| ELECTRO SCIENTIFIC INDUSTRIES, INC. Patent applications |
| Patent application number | Title | Published |
|---|
| 20120103953 | LASER MACHINING OF FIRED CERAMIC AND OTHER HARD AND/OR THICK MATERIALS - Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interlace of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf. | 05-03-2012 |
| 20120100348 | METHOD AND APPARATUS FOR OPTIMALLY LASER MARKING ARTICLES - The present invention relates to laser marking articles. In particular it relates to laser marking articles by laser ablating a coating applied to the article which reveals the surface of the article underneath, thereby forming the mark by the contrasting appearance between the revealed surface of the article and the adjacent remaining coating. Laser parameters are selected to provide uniform, commercially desirable appearance and avoid damage to the underlying surface while maintaining acceptable system throughput. In particular the laser pulse envelope is tailored to provide desirable appearance while maintaining acceptable system throughput. | 04-26-2012 |
| 20120092755 | TANDEM PHOTONIC AMPLIFIER - Embodiments of laser systems advantageously use pulsed optical fiber-based laser source ( | 04-19-2012 |
| 20120064695 | DICING A SEMICONDUCTOR WAFER - A method of dicing a semiconductor wafer comprises scribing at least one dielectric layer along dice lanes to remove material from a surface of the wafer using a laser with a pulse-width between 1 picosecond and 1000 picoseconds and with a repetition frequency corresponding to times between pulses shorter than a thermal relaxation time of the material to be scribed. The wafer is then diced through a metal layer and at least partially through a substrate of the semiconductor wafer. | 03-15-2012 |
| 20120043306 | METHOD AND APPARATUS FOR OPTIMALLY LASER MARKING ARTICLES - The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds. | 02-23-2012 |
| 20110315667 | METHOD AND APPARATUS FOR RELIABLY LASER MARKING ARTICLES - The invention is a method and apparatus for laser marking a stainless steel specimen with commercially desirable marks. The method includes providing a laser processing system having a laser, and laser optics and a controller with pre-determined laser pulse parameters, selecting the pre-determined laser pulse parameters associated with the desired mark, and directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired marks including temporal pulse widths greater than about 1 and less than about 1000 picoseconds. | 12-29-2011 |
| 20110298156 | METHODS AND SYSTEMS FOR LASER PROCESSING A WORKPIECE USING A PLURALITY OF TAILORED LASER PULSE SHAPES - Tailored laser pulse shapes are used for processing workpieces. Laser dicing of semiconductor device wafers on die-attach film (DAF), for example, may use different tailored laser pulse shapes for scribing device layers down to a semiconductor substrate, dicing the semiconductor substrate, cutting the underlying DAF, and/or post processing of the upper die edges to increase die break strength. Different mono-shape laser pulse trains may be used for respective recipe steps or passes of a laser beam over a scribe line. In another embodiment, scribing a semiconductor device wafer includes only a single pass of a laser beam along a scribe line using a mixed-shape laser pulse train that includes at least two laser pulses that are different than one another. In addition, or in other embodiments, one or more tailored pulse shapes may be selected and provided to the workpiece on-the-fly. The selection may be based on sensor feedback. | 12-08-2011 |
| 20110287607 | METHOD AND APPARATUS FOR IMPROVED WAFER SINGULATION - Laser singulation of electronic devices from semiconductor substrates including wafers is performed using up to 3 lasers from 2 wavelength ranges. Using up to 3 lasers from 2 wavelength ranges permits laser singulation of wafers held by die attach film while avoiding problems caused by single-wavelength dicing. In particular, using up to 3 lasers from 2 wavelength ranges permits efficient dicing of semiconductor wafers while avoiding debris and thermal problems associated with laser processing die attach tape. | 11-24-2011 |
| 20110273184 | SYSTEM AND METHOD FOR IMPROVED TESTING OF ELECTRONIC DEVICES - An improved method of testing and sorting electronic devices uses two or more test stations and two or more sorting stations applied to a single track to improve system throughput. Applying two or more test stations and two or more sorting stations to a single track accomplishes improved system throughput while increasing system cost less than would be expected if a duplicate track was installed for each test station. | 11-10-2011 |
| 20110272388 | PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING - Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece. | 11-10-2011 |
| 20110267671 | COMBINING MULTIPLE LASER BEAMS TO FORM HIGH REPETITION RATE, HIGH AVERAGE POWER POLARIZED LASER BEAM - Two pulsed lasers ( | 11-03-2011 |
| 20110243163 | WEDGE-FACETED NONLINEAR CRYSTAL FOR HARMONIC GENERATION - Lasers and laser systems generate different wavelengths by nonlinear sum or difference frequency conversion. A wedge-faceted nonlinear crystal compensates for the spatial walk-off phenomenon associated with critical phase matching of a nonlinear crystal in the production of harmonic laser output at peak power. | 10-06-2011 |
| 20110242639 | METHOD FOR ACCOMPLISHING HIGH-SPEED INTENSITY VARIATION OF A POLARIZED OUTPUT LASER BEAM - A method of accomplishing high-speed intensity variation of a polarized output laser beam includes securing an angle of light incidence sensitive optical element to a galvanometer system that provides high-speed transitioning of the angle of light incidence sensitive optical element between different angular positions. The high-speed transitioning provided by the galvanometer system varies an angle of incidence between an input laser beam and the angle of light incidence sensitive optical element to thereby provide high-speed variation of an intensity of a polarized output laser beam produced by the angle of light incidence sensitive optical element. | 10-06-2011 |
| 20110242307 | TOUCH SCREEN INTERFACE FOR LASER PROCESSING - A touch screen user interface for an optical device wherein the touch screen user interface is connected to a controller which controls motion stages permitting the motion stages to re-position, re-size, re-orient or focus the field of view of the optical device in response to commands input from the touch screen user interface. | 10-06-2011 |
| 20110241718 | Test Plate for Electronic Component Handler - Test plates with improved test pockets are described herein. One embodiment is a circular test plate comprising a plurality of test pockets, each test pocket being a quadrilateral hole in the test plate, and each quadrilateral hole having four sides and four corners located at the intersections of the sides. Each of the four corners comprises at least one corner having a corner relief that extends from and intersects each of the at least one corner's two intersecting sides, and any remaining corners not having a corner relief. The test plate can be incorporated into a component handler. | 10-06-2011 |
| 20110240839 | SAMPLE CHAMBER FOR LASER ABLATION INDUCTIVELY COUPLED PLASMA MASS SPECTROSCOPY - An improved sample chamber for laser assisted spectroscopy integrates valve mechanisms into the sample drawer, permitting the sample chamber to automatically bypass, purge and resume flow as the sample drawer is opened and closed to insert samples for processing. Integrating valve mechanisms into the sample drawer in this manner eliminates the need for external valves to be operated to bypass, purge and resume flow, thereby increasing system throughput and reducing system complexity. | 10-06-2011 |
| 20110240616 | METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS - An improved method for singulation of electronic substrates into dice uses a laser to first form cuts in the substrate and then chamfers the edges of the cuts by altering the laser parameters. The chamfers increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut without requiring additional process steps, additional equipment or consumable supplies. | 10-06-2011 |
