| Emaus Kyoto, Inc. Patent applications |
| Patent application number | Title | Published |
|---|
| 20090045119 | POROUS POLYMER AND PROCESS FOR PRODUCING THE SAME - The present invention relates to a polymeric porous material characterized in that: the porous material has a bimodal pore size distribution attributable to macropores having a pore size of at least 50 nm and mesopores having a pore size of from 2 nm to less than 50 nm, the proportion of the specific surface area of the macropores to the specific surface area of all pores of the porous material is at least 10%, and the porous material is produced by (1) polymerizing a monomer in the presence of a polymerization initiator using as a porogen a solution obtained by dissolving a polymer having a weight-average molecular weight of at least 100,000 and a molecular weight distribution Mw/Mn of not more than 1.5 in a good solvent for the monomer, and (2) removing the porogen from the resultant product. | 02-19-2009 |
| 20080210626 | Porous Cured Epoxy Resin - A porous object comprising a three-dimensional network skeleton of a cured epoxy resin and having interconnecting pores, characterized in that the three-dimensional network skeleton forms a non-particle-aggregation type porous object constituted of a three-dimensional branched columnar structure, the proportion of aromatic-ring-derived carbon atoms to all the carbon atoms as a component of the cured epoxy resin is 0.10-0.65, and the porous object has a porosity of 20-80% and an average pore diameter of 0.5-50 μm. | 09-04-2008 |
