| ELMOS ADVANCED PACKAGING B.V. Patent applications |
| Patent application number | Title | Published |
|---|
| 20090206467 | INTEGRATED CIRCUIT PACKAGE | 08-20-2009 |
| 20090102033 | INTEGRATED CIRCUIT PACKAGE - Package for an integrated circuit (IC), includes a housing ( | 04-23-2009 |
| 20080236292 | Sensor element and sensor assembly provided with a casing - A sensor element having a sensitive sensor portion on an upper side of a substrate layer. The upper side of the substrate layer is provided with a recess on the periphery of the sensitive sensor portion. The recess provides mechanical isolation or decoupling of the sensitive sensor portion, as a result of which external forces do not cause stress in the sensitive sensor portion. In addition, a sensor assembly is described which is provided with at least one sensor element and a casing. | 10-02-2008 |