| 20110236645 | METHOD OF MANUFACTURING A PANEL WITH OCCLUDED MICROHOLES AND PRODUCTS MADE THEREBY - Methods of manufacturing a panel and resulting panels include a plurality of microholes arranged in a pattern and filled with light transmissive polymeric material. The light transmissive polymeric material occludes the microholes and is set, or cured, by exposure to an energy source using at least two discrete exposure periods separated by an idle or rest period. | 09-29-2011 |
| 20110222298 | PANEL WITH MICRO-HOLE PATTERN IN A STRUCTURALLY THIN PORTION - An area of reduced thickness is formed in a panel, and a pattern of microscopic holes are formed in the area. The holes are filled with a light transmissive material such as a curable polymer. The thinned area may also be filled with a polymer to reinforce the thinned area and the polymer may be colored to add color to light transmitted through the pattern. The panel can form a portion of a housing surrounding a lighting source that makes the holes visible when lit. | 09-15-2011 |
| 20110220595 | High Strength, High Density Carrier Plate - A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers. | 09-15-2011 |
| 20110210103 | SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR STRUCTURES USING LASER PULSES LATERALLY DISTRIBUTED IN A SCANNING WINDOW - Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the semiconductor substrate such that a plurality of laterally spaced rows of structures simultaneously pass through the processing window. As the processing window is scanned, the deflector selectively deflects the series of laser pulses among the laterally spaced rows within the processing window. Thus, multiple rows of structures may be processed in a single scan. | 09-01-2011 |
| 20110208343 | Tracking and Marking Specimens Having Defects Formed During Laser Via Drilling - A method and system increase processed specimen yield in the laser processing of target material that includes multiple specimens formed on a common substrate. Preferred embodiments implement a feature that enables storage in the laser processing system a list of defective specimens that have somehow been subject to error during laser processing. Once the common substrate has been completely processed, the system alerts an operator to the number of improperly processed specimens and gives the operator an opportunity to run a software routine, which in a preferred embodiment uses a laser to scribe a mark on the top surface of each improperly processed specimen. | 08-25-2011 |
| 20110194574 | METHOD AND APPARATUS FOR RELIABLY LASER MARKING ARTICLES - The invention is a method and apparatus for creating a color and optical density selectable visible mark on an anodized aluminum specimen. The method includes providing a laser marking system having a laser, laser optics and a controller operatively connected to said laser to control laser pulse parameters and a controller with stored laser pulse parameters, selecting the stored laser pulse parameters associated with the desired color and optical density, directing the laser marking system to produce laser pulses having laser pulse parameters associated with the desired color and optical density including temporal pulse widths greater than about 1 and less than about 1000 picoseconds to impinge upon said anodized aluminum. | 08-11-2011 |
| 20110193929 | METHOD AND APPARATUS FOR RELIABLY LASER MARKING ARTICLES - The invention is a method and apparatus for creating marks on an anodized aluminum specimen with selectable color and optical density. The method includes providing a laser marking system having a laser, laser optics and a controller operatively connected to said laser to control laser pulse parameters. The laser marking system is directed to produce laser pulses having laser pulse parameters associated with the desired color and optical density in the presence of a fluid directed to the surface of the anodized aluminum specimen while marking. | 08-11-2011 |
| 20110193928 | METHOD AND APPARATUS FOR RELIABLY LASER MARKING ARTICLES - Disclosed is a method for creating a mark desired properties on an anodized specimen and the mark itself. The method includes providing a laser marking system having a controllable laser pulse parameters, determining the laser pulse parameters associated with the desired properties and directing the laser marking system to mark the article using the selected laser pulse parameters. Laser marks so made have optical density that ranges from transparent to opaque, white color, texture indistinguishable from the surrounding article and durable, substantially intact anodization. The anodization may also be dyed and optionally bleached to create other colors. | 08-11-2011 |
| 20110177674 | PROCESSING OF MULTILAYER SEMICONDUCTOR WAFERS - A method and apparatus for machining, or forming a feature in, a patterned silicon wafer includes removing portions of surface layers on the wafer using a first pulsed laser ( | 07-21-2011 |
| 20110151046 | METHOD AND APPARATUS FOR OPTICALLY TRANSPARENT VIA FILLING - A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit. | 06-23-2011 |
| 20110147348 | ADAPTIVE PROCESSING CONSTRAINTS FOR MEMORY REPAIR - An apparatus and method for processing a plurality of semiconductor parts in a laser-based system adjusts a default recipe to account for work to be performed on at least one part of the plurality of parts. The work to be performed on a part is analyzed using the default recipe and a part-specific recipe including a modified parameter of the default recipe. The default or part-specific recipe is selected based on a desired processing result, and the selected recipe replaces the default recipe to perform the work using the laser-based system. | 06-23-2011 |
| 20110147067 | METHOD AND APPARATUS FOR OPTICALLY TRANSPARENT VIA FILLING - A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit. | 06-23-2011 |
| 20110131807 | Process for Forming an Isolated Electrically Conductive Contact Through a Metal Package - A method of forming an isolated electrically conductive contact through a metallic substrate includes creating at least one via through the substrate, where the via includes a first opening in a top surface of the substrate, a second opening in an opposing bottom surface and at least one continuous sidewall extending therebetween. A dielectric sleeve is formed on the at least one sidewall of the via while preserving at least a portion of the through via. An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy. | 06-09-2011 |
| 20110085574 | METHODS AND SYSTEMS FOR GENERATING PULSE TRAINS FOR MATERIAL PROCESSING - Systems and methods generate laser pulse trains for material processing. In one embodiment, stable laser pulse trains at high repetition rates are generated from a continuous wave (CW) or quasi-CW laser beams. One or more laser pulses in the laser pulse train may be shaped to control energy delivered to a target material. In another embodiment, multiple laser beams are distributed to multiple processing heads from a single laser pulse, CW laser beam, or quasi-CW laser beam. In one such embodiment, a single optical deflector distributes multiple laser beams among respective processing heads. | 04-14-2011 |
| 20110029124 | PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAM - A substrate is diced using a program-controlled pulsed laser beam apparatus having an associated memory for storing a laser cutting strategy file. The file contains selected combinations of pulse rate Δt, pulse energy density E and pulse spatial overlap to machine a single layer or different types of material in different layers of the substrate while restricting damage to the layers and maximising machining rate to produce die having predetermined die strength and yield. The file also contains data relating to the number of scans necessary using a selected combination to cut through a corresponding layer. The substrate is diced using the selected combinations. Gas handling equipment for inert or active gas may be provided for preventing or inducing chemical reactions at the substrate prior to, during or after dicing. | 02-03-2011 |
