127767 | Low-Current Inverter Circuit - The circuit includes an E-mode transistor with gate-source junction, a D-mode transistor with gate-source junction, a component generating a voltage drop between the source of the D-mode transistor and the drain of the E-mode transistor, and a connection between the drain of the E-mode transistor and the gate of the D-mode transistor. The gate of the E-mode transistor is provided for an input signal, and the drain of the E-mode transistor is provided for an output signal. | 05-24-2012 |
| 20120119616 | Piezoelectric Multilayer Component - A piezoelectric multilayer component includes a stack of sintered piezoelectric layers and inner electrodes that are arranged there between. A piezoelectric layer includes at least one piezoelectric film. At least one of the piezoelectric films is designed as a weakening film, wherein the thickness of the weakening film is substantially smaller than the thickness of at least one of the other piezoelectric films. | 05-17-2012 |
| 20120115355 | APPLIANCE INSTALLATION DEVICE AND METHOD FOR PRODUCING THE SAME - An appliance installation device for connection of an electrical appliance to a power supply system comprising a connecting unit for electrical connection of the appliance installation device to the power supply system, a housing, a mounting frame which has at least one aperture opening open on two sides, wherein the connecting unit, the mounting frame and the housing each form an individual module and the individual modules are connected to one another. | 05-10-2012 |
| 20120114145 | Microphone Arrangement - A microphone arrangement has an SMD housing with a sound inlet opening. A transducer receives sound waves through the sound inlet opening and converts the received sound waves into electrical signals. An analog-to-digital converter provides digital signals. An interface control unit with a digital interface is used by the chip to transmit data serially to an external device. At least one further interface is connected to a peripheral device such that the at least one further interface can be used to transmit data between the peripheral devices and the interface control unit. The transducer, the analog-to-digital converter, the interface control unit and the at least one further interface are integrated in the SMD housing. | 05-10-2012 |
| 20120113408 | Radiation Sensor for Detecting the Position and Intensity of a Radiation Source - A radiation sensor is provided for detecting the position and intensity of a radiation source. The radiation sensor includes at least one photodetector having a radiation-sensitive surface. Furthermore, the radiation sensor includes a reflector that reflects the radiation emitted by a radiation source from specific directions at least partly in the direction of the radiation-sensitive surface of the photodetector. The reflector is arranged on that side of the radiation sensor that is remote from the radiation source. | 05-10-2012 |
| 20120112834 | Device Comprising a Controlled Matching Stage - A device includes a matching stage coupled between a first signal terminal and a second signal terminal. A signal path extends between the first signal terminal and the second terminal. An adjustable impedance element is connected to the signal path. A detection circuit is coupled to the signal path and configured to derive matching information. A control circuit is coupled between the detection circuit and the adjustable impedance element. The control circuit is configured to control the adjustable impedance element. | 05-10-2012 |
| 20120112801 | Low-Current Input Buffer - A current-limited differential entry stage compares an input signal to a reference voltage generated by a current-limited transistor or diode configuration. Current limiters comprise a D-mode feedback transistor having a gate-source junction. The D-mode transistor is not conducting between the source and the drain if a gate-source voltage is more negative than a negative threshold voltage, and conducting between the source and the drain, otherwise a feedback connection connects the source of the D-mode feedback transistor to its gate via a component that generates a voltage drop. | 05-10-2012 |
| 20120112793 | Low-Current Logic-Gate Circuit - A circuit includes E-mode transistors with gate-source junction, a D-mode transistor with gate-source junction. A component generates a voltage drop between the source of the D-mode transistor and the drain of an E-mode transistor provided as a signal output. A connection is made between this drain of the E-mode transistor and the gate of the D-mode transistor, and a signal input at the gates of the E-mode transistors. | 05-10-2012 |
| 20120098386 | Ceramic Material, Method for Producing said Ceramic Material and Component Comprising said Ceramic Material - The invention relates to a ceramic material of the formula [(Bi | 04-26-2012 |
| 20120093346 | MEMS MICROPHONE - A microphone package wherein an MEMS microphone chip (MIC) is mounted on a substrate (SUB) and is sealed with a cover (ABD) with respect to the substrate. The membrane (MMB) of the microphone chip is connected to a sound entry opening (SEO) in the substrate via an acoustic channel. As a result of defined dimensioning of, in particular, the cross section and length of sound entry opening and channel, an acoustic low-pass filter is formed, the −3 dB attenuation point of which is significantly below the natural resonance of microphone membrane and package. | 04-19-2012 |
