Enkris Semiconductor, Inc. Patent applications |
Patent application number | Title | Published |
20150187925 | ENHANCEMENT-MODE DEVICE - An enhancement-mode device is provided. A spontaneous polarization effect and a piezoelectric effect in a crystal of nitride are greatest in a <0002> direction and do not exist or are minimal in a non-polar and a semi-polar direction, which is used to form the enhancement-mode device. A groove having a non-polar surface or a semi-polar surface is formed in an epitaxial multilayer structure, thereby interrupting two-dimensional electron gas in the groove. When a gate voltage is increased, the electron density on the non-polar and semi-polar surfaces in the groove is increased consequently, thereby realizing an enhancement-mode operation. | 07-02-2015 |
20150187885 | SEMICONDUCTOR EPITAXIAL STRUCTURE AND METHOD FOR FORMING THE SAME - A semiconductor epitaxial structure is provided, which includes: a nitride nucleation layer, formed on a substrate including silicon, sapphire, patterned sapphire substrate (PSS) or silicon carbide, a nitride layer on the nitride nucleation layer and an multi-layer structure in the nitride layer. The multi-layer structure includes a first intermediate layer and a second intermediate layer formed on the first intermediate layer. The first intermediate layer includes AlGaN, the second intermediate layer includes AlGaN or aluminium nitride, and the average composition of Al in the first intermediate layer is less than that in the second intermediate layer. A method for forming a semiconductor epitaxial structure is provided. The semiconductor epitaxial structure according to the present disclosure can not decrease the crystalline quality when a compressive stress is introduced, which may avoid a crack phenomenon or quality degradation caused by the change of temperature. | 07-02-2015 |
20150187618 | SYSTEM AND METHOD FOR FORMING GAN-BASED DEVICE - A system and a method for forming a GaN based device are provided. The system may include: at least one MOCVD reaction chamber; at least one ALD or CVD reaction chamber; and a loadlock transfer connecting with the MOCVD reaction chamber and the ALD or CVD reaction chamber. The MOCVD reaction chamber may be a standard chamber for nitride growth. The ALD or CVD reaction chamber may be used for growing nitride and oxide dielectric layers, which may have a highest growth temperature no less than about 500° C., such that nitride and oxide may have better qualities. The system may include a cleaning chamber for cleaning the substrate and the nitride films. Using the integrated system, cleaning processes and growing processes for epitaxial layers and dielectric layers can be implemented in a same system, which may avoid contaminations in the air. Device performance may be improved. | 07-02-2015 |