| 20100321491 | ACHIEVING CONVERGENT LIGHT RAYS EMITTED BY PLANAR ARRAY OF LIGHT SOURCES - Systems and methods are provided for achieving convergent light rays emitted by a planar array of light sources. In one embodiment, an imaging device is provided for inspecting semiconductors or other objects. The imaging device includes one or more imaging lens for imaging light reflected from an object. The imaging device also includes a first light source attached to a planar circuit board and a second light source attached to the planar circuit board. The imaging device further includes a first Fresnel prism for directing light from the first light source toward the object from a first direction and a second Fresnel prism for directing light from the second light source toward the object from a second direction. In one embodiment, the imaging device also includes one or more optical elements for increasing or decreasing the divergence of the light. | 12-23-2010 |
| 20100310200 | ROTARY FLEXURE AND AIR BEARING SUPPORT FOR ROTARY INDEXING SYSTEM - A highly position-stabilized indexable table or “dial” in which the dial is supported relative to a steel surface on a frame by one or more air bearings. A flexure mechanically connects the indexing motor to the dial in such a way as to be torsionally non-compliant, but axially compliant to decouple the dial from the motor shaft along the Z-axis. In one embodiment, the air bearings are mounted to the frame at uniformly angularly displaced positions under the dial. In another embodiment, the bearings are partially integrated into the dial. Negative (suction) preload can be used in either embodiment to increase air bearing stiffness and/or to allow inverted processing; i.e., mounting part fixtures on an undersurface of the dial. | 12-09-2010 |
| 20100301028 | METHOD AND APPARATUS FOR HYBRID RESOLUTION FEEDBACK OF A MOTION STAGE - A method and apparatus is presented for obtaining high resolution positional feedback from motion stages | 12-02-2010 |
| 20100301024 | LASER PROCESSING SYSTEMS USING THROUGH-THE-LENS ALIGNMENT OF A LASER BEAM WITH A TARGET FEATURE - A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction. The AOD subsystem may be used for aligning a processing laser beam to workpiece features. | 12-02-2010 |
| 20100301023 | ACOUSTO-OPTIC DEFLECTOR APPLICATIONS IN LASER PROCESSING OF DIELECTRIC OR OTHER MATERIALS - A laser processing system for micromachining a workpiece includes a laser source to generate laser pulses for processing a feature in a workpiece, a galvanometer-driven (galvo) subsystem to impart a first relative movement of a laser beam spot position along a processing trajectory with respect to the surface of the workpiece, and an acousto-optic deflector (AOD) subsystem to effectively widen a laser beam spot along a direction perpendicular to the processing trajectory. The AOD subsystem may include a combination of AODs and electro-optic deflectors. The AOD subsystem may vary an intensity profile of laser pulses as a function of deflection position along a dither direction to selectively shape the feature in the dither direction. The shaping may be used to intersect features on the workpiece. The AOD subsystem may also provide rastering, galvo error position correction, power modulation, and/or through-the-lens viewing of and alignment to the workpiece. | 12-02-2010 |
| 20100298964 | APPARATUS AND METHOD FOR NON-CONTACT SENSING OF TRANSPARENT ARTICLES - A laser-based displacement detector is used to detect cosmetic coatings applied to one surface of the transparent article and thereby determine which side is uppermost when loaded into the laser processing system. In particular, articles that are transparent to visible light and are particularly difficult to orient properly in laser processing systems are oriented using a laser-based displacement detector in conjunction with a partial coating on the article. | 11-25-2010 |
| 20100276405 | LASER SYSTEMS AND METHODS USING TRIANGULAR-SHAPED TAILORED LASER PULSES FOR SELECTED TARGET CLASSES - Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. At least one of the predefined temporal pulse profiles may be triangular. The target class may include, for example unpassivated electrically conductive links or other bare metal structures. Based on the target class associated with the selected target, a laser pulse is generated having a triangular temporal pulse profile. The generated laser pulse is used to process the selected structure. | 11-04-2010 |
| 20100252959 | METHOD FOR IMPROVED BRITTLE MATERIALS PROCESSING - An improved method for laser machining features in brittle materials such as glass is presented, wherein a tool path related to a feature is analyzed to determine how many passes are required to laser machine the feature using non-adjacent laser pulses. Laser pulses applied during subsequent passes are located so as to overlap previous laser spot locations by a predetermined overlap amount. In this way no single spot receives excessive laser radiation caused by immediately subsequent laser pulses being applied adjacent to a previous pulse location. | 10-07-2010 |
| 20100252540 | METHOD AND APPARATUS FOR BRITTLE MATERIALS PROCESSING - An improved method for laser machining features in brittle materials | 10-07-2010 |
| 20100246615 | INTRACAVITY HARMONIC GENERATION USING A RECYCLED INTERMEDIATE HARMONIC - Lasers configured for intracavity harmonic generation of second and higher order harmonic laser beam energy include mode-matching optics, such as a curved mirror, for recycling an unused portion of an intermediate harmonic laser beam energy (e.g., second harmonic laser beam energy) to improve higher order harmonic laser beam energy generation efficiency (e.g., third or higher order harmonic laser beam energy generation efficiency) without sacrificing beam quality of the higher order harmonic laser beam energy. The curved mirror may be positioned out of a resonant laser cavity of the laser. A radius of curvature and a position of the curved mirror are selected so that a beam radius and a beam divergence of the recycled second harmonic laser beam energy are essentially the same as a beam radius and a beam divergence of incoming second harmonic laser beam energy everywhere along a beam path of the incoming second harmonic laser beam. | 09-30-2010 |
| 20100246611 | LASER MICROMACHINING WITH TAILORED BURSTS OF SHORT LASER PULSES - A series of laser pulse bundles or bursts are used for micromachining target structures. Each burst includes short laser pulses with temporal pulse widths that are less than approximately 1 nanosecond. A laser micromachining method includes generating a burst of laser pulses and adjusting an envelope of the burst of laser pulses for processing target locations. The method includes adjusting the burst envelope by selectively adjusting one or more first laser pulses within the burst to a first amplitude based on processing characteristics of a first feature at a target location, and selectively adjusting one or more second laser pulses within the burst to a second amplitude based on processing characteristics of a second feature at the target location. The method further includes directing the amplitude adjusted burst of laser pulses to the target location. | 09-30-2010 |
| 20100243626 | Method and Apparatus for Laser Machining - A method and apparatus is presented for laser machining complex features in workpieces using programmable laser focal spot shapes. A deformable mirror is inserted into the laser beam path of a laser machining system and programmed to alter the shape of the laser beam focal spot in real time as the workpiece is being laser machined in order to achieve improved control over the shape and size of laser machined features. | 09-30-2010 |