| 20120093046 | Antenna Arrangement - An antenna arrangement has a first signal path connected to a first antenna. A second signal path is connected to a second antenna. A third signal path includes a device that measures the signal strength. Directional couplers couple the first and second signal paths to the third signal path. Filters filter out signal components that are coupled by one antenna into the other antenna. | 04-19-2012 |
| 20120091862 | Electrode, Microacoustic Component and Production Method for an Electrode - A microacoustic component includes an active layer and an electrode. The electrode includes a first metal layer facing the active layer, a second metal layer facing away from the active layer, and a third layer arranged between the first metal layer and the second metal layer. The third layer serves as a diffusion barrier. | 04-19-2012 |
| 20120063368 | Communication System and Method for Transmitting and Receiving Signals - A communication system transmits signals having frequencies that lie within a transmission band and receives signals having frequencies that lie within a reception band. The system includes a duplexer and an antenna. The duplexer includes a transmission branch and a reception branch. The transmission branch includes a transmission filter, a transmission phase shifting network and a transmission matching network. The reception branch includes a reception filter, a reception phase shifting network and a reception matching network. The transmission matching network and the reception matching network have predominately constant phase shifts over frequencies within the reception band and within the transmission band, respectively. The antenna is coupled to the transmission matching network and to the reception matching network, and shows a predominantly reactance-only impedance variation over frequencies in the transmission band and over frequencies in the reception band. | 03-15-2012 |
| 20120062431 | Front End Module Comprising an Antenna Tuner - A front end module for a wireless transmission/reception device has two antennas and two signal paths connected thereto. A mismatch in the antenna is identified by monitoring the transmitted power and the reflected power in the active and passive signal paths and using the powers in a controller to generate a control signal for the antenna tuner. In this case, decreasing isolation between the first and second antennas and the first and second signal paths is identified, and is compensated for using different devices, in order to ensure faster and safer antenna matching. | 03-15-2012 |
| 20120062075 | Piezoelectric Component - A piezoelectric component includes a stack of piezoelectric layers arranged one on top of the other and first and second electrode layers arranged therebetween. The stack includes at least one first piezoelectric layer having a first electrical coercive force and directly adjacent thereto at least one second piezoelectric layer having a second electrical coercive force different from the first coercive force. | 03-15-2012 |
| 20120061778 | Method and Apparatus for Producing Chip Devices, and Chip Device Produced by Means of the Method - A chip device is produced providing at least one wafer having a plurality of chip components. The wafer or wafers are separated into the individual chip components and/or into groups of chip components. The individual chip components and/or the groups of chip components are applied to a carrier element, in such a way that interspaces having a predetermined width are formed between the individual chip components and/or the groups of chip components. A polymer is introduced into the interspaces in order to form a composite element composed of the chip components and a polymer matrix. The composite element is separated in such a way that chip devices composed of in each case one of the chip components and at least one section of the polymer matrix are formed. The invention furthermore relates to a chip device produced by means of the method. | 03-15-2012 |
| 20120057617 | SENSOR ARRANGEMENT AND METHOD FOR PRODUCTION - A sensor arrangement has at least one sensor element with electrical connections. At least one sensor element is arranged in a solid plastic-material body, at least a first insulating layer, which encloses the sensor element, being arranged between the sensor element and the plastic-material body. The sensor element senses at least one physical property of a medium to be measured. | 03-08-2012 |
| 20120056507 | Microacoustic Component and Production Method - The microacoustic component has a substrate that has at least one layer (composed of a dielectric or piezoelectric material, and a metallic strip structure. The layer is composed of a dielectric or piezoelectric material and/or the metallic strip structure have/has been produced or can be produced by the atomic layer deposition method. | 03-08-2012 |
| 20120044039 | Electrical Multilayer Component - The electrical multilayer component includes a base body with external electrodes and internal electrodes. A ceramic varistor layer is provided with the first internal electrode, and a dielectric layer adjoins the varistor layer. The dielectric layer has at least one opening filled with a semiconducting material or a metal. | 02-23-2012 |
| 20120032757 | Multilayer Component and Production Method - A multilayer component includes a dielectric ceramic material that can be co-sintered with a varistor ceramic to form a monolithic multilayer component according to the invention. The multilayer component therefore includes a layer of a varistor ceramic and another layer of a dielectric. Both layers can be arranged directly adjacent to one another in the multilayer component. In the multilayer component, metallizations are arranged on or between the ceramic layers. The metallizations are structured to form conductor sections and metallized areas. The metallizations form together with the ceramic layers alongside a varistor at least one further component selected from at least one of the component functions. | 02-09-2012 |
