EO TECHNICS CO., LTD.
|EO TECHNICS CO., LTD. Patent applications|
|Patent application number||Title||Published|
|20100187207||LASER PROCESSING APPARATUS AND METHOD USING BEAM SPLIT - Disclosed are a laser processing apparatus and method that can effectively remove a low-k material formed on a wafer. A laser processing apparatus of the invention is a laser processing apparatus that processes a subject on which a low-k material is formed. The laser processing apparatus includes a laser generating unit that emits a laser beam; and an optical system that splits the laser beam emitted from the laser generating unit into two and irradiates the split laser beams onto the subject In this case, the optical system includes a pair of condensing lenses in which cut surfaces that are cut at a predetermined distance from central axes to be parallel to the central axes contact with each other, and the interval between the two split laser beams is the same as the interval between two edges of the low-k material in a removal subject region. According to the invention, after splitting a laser beam into two laser beams and primarily removing the edges of the low-k material in the removal subject region using the laser beams, the remaining low-k material between the edges is removed. As a result, it is possible to improve processing quality.||07-29-2010|
|20080279248||LASER MACHINING APPARATUS - Provided is a laser machining apparatus. The laser machining apparatus includes: a laser oscillator emitting laser beams; a first dividing means on which the laser beams emitted from the laser oscillator are incident to be selectively divided so that the incident laser beams progress along at least one path from among a pair of first paths; a second dividing means on which the laser beams that passed through any one of the first paths are incident to be selectively divided so that the incident laser beams progress along at least one path from among a pair of second paths; a third dividing means on which the laser beams that passed through the other one of the first paths are incident to be selectively divided so that the incident laser beams progress along at least one path from among a pair of third paths; four pairs of scanners on which the laser beams that passed through the first, second, and third dividing means are incident to each be deflected onto desired positions on a substrate so as to be processed; and a scan lens on which the laser beams that passed through the four pairs of scanners are incident to be collected on a spot having a predetermined diameter and irradiated onto the substrate.||11-13-2008|
|20080279232||MULTI-LASER SYSTEM - A multi-laser system including a first laser oscillator for emitting a first laser beam, a second laser oscillator for emitting a second laser beam, a first scanner pair for receiving the first laser beam emitted by the first laser oscillator and deflecting the incident first laser beam to a desired location on a substrate to be processed, a second scanner pair for receiving the second laser beam emitted by the second laser oscillator and deflecting the incident second laser beam to a desired location on the substrate to be processed, and a scan lens for receiving laser beams that have been deflected from the first and second scanner pairs, focusing the received laser beams to spots having predetermined diameters so as to radiate the spots on the substrate.||11-13-2008|
Patent applications by EO TECHNICS CO., LTD.