| 20100243625 | MINIMIZING THERMAL EFFECT DURING MATERIAL REMOVAL USING A LASER - A process to cut sheet material using a laser is improved by performing a first plurality of routings using a first toolpath for the laser and performing at least a second routing using a second toolpath for the laser after performing the first plurality of routings using the first toolpath, the second toolpath traverse from a kerf formed by the laser as a result of performing the first plurality of routings. A z-height shift can be simultaneously implemented with the transverse shift. By shifting the toolpath, interference of plasma generated during laser processing is minimized by maximizing the coupling of the laser and the material, resulting in less discoloration and/or burning of the material. | 09-30-2010 |
| 20100243622 | FORCE REACTION COMPENSATION SYSTEM - A laser beam propagates along a beam axis for incidence on a work surface mounted on a support. The support operatively connects to a positioning system moving at least one of the laser beam and the target specimen relative to each other to position the laser beam at selected locations on the work surface. At least one force reaction compensation motor is located in a common force plane with, and as close as possible to, a corresponding stage motor. Any moment arm between the compensation motor and the corresponding stage motor is reduced or eliminated, allowing the compensation motor to directly couple and react to stage forces with virtually zero moment arm. Six degrees of freedom can be controlled with only four motors, since each compensation motor is directly coupled and aligned to a corresponding stage motor. | 09-30-2010 |
| 20100243617 | PRINTED CIRCUIT BOARD VIA DRILLING STAGE ASSEMBLY - A via drilling system is preferably constructed to process one target at a time. The via drilling system preferably provides a relatively small footprint for the via drilling system, relatively small moment arms between via drilling system components, a relatively short stiffness loop, and a relatively fast processing time for a target. Multiple tools are preferably provided to perform multiple operations substantially simultaneously on the target. | 09-30-2010 |
| 20100206769 | HIGH STRENGTH, HIGH DENSITY CARRIER PLATE - A carrier plate for supporting electronic components during processing includes hexagonally-arranged holes for supporting the components. Walls of the holes comprise a gripping resilient material. The hexagonal arrangement provides a strong carrier that improves production yield through an increase in per batch processing and improved locational accuracy over conventional carriers. | 08-19-2010 |
| 20100206693 | LONG AXIS COMPONENT LOADER - A component loader orients a component along its long-axis for transfer from a rotatable load plate. The load plate has an outer peripheral edge and an upper surface inclined from a horizontal plane. Slots on the upper surface terminate at the outer edge of the load plate and are sized to receive at least one elongate chip lying with its long axis perpendicular to the axis of the load plate and in parallel with radius of the load plate. An outer wall conforms to the curvature of the outer edge and is mounted adjacent thereto. A transfer slot extends axially from and into the upper surface of the load plate on outer ends of the slots and terminates at the outer edge of the load plate. Each transfer slot is shaped so that a chip descending therein from a slot has a ninety degree rotation about the long axis. | 08-19-2010 |
| 20100193481 | LASER CONSTRUCTED WITH MULTIPLE OUTPUT COUPLERS TO GENERATE MULTIPLE OUTPUT BEAMS - A laser beam switching system employs a laser coupled to a beam switching device that causes a laser beam to switch between first and second beam positioning heads such that while the first beam positioning head is directing the laser beam to process a workpiece target location, the second beam positioning head is moving to another target location and vice versa. A preferred beam switching device includes first and second AOMs. When RF is applied to the first AOM, the laser beam is diffracted toward the first beam positioning head, and when RF is applied to the second AOM, the laser beam is diffracted toward the second beam positioning head. A workpiece processing system employs a common modular imaged optics assembly and an optional variable beam expander for optically processing multiple laser beams. | 08-05-2010 |
| 20100189145 | LASER WITH GAIN MEDIUM SUPPRESSING HIGHER ORDER MODES TO PROVIDE LASING OUTPUT WITH HIGH BEAM QUALITY - High-power, diode-pumped solid state (DPSS) pulsed lasers are preferred for applications such as micromachining, via drilling of integrated circuits, and ultraviolet (UV) conversion. Nd:YVO | 07-29-2010 |
| 20100177794 | PULSE TEMPORAL PROGRAMMABLE ULTRAFAST BURST MODE LASER FOR MICROMACHINING - A laser processing system provides a burst of ultrafast laser pulses having a selectively shaped burst envelope. A burst pulse laser includes a high repetition rate ultrafast laser to deliver a pulse train with each pulse in the train having an independently controlled amplitude. The respective amplitudes of each ultrafast pulse in a group define a “burst envelope.” In addition to independently controlling the amplitude of each ultrafast pulse within the burst envelope, the system may also provide selective control of spacing between each ultrafast pulse and/or the overall temporal width of the burst envelope. Thus, the system provides selective shaping of the burst envelope for particular laser processing applications. | 07-15-2010 |
| 20100171512 | Self-Testing, Monitoring and Diagnostics in Grouped Circuitry Modules - An electrical test system for providing a power source to each of a plurality of electrical components under electrical test includes a grouped circuitry module. The grouped circuitry module includes a plurality of individually-programmable power sources, each coupled to an output channel, a controller configured to program each of the power sources to a respective stimulus output value and to read a measured value at each corresponding output channel and random access, non-volatile, memory for storing information and for providing read/write capability for the controller. A host computer is in communication with the controller for running a self test program that sequentially programs each of the power sources to its respective stimulus output value and reads the measured value at each corresponding output channel using the controller to determine if the tested complete subsystem is operating properly. | 07-08-2010 |
| 20100164305 | MONOLITHIC STAGE POSITIONING SYSTEM AND METHOD - A magnetically levitated monolithic stage positioning system includes linear three phase motors and coil windings connected to the monolithic stage that interact with a ferromagnetic base. The linear three phase motors may be excited to provide motion in an X-axis direction, motion in a Y-axis direction, and rotation about a Z-axis. The monolithic stage is levitated on an air bearing. The plurality of coil windings connected to the monolithic stage may serve to magnetically preload the air bearing. The plurality of coil windings may be excited to provide motion in a Z-axis direction and rotation of the monolithic stage about the X-axis and about the Y-axis. | 07-01-2010 |
| 20100147813 | METHOD FOR LASER PROCESSING GLASS WITH A CHAMFERED EDGE - A laser machining process is described for laser machining glass or glass-like materials. This process machines articles or features in articles with chamfered edges in one manufacturing operation. Chamfered edges are desirable in glass and glass-like materials because they resist fracturing or chipping and eliminate sharp edges. Producing articles or features in articles in one manufacturing operation is desirable because it can save time and expense by eliminating the need to transfer the article to a separate machine for chamfering after laser machining. Alternatively, it can permit use of less expensive equipment because the same laser used for machining can be used to form the chamfer instead of having a separate process perform the chamfering. Producing chamfers with laser machining results in high quality chamfers without the need for a separate polishing or finishing step. | 06-17-2010 |