| 20120019972 | Surge Arrester and Arrangement of a Plurality of Surge Arresters to Form an Array - A surge arrester includes a gas-filled closed arrester body that is formed by a first annular ceramic body and two electrodes at a distance from one another. A second annular ceramic body is arranged in the interior of the arrester body and is at a distance from the first ceramic body and has a physical height that is less than the physical height of the first ceramic body. | 01-26-2012 |
| 20120019107 | Piezo Actuator in Multi-Layered Construction - A multilayer piezo actuator is specified, in which piezoelectric layers and electrode layers are arranged to form a stack. Electrical contact is made with the electrode layers via two external electrodes which consist of wires which are woven with one another. The external electrodes are in this case connected over their entire area to the side surfaces of the stack. A method is also specified for fitting an external electrode. | 01-26-2012 |
| 20120014029 | Surge Arrester - A surge arrester includes a housing with a tubular insulating body and at least two electrodes. A layer sequence includes at least one electrically conductive or semiconductive layer, at least one electrically conductive layer and at least one insulating layer and is arranged at least in sub-areas on the inside of the insulating body. | 01-19-2012 |
| 20120007695 | High-Frequency Swinging Choke - A high-frequency swinging choke has at least two rod cores arranged next to one another in the longitudinal direction. The rod cores each have at least one winding. The windings are connected in series. | 01-12-2012 |
| 20120007690 | Adaptive Impedance Matching Network - An adjustable impedance matching network for providing an adjustable matching impedance (Rm) is presented. The matching network includes first and second impedance adjusting circuits. The first impedance adjusting circuit is adapted to adjust the value of an imaginary part of the matching impedance whilst substantially maintaining the value of a real part of the matching impedance based on frequency information frequency and a target reference value. The second impedance adjusting circuit is adapted to adjust the value of an imaginary part of the matching impedance to be substantially equal to zero based on the frequency information, so as to adjust the real part of the matching impedance to be substantially equal to the target reference value. | 01-12-2012 |
| 20120007475 | CONSTRUCTION ELEMENT THAT OPERATES WITH ACOUSTIC WAVES, AND METHOD FOR THE MANUFACTURE THEREOF - A component that operates with acoustic waves includes a substrate including a piezoelectric material, a first electrode plane in which bottom electrode structures including an acoustically active bottom electrode are arranged directly on the substrate, and a top electrode arranged above the bottom electrode plane and which is electrically conductively connected to the bottom electrode structures, wherein excitation of the acoustic waves during operation of the component is effected exclusively or predominantly through the bottom electrode structures. | 01-12-2012 |
| 20120001727 | SAW FILTER - A SAW filter includes at least four electrically interconnected DMS tracks. First and second tracks of the at least four DMS tracks are connected in parallel in opposite directions to form a first filter element. The first and second tracks have two resonant frequencies that are offset from one another from track to track within the first filter element such that they define a common passband by virtue of a lower-frequency resonance of the first track being in phase at the same frequency as a higher-frequency resonance of the second track. Third and fourth tracks of the at least four DMS tracks can be connected in a similar fashion to form a second filter element. The passbands of the first and second filter elements are offset from one another and each comprise one of two channels of a two-channel filter. | 01-05-2012 |
| 20110319255 | VARISTOR CERAMIC, MULTILAYER COMPONENT COMPRISING THE VARISTOR CERAMIC, AND PRODUCTION METHOD FOR THE VARISTOR CERAMIC - A varistor ceramic includes the following materials: Zn as the main component, Pr in a proportion of 0.1 to 3 atom %, and a metal M selected from Y, Ho, Er, Yb and Lu in a proportion of 0.1 to 5 atom %. | 12-29-2011 |
| 20110316649 | Reactance Filter Having a Steep Edge - A reactance filter includes a series branch that connects a signal input to a signal output. At least one parallel branch branches off from the series branch with respect to ground. A parallel resonator is arranged in each parallel branch. Two or more series resonators are connected in series in the series branch. A capacitor is connected in parallel with one of the series resonators in the series branch. | 12-29-2011 |
| 20110299220 | Electrical Multi-Layered Component and Circuit Arrangement Comprising the Same - An electrical multi-layered component includes a monolithic base member that has a plurality of ceramic layers and electrode layers disposed one on top of the other in alternating fashion. The base member includes two end surfaces opposite to one another and two side surfaces opposite to one another. The multi-layered component includes a plurality of external electrodes and a plurality of internal electrodes (designed into the electrode layers. The internal electrodes at least partially overlap and form overlap areas. Each internal electrode is associated with a respective external electrode. At least one first internal electrode extending from an end surface overlaps with at least one second internal electrode ( | 12-08-2011 |