| 20100140237 | CONTROLLING DYNAMIC AND THERMAL LOADS ON LASER BEAM POSITIONING SYSTEM TO ACHIEVE HIGH-THROUGHPUT LASER PROCESSING OF WORKPIECE FEATURES - A method of accomplishing high-throughput laser processing of workpiece features arranged in a densely spaced pattern minimizes workpiece feature processing inaccuracy and quality degradation that result from dynamic and thermal loads on laser beam positioning and optical components directing the laser beam during workpiece feature processing. A preferred embodiment is implemented with a laser beam positioning system composed of a zero-inertia optical deflector of an acousto-optic beam deflector (AOD) or an electro-optical deflector (EOD) type, a galvanometer head, and a linear stage cooperating to position the laser beam among the workpiece features. | 06-10-2010 |
| 20100133651 | SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS WITH JOINT VELOCITY PROFILING - A method is used in processing structures on or within a semiconductor substrate using N series of laser pulses to obtain a throughput benefit, wherein N≧2. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The N series of laser pulses propagate along N respective beam axes until incident upon selected structures in N respective distinct rows. The method determines a joint velocity profile for simultaneously moving in the lengthwise direction the N laser beam axes substantially in unison relative to the semiconductor substrate so as to process structures in the N rows with the respective N series of laser pulses, whereby the joint velocity profile is such that the throughput benefit is achieved while ensuring that the joint velocity profile represents feasible velocities for each of the N series of laser pulses and for each of the respective N rows of structures processed with the N series of laser pulses. A semiconductor substrate is designed to have a structure layout that takes advantage of the N-fold processing parallelism provided by the N laser beams. | 06-03-2010 |
| 20100118899 | GENERATING LASER PULSES OF PRESCRIBED PULSE SHAPES PROGRAMMED THROUGH COMBINATION OF SEPARATE ELECTRICAL AND OPTICAL MODULATORS - A programmable laser pulse combines electrical modulation of the pulse frequency and optical modulation of the pulse shape to form laser pulses of prescribed pulse shapes. A prescribed pulse shape features high peak power and low average power. The laser system disclosed also allows for power-scaling and nonlinear conversions to other (shorter or longer) wavelengths. The system provides an economical reliable alternative to using a laser source with high repetition rates to achieve shaped pulses at a variety of wavelengths. The combinatorial scheme disclosed is inherently more efficient than existing subtractive methods. | 05-13-2010 |
| 20100099239 | LASER MACHINING - A method of laser machining a feature in a substrate includes machining the substrate with a pulsed laser along a scan line so that the successive pulses | 04-22-2010 |
| 20100089881 | SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LATERALLY SPACED LASER BEAM SPOTS DELIVERING MULTIPLE BLOWS - Methods and systems process a semiconductor substrate having a plurality of structures to be selectively irradiated with multiple laser beams. The structures are arranged in a plurality of substantially parallel rows extending in a generally lengthwise direction. The method generates a first laser beam that propagates along a first laser beam axis that intersects a first target location on or within the semiconductor substrate. The method also generates a second laser beam that propagates along a second laser beam axis that intersects a second target location on or within the semiconductor substrate. The second target location is offset from the first target location in a direction perpendicular to the lengthwise direction of the rows by some amount such that, when the first target location is a structure on a first row of structures, the second target location is a structure or between two adjacent structures on a second row distinct from the first row. The method moves the semiconductor substrate relative to the first and second laser axes in a direction approximately parallel to the rows of structures, so as to pass the first target location along the first row to irradiate for a first time selected structures in the first row, and so as to simultaneously pass the second target location along the second row to irradiate for a second time structures previously irradiated by the first laser beam during a previous pass of the first target location along the second row. | 04-15-2010 |
| 20100084662 | SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS OVERLAPPING LENGTHWISE ON A STRUCTURE - Methods and systems use laser pulses to process a selected structure on or within a semiconductor substrate. The structure has a surface, a width, and a length. The laser pulses propagate along axes that move along a scan beam path relative to the substrate as the laser pulses process the selected structure. The method simultaneously generates on the selected structure first and second laser beam pulses that propagate along respective first and second laser beam axes intersecting the selected structure at distinct first and second locations. The first and second laser beam pulses impinge on the surface of the selected structure respective first and second beam spots. Each beam spot encompasses at least the width of the selected link. The first and second beam spots are spatially offset from one another along the length of the selected structure to define an overlapping region covered by both the first and the second beam spots and a total region covered by one or both of the first and second beam spots. The total region is larger than the first beam spot and also larger than the second beam spot. The method sets respective first and second energy values of the first and second laser beam pulses to cause complete depthwise processing of the selected structure across the width of the structure in at least a portion of the total region. | 04-08-2010 |
| 20100078419 | POST-LENS STEERING OF A LASER BEAM FOR MICRO-MACHINING APPLICATIONS - In a laser micro-machining system including a simple focusing lens located between a laser source and a beam steering mechanism along the path of a laser beam pulse. The focusing lens being a simple single-element spherical lens with an optical axis of the focusing lens located inline with a laser beam input from the laser source. The focusing lens located further away from a work piece than the beam steering mechanism. An active beam path management system moves the simple focusing lens in concert with and relative to the beam steering mechanism to maintain a focal point coincident with a surface of the work piece at all deflection angles affected by the beam steering mechanism. The focusing lens is rapidly moveable in concert with the beam steering mechanism to maintain a constant beam path length from the lens output to the work piece at all times. | 04-01-2010 |
| 20100078418 | METHOD OF LASER MICRO-MACHINING STAINLESS STEEL WITH HIGH COSMETIC QUALITY - A process to laser micro-machine a metal part with a high cosmetic quality surface includes applying a protective coating layer to at least one surface of the part before micro-machining the part with a laser. The protective coating applied to the high quality cosmetic surface can have a thickness of between about 5 mil and about 10 mil, inclusive and have sufficient adhesion strength to adhere to the part without delaminating during processing. The protective coating applied to the machining surface of the part can be a metallic material, such as a metallic foil or tape. | 04-01-2010 |
| 20100060773 | APPARATUS AND METHOD FOR OPTICALLY CONVERTING A THREE-DIMENSIONAL OBJECT INTO A TWO-DIMENSIONAL PLANAR IMAGE - A device and method for optically converting a three-dimensional object into a two-dimensional planar image includes a camera, a lighting source and a concentric-shaped mirror positioned about a concentric inspection surface of an object to be inspected. A planar image of the object inspection surface about 360 degrees is generated and inspected for defects, marking indicia or other qualities of interest without having to rotate the camera or object. | 03-11-2010 |
| 20100059490 | ADAPTIVE OPTIC BEAMSHAPING IN LASER PROCESSING SYSTEMS - A laser processing system quickly and flexibly modifies a processing beam to determine and implement an improved or optimum beam profile for a particular application (or a subset of the application). The system reduces the sensitivity of beam shaping subsystems to variations in the laser processing system, including those due to manufacturing tolerances, thermal drift, variations in component performance, and other sources of system variation. Certain embodiments also manipulate lower quality laser beams (higher M | 03-11-2010 |
| 20100046561 | HIGH ENERGY PULSE SUPPRESSION METHOD - A laser processes a workpiece with laser pulses delivered at random time intervals and at substantially constant energy levels by characterizing the laser cavity discharge behavior and utilizing that information for adjusting dummy pulse time periods to compensate for the energy errors. Dummy pulses are laser pulses that are blocked from reaching a workpiece. A second way for providing constant pulse energies employs an AOM for varying amounts of laser energy passed to the workpiece. A third way of providing constant pulse energies entails extending the pulse period of selected pulses to allow additional laser cavity charging time whenever a dummy pulse is initiated. | 02-25-2010 |
| 20100044092 | METHOD AND APPARATUS FOR OPTICALLY TRANSPARENT VIA FILLING - A method and apparatus for filling a via with transparent material is presented, including the steps of providing a panel having a via, occluding the via with transparent material in a workable state so that a portion of the occluding material is internal to the via and a portion of the material is external to said via. The external and internal portions are separated so the transparent filler material, when set, forms a smooth and featureless surface. This causes the filled via to have a substantially even and uniform appearance over a wide range of viewing angles when lit. | 02-25-2010 |
| 20100032417 | MICROMACHINING WITH SHORT-PULSED, SOLID-STATE UV LASER - In some embodiments, laser output including at least one laser pulse having a wavelength shorter than 400 microns and having a pulsewidth shorter than 1,000 picoseconds permits the number of pulses used to clean a bottom surface of a via or the surface of a solder pad to increase process throughput. An oscillator module in cooperation with an amplification module may be used to generate the laser output. | 02-11-2010 |
| 20090314754 | PRE-PROCESS STRESS LOADING COMPONENTS FOR POST-PROCESS WARP CONTROL - A process and apparatus neutralizes a warp effect resulting from a build up of micro strains caused by machining a part with a long wavelength laser. The part to be machined is pre-stressed in an opposite direction of a warp stress due to machining using a fixture for holding the part without yielding any other features in the part. The part is machined while held in the pre-stressed position in the fixture. | 12-24-2009 |
| 20090314753 | DEBRIS CAPTURE AND REMOVAL FOR LASER MICROMACHINING - A method of capturing and removing metallic debris created on a target side of a target metal specimen undergoing laser micromachining entails providing a barrier that encompasses the immediate volume surrounding a laser cutting head output nozzle to contain the ejected debris and extracting the debris through a vacuum outlet. A preferred system implementing this approach to debris management includes a barrier in the form of a flexible fiber brush configured in the shape of a ring and positioned to trap ejected debris within a localized area surrounding a target area where the laser beam is incident on the target metal specimen. The ring brush is made of material that is robust to molten metals. An inert gas directed at a high flow rate along the target surface of the metal specimen carries ejected surface debris trapped in the ring brush toward a vacuum outlet. | 12-24-2009 |
| 20090312859 | MODIFYING ENTRY ANGLES ASSOCIATED WITH CIRCULAR TOOLING ACTIONS TO IMPROVE THROUGHPUT IN PART MACHINING - An apparatus for controlling a trajectory along which a tooling positioner system moves tooling for machining multiple features of the same type in a component includes a first tooling trajectory having an entry velocity at a time when the tooling begins machining a first feature and an exit velocity at a time when the tooling completes machining of the first feature. A second tooling trajectory has an entry velocity at a time when the tooling begins machining a second feature and an exit velocity at a time when the tooling completes machining of the second feature. The entry and exit velocities of the second tooling trajectory are different from the respective entry and velocities of the first tooling trajectory. Methods for controlling a trajectory are also taught. | 12-17-2009 |
| 20090312858 | METHOD FOR DEFINING SAFE ZONES IN LASER MACHINING SYSTEMS - A method for defining machine cutting path safety zones for use in laser machining devices. The method includes indentifying safety zone positional coordinates in a computer aided design model, using a machine vision system to image the modeled physical machining device, determining the positional difference between the design model safety zone points and the imaged points and converting the design model safety zone coordinates into machine specific coordinates for input into a machining cutting path program. | 12-17-2009 |
| 20090308853 | ELIMINATING HEAD-TO-HEAD OFFSETS ALONG COMMON CHUCK TRAVEL DIRECTION IN MULTI-HEAD LASER MACHINING SYSTEMS - The embodiments disclosed herein provide systems and methods for correcting a head-to-head offset in a laser machining system with two or more processing heads. A focusing lens is associated with each processing head, and is configured to receive an incident laser beam along an incident beam axis of propagation. The incident beam axis of propagation is offset from the primary axis of the focusing lens. The focusing lens is further configured to rotate about the incident beam axis of propagation in order to steer the incident laser beam's path with respect to a workpiece. | 12-17-2009 |
| 20090308852 | REDUCING BACK-REFLECTIONS IN LASER PROCESSING SYSTEMS - Systems and methods reduce or prevent back-reflections in a laser processing system. A laser processing system includes a laser source to generate an incident laser beam, a laser beam output to direct the incident laser beam toward a work surface, and a lens to receive the incident laser beam along a first axis of propagation that is substantially perpendicular to the work surface. The lens includes a primary axis that is substantially parallel to, and offset from, the first axis of propagation. The lens is configured to focus the incident laser beam onto the work surface along a second axis of propagation that forms a non-perpendicular angle with the work surface such that at least a substantial portion of a reflected laser beam from the work surface does not return to the laser beam output. | 12-17-2009 |
| 20090245614 | METHOD AND APPARATUS FOR DETECTING DEFECTS USING STRUCTURED LIGHT - An improved method and apparatus for detecting problems with fit and finish of manufactured articles is presented which uses structured light. Two or more structured light images acquired from opposing directions is used to measure the fit of mating surfaces while avoiding false positives caused by small defects near the seam. | 10-01-2009 |