| 20110299213 | VARISTOR CERAMIC, MULTILAYER COMPONENT COMPRISING THE VARISTOR CERAMIC, AND PRODUCTION METHOD FOR THE VARISTOR CERAMIC | 12-08-2011 |
| 20110299211 | Surge Arrester Having a Short-Circuit Device - A surge arrester includes a short-circuit device. The short-circuit device includes at least one first base element. The first base element is rigidly connected in an electrically conducting and mechanical manner to a first electrode of the surge arrester. The short-circuit device also includes at least one spring arm arranged on the base element. The free end of the spring arm has a distance to the base element, and the spring arm extends over at least two adjoining electrodes of the surge arrester. | 12-08-2011 |
| 20110298685 | Impedance Adjustment Circuit for Adjusting Planar Antennas - An impedance matching circuit for matching planar antennas includes a signal path with a signal path input and a signal path output. A first capacitive element with variable capacitance is connected between the signal path input and signal path output. A second capacitive element with variable capacitance is connected between the signal path and ground. A first inductive element is connected between the signal path input and ground. A second inductive element is connected between the signal path output and ground. An antenna line with an impedance between 30 and 60 ohm is connected to the signal path output. | 12-08-2011 |
| 20110298337 | Piezoelectric Multilayer Component having a Disturbance Material and Method of Forming Same - A piezoelectric multilayer component includes a stack of piezoceramic layers, which are arranged one on top of the other, and electrode layers. The stack has a first area and a second area. The second area contains a disturbance material, which is used to make the second area less mechanically robust than the first area. | 12-08-2011 |
| 20110298064 | SENSOR MODULE AND METHOD FOR PRODUCING SENSOR MODULES - Sensor module, comprising a carrier, at least one sensor chip and at least one evaluation chip which is electrically coupled to the sensor chip. The carrier has a cutout, in which the sensor chip is at least partly situated. The evaluation chip is arranged on the carrier and at least partly covers the cutout. | 12-08-2011 |
| 20110297666 | Heating Apparatus and Method for Producing the Heating Apparatus - A heating apparatus and a method for producing a heating apparatus are specified. The heating apparatus comprises a pipe ( | 12-08-2011 |
| 20110291522 | Ceramic Material, Method for the Production of the Ceramic Material and Component Comprising the Ceramic Material - The invention relates to a ceramic binary material and to a method for the production thereof. The material has piezoelectric properties and has a composition of the formula (1−x)(Bi | 12-01-2011 |
| 20110280147 | Front-End Module and Method for Testing a Front-End Module - For simpler and more rapid testing of a front-end module, additional linked operating states are provided in the switch and/or its decoder and allow a plurality of paths to be enabled in parallel, in order in this way to test these paths with a smaller number of test routines in a test set, in particular a network analyzer. | 11-17-2011 |
| 20110277913 | Method for Producing a Multilayer Element - A ceramic multilayer element can be produced by pressing together a plurality of ceramic multilayer segments. Each multilayer segment includes a stack of a plurality of ceramic layers that are pressed together. | 11-17-2011 |
| 20110261536 | Electronic Component Assembly Comprising a Varistor and a Semiconductor Component - An electric component assembly comprising a semiconductor component ( | 10-27-2011 |
| 20110259502 | Ceramic Material, Method for Producing the Same, and Electro-Ceramic Component Comprising the Ceramic Material - A method for producing a ceramic material is disclosed. A ceramic raw material mixture is produced by comminuting and mixing starting materials containing Pb, Zr, Ti, Nd and oxygen. Nickel or an nickel compound is introduced. The raw material mixture is calcined and a ceramic is sintered. | 10-27-2011 |
| 20110254652 | PTC-RESISTOR - A PTC-resistor includes a base body made of a ceramic material with a positive temperature coefficient of resistance. The base body extends along a median plane, and is confined by surfaces. At least one surface is configured to electrically connect the base body. An area of the at least one surface is larger than an area of a parallel projection of the base body in a direction perpendicular to the median plane. | 10-20-2011 |
| 20110248794 | Antenna Duplexer with High GPS Suppression - An antenna duplexer includes a transmission filter which operates in a transmission frequency band and has a transmission filter output. A reception filter operates in a reception frequency band and has a reception filter output. An antenna connection is connected to the transmission filter output and a matching element is connected between the antenna connection and the reception filter input. The circuit formed from the transmission filter, reception filter and matching element attenuates transmission signals in a frequency band whose frequencies f are in the interval 0.50*f | 10-13-2011 |
| 20110241076 | P-type Field-Effect Transistor and Method of Production - An n-layer is arranged above a substrate, which can be GaAs, and a p-layer ( | 10-06-2011 |
| 20110233690 | SEMICONDUCTOR CHIP ARRANGEMENT WITH SENSOR CHIP AND MANUFACTURING METHOD - On a carrier ( | 09-29-2011 |
| 20110230068 | COMPONENT COMPRISING A CHIP IN A CAVITY AND A STRESS-REDUCED ATTACHMENT - A mechanically improved component comprising a chip in a cavity and a stress-reduced attachment is specified. A component comprises an opening in a housing, an opaque cover or a mechanically flexible line connector, which is attached to two locations. | 09-22-2011 |
| 20110221543 | Impedance Matching Circuit for Matching Planar Antennas - A circuit includes a signal path having a node between a signal path input and a signal path output. A first inductive element is connected between the signal path input and the node and a first capacitive element whose capacitance is variably adjustable is connected between the node and the signal path output. A second variable-capacitance capacitive element is connected between the signal path input and ground. A second inductive element is connected between the node and ground, and a third inductive element is connected between the signal path output and ground. | 09-15-2011 |
| 20110221037 | Electronic Component Arrangement Comprising a Varistor and a Semiconductor Component - An electric component arrangement is described, comprising a semiconductor component ( | 09-15-2011 |
| 20110215789 | BANDGAP REFERENCE CIRCUIT AND METHOD FOR PRODUCING THE CIRCUIT - Bandgap reference circuit, comprising a voltage generator (VG) designed to produce a voltage or a current proportional to absolute temperature, a supply circuit (SC), designed to produce a supply for operating the voltage generator (VG), comprising a bias element (BS) and a control element (CS), and a bias circuit (BC), designed to produce a bias for operating the voltage generator (VG), comprising a bias element (BB) and a control element (CB). At least one of the control element (CS) of the supply circuit (SC) and the control element (CB) of the bias circuit (BC) comprises a pseudomorphic high-electron-mobility transistor or a hetero-junction bipolar transistor and/or at least one of the bias element (BS) of the supply circuit (SC) and the bias element (BB) of the bias circuit (BC) comprises a long-gate pseudomorphic high-electron-mobility transistor or a resistor. Method for producing the circuit wherein the pseudomorphic high-electron-mobility transistors and the hetero-junction bipolar transistors are produced using a GaAs BiFET technology process. | 09-08-2011 |
| 20110215674 | Piezoelectric Actuator of a Multilayer Design and Method for Fastening an Outer Electrode in a Piezoelectric Actuator - A piezoelectric actuator of a multilayer design includes outer electrodes that are fastened by means of a bonding layer applied by thermal spraying. For example, the outer electrodes are formed as a woven wire fabric. Furthermore, a method for fastening an outer electrode in a piezoelectric actuator is specified. | 09-08-2011 |
| 20110214905 | Circuit Board with Flexible Region and Method for Production Thereof - A circuit board comprising a circuit carrier, a cover layer composed of a nonconductive material, comprising an organic substance, arranged on the circuit carrier, a first metallization layer at least partly arranged on the cover layer, wherein the first metallization layer has a flexible region. | 09-08-2011 |
| 20110210901 | Front-End Circuit for Improved Antenna Performance - A front-end circuit includes a signal path and a first antenna port. A first antenna switch is electrically connected to the first antenna port. A second antenna port is electrically connectable or connected to the signal path. An antenna termination circuit is electrically connected to the first antenna switch. The antenna termination includes an impedance element. The first antenna switch electrically connects the first antenna port to the antenna termination circuit when the signal path is electrically connected to the second antenna port. | 09-01-2011 |
| 20110210805 | Duplexer and Method for Increasing the Isolation Between Two Filters - A duplexer includes an antenna terminal, a transmission amplifier terminal and a reception amplifier terminal. The transmission amplifier terminal is coupled to the antenna terminal via a transmission filter. The reception amplifier terminal is coupled to a reception filter and the reception filter is coupled to the antenna terminal via a band-stop filter. | 09-01-2011 |
| 20110210714 | Circuit for Generating a Control Current - A circuit includes a supply voltage and a control current line including two resistors. A sink current line branches off from the control current line between the resistors. A current sink transistor has an emitter that is connected to the sink current line and a collector that is connected to ground via a first further resistor. At least one reference transistor has an emitter that is connected to its base, to the supply voltage via a second further resistor and to the base of the current sink transistor. The collector of the reference transistor is connected to ground or to an emitter of a further reference transistor, which is switched in a manner similar to the first reference transistor. | 09-01-2011 |
| 20110188161 | Electric Component Assembly - An electric component arrangement is described, comprising a semiconductor component ( | 08-04-2011 |