| 20090245317 | LASER WITH HIGHLY EFFICIENT GAIN MEDIUM - High-power, diode-pumped solid state (DPSS) pulsed lasers are preferred for applications such as micromachining, via drilling of integrated circuits, and ultraviolet (UV) conversion. Nd:YVO | 10-01-2009 |
| 20090245304 | MULTI-PASS OPTICAL POWER AMPLIFIER - Anisotropic crystals such as Nd:YVO | 10-01-2009 |
| 20090245302 | METHODS AND SYSTEMS FOR DYNAMICALLY GENERATING TAILORED LASER PULSES - Processing workpieces such as semiconductor wafers or other materials with a laser includes selecting a target to process that corresponds to a target class associated with a predefined temporal pulse profile. The temporal pulse profile includes a first portion that defines a first time duration, and a second portion that defines a second time duration. A method includes generating a laser pulse based on laser system input parameters configured to shape the laser pulse according to the temporal pulse profile, detecting the generated laser pulse, comparing the generated laser pulse to the temporal pulse profile, and adjusting the laser system input parameters based on the comparison. | 10-01-2009 |
| 20090245300 | SYSTEMS AND METHODS FOR LASER PULSE EQUALIZATION - Systems and methods provide laser pulse equalization at different pulse repetition frequencies (PRFs). After initially pumping a lasing medium from a first pumping level to a peak pumping level, a controller may cause a pump source to continue pumping the lasing medium according to a pulse equalization pumping curve. The equalization pumping curve may be determined based on testing laser pulse parameters at different PRFs to achieve an optimal equalization result of the pulse parameters. The optimization metric used to evaluate various equalization pumping curves may include a consistency of the pulse energy level, peak power level, and/or pulse width of the laser under different PRFs. The equalization pumping curve may be a descending curve from the peak pumping level to the first pumping level. The equalization pumping curve may be a linearly declining curve, a substantially exponentially declining curve, a parametrically declining curve, or any other curve type. | 10-01-2009 |
| 20090243636 | PROGRAMMABLE GAIN TRANS-IMPEDANCE AMPLIFIER OVERLOAD RECOVERY CIRCUIT - Embodiments of an apparatus for measuring the leakage current of capacitive components is taught. One embodiment includes a first stage amplifier configured to receive an input from a serially-connected capacitive component at an inverting input and a feedback resistor in a feedback path of the first stage amplifier. A resistance value of the feedback resistor is programmable based on an expected value of the leakage current and a corresponding voltage output. | 10-01-2009 |
| 20090243403 | RECOILLESS VOICE COIL ACTUATOR AND METHOD - A recoilless voice coil actuator and method having flexures connected to both the magnet and the voice coil allowing independent movement of both the magnet and the voice coil in the direction of actuation. The stiffness or resistance to movement of the flexures is selected so that the natural frequencies of the magnet and the voice coil along the direction of actuation are substantially the same. | 10-01-2009 |
| 20090242531 | PHOTONIC CLOCK STABILIZED LASER COMB PROCESSING - Processing a workpiece with a laser includes generating laser pulses at a first pulse repetition frequency. The first pulse repetition frequency provides reference timing for coordination of a beam positioning system and one or more cooperating beam position compensation elements to align beam delivery coordinates relative to the workpiece. The method also includes, at a second pulse repetition frequency that is lower than the first pulse repetition frequency, selectively amplifying a subset of the laser pulses. The selection of the laser pulses included in the subset is based on the first pulse repetition frequency and position data received from the beam positioning system. The method further includes adjusting the beam delivery coordinates using the one or more cooperating beam position compensation elements so as to direct the amplified laser pulses to selected targets on the workpiece. | 10-01-2009 |
| 20090242528 | METHOD AND APPARATUS FOR LASER DRILLING HOLES WITH GAUSSIAN PULSES - An improved method and apparatus for drilling tapered holes in workpieces with laser pulses is presented which uses defocused laser pulses to machine the holes with specified taper and surface finish while maintaining specified exit diameters and improved system throughput. A system is described which can also drill holes with the desired taper and surface finish without requiring defocused laser pulses. | 10-01-2009 |
| 20090242526 | LASER MICROMACHINING THROUGH A PROTECTIVE MEMBER - A small feature at a target location on a working surface of a workpiece is laser machined. A laser beam propagating along a beam path is directed for incidence at the target location on the working surface to machine the small feature. A focusing lens sized to converge the laser beam on the working surface is set in the beam path at a short working distance from the working surface to laser machine the small feature and thereby eject target material from the workpiece back toward the focusing lens. A sacrificial protective member positioned between the focusing lens and the working surface transmits without appreciable distortion or adsorption the laser beam focused by the focusing lens and incident on the working surface. The sacrificial protective member intercepts the ejected target material to prevent a sufficient amount of it from reaching and thereby appreciably contaminating the focusing lens. | 10-01-2009 |
| 20090242525 | LASER MACHINING OF FIRED CERAMIC AND OTHER HARD AND/OR THICK MATERIALS - Laser machining fired ceramic and other hard and/or thick materials includes scribing a workpiece with a laser beam along a sequence of parallel laser paths within a cutout region of the workpiece. The scribing creates a kerf in the cutout region that widens as the laser beam advances along the sequence. The sequence may begin with an inner portion of the cutout region and end with an outer edge thereof such that debris is directed away from the laser paths to increase throughput and create a high quality opening in the workpiece. High quality structures may also be cut out from the workpiece. The method includes directing a high velocity stream of gas to an interface of the laser beam and the workpiece to redirect the flow of debris and cool the interface. The method may also adjust a focus depth of the laser beam as it deepens the kerf. | 10-01-2009 |
| 20090242522 | PHOTONIC MILLING USING DYNAMIC BEAM ARRAYS - A laser processing system includes a beam positioning system to align beam delivery coordinates relative to a workpiece. The beam positioning system generates position data corresponding to the alignment. The system also includes a pulsed laser source and a beamlet generation module to receive a laser pulse from the pulsed laser source. The beamlet generation module generates a beamlet array from the laser pulse. The beamlet array includes a plurality of beamlet pulses. The system further includes a beamlet modulator to selectively modulate the amplitude of each beamlet pulse in the beamlet array, and beamlet delivery optics to focus the modulated beamlet array onto one or more targets at locations on the workpiece corresponding to the position data. | 10-01-2009 |
| 20090242521 | ON-THE-FLY MANIPULATION OF SPOT SIZE AND CUTTING SPEED FOR REAL-TIME CONTROL OF TRENCH DEPTH AND WIDTH IN LASER OPERATIONS - Systems and methods cut trenches of multiple widths in a material using a single pass of a laser beam. A first series of laser pulses cut a work surface of the material at a first cutting speed using a first spot size. In a transition region from a first trench width to a second trench width, a second series of laser pulses sequentially change spot sizes while gradually changing from the first cutting speed to a second cutting speed. Then, a third series of laser pulses continue to cut the work surface at the second cutting speed using a second spot size. The method provides for increased depth control in the transition region. A system uses a selectively adjustable optical component in the laser beam path to rapidly change spot size by adjusting a position of a focal plane with respect to the work surface. | 10-01-2009 |