| 20110187478 | Antenna Matching Circuit - An antenna matching circuit includes at least two signal paths are connected to one antenna connection. The signal paths are designed to transmit and/or receive RF signals. A matching circuit includes a discrete line for phase shifting integrated at the antenna end in at least one of the signal paths. In this case, at least one of the capacitances contained in the discrete line is in the form of a micro-acoustic resonator, whose resonance is shifted sufficiently far that it is outside the pass band of the respective signal paths. | 08-04-2011 |
| 20110187434 | SWITCHABLE CAPACITIVE ELEMENT WITH IMPROVED QUALITY FACTOR, AND METHOD OF PRODUCTION - A switchable capacitive element having an adjustable capacitance and an improved quality factor is specified. To this end, the characteristic variables of the switchable capacitive element are optimized in accordance with the equations cited in the description. | 08-04-2011 |
| 20110187239 | Piezoelectric Component and Method for Producing an Electrical Contact - A piezoelectric component includes an electromechanical transducer with two first electrodes and a second electrode. The second electrode is arranged between the two first electrodes. The transducer also includes a first main side, a second main side, opposite from the first main side, and a first longitudinal side. A first contiguous metallization layer is arranged on a first partial region of the first main side and on a partial region of the first longitudinal side adjacent to the first partial region of the first main side. Here, the partial region of the first longitudinal side is kept at a sufficient distance from a side edge facing the second main side and the partial region electrically contacts the at least two first electrodes. | 08-04-2011 |
| 20110186943 | MEMS Package and Method for the Production Thereof - A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate. | 08-04-2011 |
| 20110186711 | Molded Object, Heating Device and Method for Producing a Molded Object | 08-04-2011 |
| 20110181155 | Piezoactuator with a Predetermined Breaking Layer - A piezoactuator of multilayer design includes piezoelectric layers and electrode layers to form a stack. A predetermined breaking layer for the targeted origination and guiding of cracks is introduced between two adjacent electrode layers. The predetermined breaking layer has a barrier region, in which the formation of continuous electrically conductive paths or the formation of cracks leading through the barrier region is impeded. | 07-28-2011 |
| 20110180885 | METHOD FOR ENCAPSULATING AN MEMS COMPONENT - Method for producing an MST device, and MST device | 07-28-2011 |
| 20110174803 | Heating Device and Method for Manufacturing the Heating Device - A heating device is provided, comprising a shaped body, which has at least two regions comprising different compositions of a ceramic material with a positive temperature coefficient of electrical resistance. A method for manufacturing a heating device is furthermore specified. | 07-21-2011 |
| 20110169600 | Ceramic material, method for the manufacture of a ceramic material and electroceramic component comprising the ceramic material - Ceramic material of the general formula: [SE | 07-14-2011 |
| 20110169374 | Method for Tuning a Resonant Frequency of a Piezoelectric Component - A method for tuning a resonant frequency of a piezoelectric component is disclosed. The piezoelectric component includes a transducer extending in three spatial directions. The resonant frequency depends on an extension in at least one of the spatial directions and/or on a material-dependent elasticity modulus. The transducer includes a layered structure with at least two first electrodes and at least one second electrode, which is disposed between the two first electrodes. In the method, a DC voltage is applied to at least one of the at least two first electrodes and the at least one second electrode, so that a change of the resonant frequency results due to a change to the extension in the one spatial direction and the elasticity modulus. A control voltage with an excitation frequency is applied, the excitation frequency substantially corresponding to the modified resonant frequency. This generates a vibration of the piezoelectric component. | 07-14-2011 |
| 20110133315 | SYSTEM SUPPORT FOR ELECTRONIC COMPONENTS AND METHOD FOR PRODUCTION THEREOF | 06-09-2011 |
| 20110114355 | HERMETICALLY SEALED HOUSING FOR ELECTRONIC COMPONENTS AND MANUFACTURING METHOD | 05-19-2011 |
| 20110057747 | Multi-Layered Component - A multi-layered component is disclosed, including at least one inductive region, wherein the inductive region includes a ferrite ceramic. The inductive region has electrode structures that form at least one inductance. The multi-layered component has at least one capacitive region, wherein at least one capacitive region includes a varistor ceramic. The capacitive region forms at least one capacitance. At least one inductive region and at least one capacitive region form at least one LC filter. | 03-10-2011 |
| 20110051778 | Composite Material for Temperature Measurement, Temperature Sensor Comprising the Composite Material, and Method for Producing the Composite Material and the Temperature Sensor - A composite material | 03-03-2011 |
| 20110006381 | MEMS PACKAGE AND METHOD FOR THE PRODUCTION THEREOF - An MEMS package is proposed, wherein a chip having MEMS structures on its top side is connected to a rigid covering plate and a frame structure, which comprises a polymer, to form a sandwich structure in such a way that a closed cavity which receives the MEMS structures is formed. Solderable or bondable electrical contact are arranged on the rear side of the chip or on the outer side of the covering plate which faces away from the chip, and are electrically conductively connected to at least one connection pad by means of an electrical connection structure. | 01-13-2011 |
| 20100294419 | Method for Making a Piezoceramic Device - The invention concerns a method for making a piezoelectrical device, whose electrode layers contain copper. The usage of copper in the electrode layers is enabled by a debindering process, which is carried out by steam. | 11-25-2010 |
| 20100289711 | PORTABLE WIRELESS DEVICE - A method of offsetting a mismatch due to user interaction when handling a portable wireless terminal in which antenna matching is changed from inductive matching to capacitive matching in response to a reactance change exceeding a threshold level and vice versa when an opposite change is detected. An antenna interface module ( | 11-18-2010 |
| 20100265003 | IMPEDANCE MATCHING METHOD - An impedance matching method which is used to save electrical energy by virtue of the fact that the method switches between modes for controlling impedance matching and modes for regulation of the impedance matching depending on the situation. An algorithm which, on the basis of control signals from an external circuit environment, controls or regulates the impedance of a variable-impedance circuit element is implemented in a logic circuit LC. | 10-21-2010 |
| 20100264498 | MANUFACTURING A MEMS ELEMENT HAVING CANTILEVER AND CAVITY ON A SUBSTRATE - Method for manufacturing a capacitor on a substrate, the capacitor including a first electrode ( | 10-21-2010 |
| 20100237962 | COMPACT HIGHLY INTEGRATED ELECTRICAL MODULE WITH INTERCONNECTION OF BAW FILTER AND BALUN CIRCUIT AND PRODUCTION METHOD - A highly integrated electrical module is specified which comprises a filter circuit and a balun circuit. The space requirement is reduced by circuit components of the balun circuit being arranged at least in part on an inner side of the housing of the filter circuit. | 09-23-2010 |
| 20100176899 | COMPONENT HAVING STRESS-REDUCED MOUNTING - A component ( | 07-15-2010 |
| 20100176895 | CIRCUIT COMPRISING A VOLTAGE-DEPENDENT COMPONENT AND METHOD FOR OPERATING THE CIRCUIT - A circuit is proposed by means of which a ceramic component having two electrodes can be provided with a uniform, but periodically alternating BIAS voltage. The component has properties dependent on the level of the BIAS voltage and, for the purpose of an increased service life, is connected to a generator for generating a BIAS voltage and to means for periodically reversing the polarity of the BIAS voltage present at the electrodes. In a method for operating the component having variable properties, a uniform BIAS voltage, the polarity of which is periodically reversed, however, is applied to the electrodes, and the service life of the component is thus increased. | 07-15-2010 |
| 20100127799 | HF-FILTER WITH IMPROVED ADJACENT CHANNEL SUPPRESSION - The invention relates to a filter with a first partial filter (TF | 05-27-2010 |
| 20100001615 | Reduction of Air Damping in MEMS Device - A micro-electromechanical device has a substrate ( | 01-07-2010 |
| 20090309677 | ELECTROACOUSTIC RESONATOR, FILTER, DUPLEXER AND METHOD FOR DETERMINING PARAMETERS OF A RESONATOR - An electroacoustic resonator includes a resonator area for propagating an acoustic wave and a resonator surface area configured so that, when an input signal power of 0 dBm is applied at a resonant frequency f | 12-17-2009 |
| 20090278422 | PIEZOELECTRIC MULTILAYER COMPONENT - The invention relates to a piezoelectric multi-layer component with a plurality of piezoelectric layers ( | 11-12-2009 |
| 20090243441 | Piezoelectric Component - The invention relates to a piezoelectric multiple-layer component with a base body, which comprises a stack of piezoelectric layers ( | 10-01-2009 |
| 20090207550 | ELECTRICAL FEEDTHROUGH COMPONENT AND METHOD FOR ITS PRODUCTION - An electrical component that is surface mountable includes a base body having first inner electrodes and second inner electrodes. A first outer electrode extends along the base body in a first direction, and a through connection extends along the base body in a second direction that is different from the first direction. The first inner electrodes are electrically connected to the first outer electrode. The second inner electrodes are electrically interconnected via the through connection. | 08-20-2009 |
| 20090129611 | Microphone Membrane And Microphone Comprising The Same - The invention relates to a microphone membrane (M | 05-21-2009 |
| 20090039965 | LOW-LOSS ELECTRICAL COMPONENT WITH AN AMPLIFIER - An electrical component includes an amplifier that includes an output stage, and a power-supply path for powering the output stage. The power supply path includes a line that includes conductor track sections in parallel. The electrical component also includes a carrier substrate containing the amplifier and the line with the conductor tracks. | 02-12-2009 |
| 20090027139 | BAND-PASS FILTER - A bandpass filter is described herein. The bandpass filter has two parallel signal branches, each connected, on an input side, to an input node and, on an output side, to an output node. The two signal branches form a ring resonator, having a wave mode with a complex amplitude of Ū | 01-29-2009 |
| 20090011554 | Component With Sensitive Component Structures and Method for the Production Thereof - An electrical component has electrically conducting structures placed on an electrically isolating or semiconductive substrate and component structures sensitive to a voltage or an electrical arcing and galvanically separated from one another. To prevent an arcing between the galvanically separated component structures, the component structures are short-circuited with a shunt line having a smaller cross-section than the remaining electrical conductor tracks. The shunt lines can be burnt through by application of an electrical current at any given time, whereby a galvanic separation of the component structures is effected, if necessary, for the function of the component. | 01-08-2009 |
| 20090009925 | Tuneable Electronic Devices and Electronic Arrangements Comprising Such Tuneable Devices - An RF MEMS tuneable arrangement, e.g. variable capacitor, having two or more tunable devices, e.g. variable capacitances, a coupling circuit arranged to couple the tunable devices together to provide a combined output, e.g. a combined capacitance, that is variable according to a tuning signal. The coupling circuit is reconfigurable to alter a response of the arrangement to changes in the tuning signal, to enable a broader range of applications, manufacturing cost reductions and more flexibility in design. The device can have a pivoted beam ( | 01-08-2009 |
| 20090003286 | FRONT END MODULE COMPRISING AN ANTENNA SWITCH - A front-end module is for use with at least three radio frequency bands. The front-end module includes at least five signal paths, and an antenna switch to electrically connect an antenna to one of the signal paths. At least one of the signal paths includes subpaths. A frequency separating network interfaces the at least one signal path to the subpaths. The subpaths are for use in passing different radio frequency bands. The different radio frequency bands have frequency ranges that do not overlap. | 01-01-2009 |
| 20090001553 | Mems Package and Method for the Production Thereof - A micro electro-mechanical systems (MEMS) package is described herein. The package includes a carrier substrate having a top side, a MEMS chip mounted on the top side of the carrier substrate, and at least one chip component on or above the top side of the carrier substrate or embedded in the carrier substrate. The package also includes a thin metallic shielding layer covering the MEMS chip and the chip component and forming a seal with the top side of the carrier substrate. | 01-01-2009 |
| 20080297277 | Circuit Working With Acoustic Volume Waves And Component Connected To The Circuit - A circuit for use with bulk acoustic waves includes a first electroacoustic system in a first branch and a second electroacoustic system in a second branch. The first electroacoustic system includes a first resonator and a second resonator that are in series in the first branch, and that are galvanically separated, and acoustically coupled, by a first coupling system. The second electroacoustic system includes a first resonator and a second resonator that are connected in series in the second branch, and that are galvanically separated, and acoustically coupled, by a second coupling system. The first and second electroacoustic systems are acoustically coupled via the first and second coupling systems and/or electrically coupled. | 12-04-2008 |
| 20080279407 | Mems Microphone, Production Method and Method for Installing - A microphone in a miniaturized form is described herein. The microphone includes a flat carrier substrate having a first recess extending through the carrier substrate. The microphone includes a first electro-acoustic transducer on a first surface of the carrier substrate and at least partially overlapping the first recess. The microphone also includes a cap on a second surface opposite the first surface having a tight seal with the second surface and spanning the first recess. The cap includes at least one metallic layer for electromagnetic shielding. | 11-13-2008 |
| 20080267431 | Mems Microphone - A microphone includes a first diaphragm and a second diaphragm coupled to the first diaphragm by a closed air volume. The first diaphragm and the second diaphragm each constitutes a piezoelectric diaphragm. The first diaphragm and the second diaphragm are electrically coupled so that movement of the first diaphragm causes movement of the second diaphragm. | 10-30-2008 |
| 20080247585 | Electrical Module Comprising a Mems Microphone - An electrical module includes a base plate having an acoustic channel that opens into a first cavity at a first end and that is closed off by a microphone chip at a second end. The microphone chip borders a second cavity that opens to an exterior of the electrical module. The second cavity is separated from the acoustic channel by the microphone chip. | 10-09-2008 |
| 20080246560 | Saw Filter Featuring Impedance Transformation - A surface acoustic wave (SAW) filter includes at least one first electroacoustic transducer, and at least one second electroacoustic transducer. The at least one first electroacoustic transducer and the at least one second electroacoustic transducer are side-by-side inside an acoustic track having an aperture A | 10-09-2008 |
| 20080238567 | Electrical Component for the Front End Circuit of a Transceiver - An electrical component is described with a first signal path (TX, RX | 10-02-2008 |
| 20080224570 | Transformer Arrangement Having a Piezoelectric Transformer - A transformer arrangement is specified which includes a piezoelectric transformer with a main body ( | 09-18-2008 |
| 20080218082 | Spark-Discharge Gap - A spark gap ( | 09-11-2008 |
| 20080212283 | Electrical Component - According to one variant, an electrical component is specified, with a substrate ( | 09-04-2008 |