| 20090236323 | METHOD AND APPARATUS FOR LASER DRILLING HOLES WITH TAILORED LASER PULSES - An improved method and apparatus for drilling vias in electronic substrates with laser pulses is presented which uses one or more tailored pulses to reduce debris remaining in the via while maintaining system throughput and avoiding damage to the substrate. A tailored pulse is a laser pulse that features a power spike having a peak power 10% higher than the average power of the pulse and lasting less than 50% of the duration of the pulse. Methods and apparatuses for creating tailored pulses by slicing longer duration pulses are shown. | 09-24-2009 |
| 20090219518 | OPTIMIZING USE AND PERFORMANCE OF OPTICAL SYSTEMS IMPLEMENTED WITH TELECENTRIC ON-AXIS DARK FIELD ILLUMINATION - Systems and methods are provided for imaging a planar specular object such as a semiconductor wafer. In one embodiment, an imaging system for imaging a defect on a planar specular object includes a telecentric lens having a sufficiently aspherical surface such that the telecentric lens is substantially corrected for an optical aberration. The imaging system also includes a telecentric stop including an aperture therein to block light reflected from the planar specular object while allowing light reflected from the defect to pass through the aperture. The imaging system further includes a lens group having a system stop positioned between the telecentric stop and the lens group. The lens group is substantially corrected for the optical aberration independent of the telecentric lens. | 09-03-2009 |
| 20090179201 | Laser Chalcogenide Phase Change Device - A laser activated phase change device for use in an integrated circuit comprises a chalcogenide fuse configured to connect a first patterned metal line and a second patterned metal line and positioned between an inter layer dielectric and an over fuse dielectric. The fuse interconnects active semiconductor elements manufactured on a substrate. A method for activating the laser activated phase change device includes selecting a laser condition of a laser based on characteristics of the fuse and programming a phase-change of the fuse with the laser by direct photon absorption until a threshold transition temperature is met. | 07-16-2009 |
| 20090161238 | FLEXURE GUIDE BEARING FOR SHORT STROKE STAGE - A laser processing system in which a laser beam propagates along a beam axis and through a lens for incidence on a work surface of a target specimen mounted on a support. The lens forms a focal region of the laser beam. The support is operatively connected to a multiple-axis positioning system that moves the laser beam and the target specimen relative to each other to position the laser beam at selected locations on the work surface. An assembly includes at least one flexure that supports the lens and guides movement of the lens along the beam axis in response to a motive force to adjust the focal region of the laser beam relative to the work surface. | 06-25-2009 |
| 20090155935 | BACK SIDE WAFER DICING - Systems and methods for scribing a semiconductor wafer with reduced or no damage or debris to or on individual integrated circuits caused by the scribing process. The semiconductor wafer is scribed from a back side thereof. In one embodiment, the back side of the wafer is scribed following a back side grinding process but prior to removal of back side grinding tape. Thus, debris generated from the scribing process is prevented from being deposited on a top surface of the wafer. To determine the location of dicing lanes or streets relative to the back side of the wafer, the top side of the wafer is illuminated with a light configured to pass through the grinding tape and the wafer. The light is detected from the back side of the wafer, and the streets are mapped relative to the back side. The back side of the wafer is then cut with a saw or laser. | 06-18-2009 |
| 20090147112 | METHOD AND APPARATUS FOR ACHIEVING PANCHROMATIC RESPONSE FROM A COLOR-MOSAIC IMAGER - A method and apparatus for achieving monochromatic response from a low-cost color imager is presented. In this method and apparatus, the out-of-band response to infrared (IR) light is by solid state sensors exploited to produce a monochrome image. The monochrome image is produced by removing the IR blocking filter from the sensor and illuminating the scene to be imaged with IR radiation from an LED. The wavelength emitted from the LED is matched to the wavelength or wavelengths that correspond to a region where the sensor's response to IR light is relatively even, despite the color-mosaic filter permanently attached to the sensor. | 06-11-2009 |
| 20090141750 | SYSTEMS AND METHODS FOR LINK PROCESSING WITH ULTRAFAST AND NANOSECOND LASER PULSES - Systems and methods for processing an electrically conductive link in an integrated circuit use a series of laser pulses having different pulse widths to remove different portions of a target structure without substantially damaging a material underlying the electrically conductive link. In one embodiment, an ultrafast laser pulse or bundle of ultrafast laser pulses removes an overlying passivation layer in a target area and a first portion of link material. Then, a nanosecond laser pulse removes a second portion of the link material to sever an electrical connection between two nodes in the integrated circuit. The nanosecond laser pulse is configured to reduce or eliminate damage to the underlying material. | 06-04-2009 |
| 20090127169 | ELECTRONIC COMPONENT HANDLER TEST PLATE - An improved electronic component handler and associated improved test plate are shown. A guide on the test plate is used to intersect the testing apertures to eliminate misalignment of the component loading frame and the aperture to ensure easy insertion of components into the test apertures. | 05-21-2009 |
| 20090045830 | AUTOMATED CONTACT ALIGNMENT TOOL - A method for determining the alignment of a plurality of contacts in an electronic testing machine is disclosed. The contacts are swept over an electronic component taking a plurality of electrical readings. These electrical readings are charted against a desired orientation to determine alignment. Alignment can be corrected as necessary using an adjustment mechanism. | 02-19-2009 |
| 20090011614 | RECONFIGURABLE SEMICONDUCTOR STRUCTURE PROCESSING USING MULTIPLE LASER BEAM SPOTS - Methods and systems selectively irradiate structures on or within a semiconductor wafer using multiple laser beams. The structures may be laser-severable conductive links, and the purpose of the irradiation may be to sever selected links. The structures are arranged in rows and may be processed in either an on-axis mode or a cross-axis mode. In the on-axis mode, the beam spots fall on structures in the same row as they move along the row. In the cross-axis mode, the beam spots fall on structures in different rows as they move along the rows. | 01-08-2009 |
| 20080314879 | SYSTEMS AND METHODS FOR ADAPTING PARAMETERS TO INCREASE THROUGHPUT DURING LASER-BASED WAFER PROCESSING - Systems and methods automatically modify a laser-based system for processing target specimens such as semiconductor wafers. In one embodiment, the laser-based system detects a trigger associated with a processing model. The processing model corresponds to a set of wafers. In response to the trigger, the system automatically adjusts one or more system parameters based on the processing model. The system then uses the modified system parameters to selectively irradiate structures on or within at least one wafer in the set of wafers. In one embodiment, the trigger includes variations in a thermal state related to a motion stage. In response to the variations in the thermal state, the system operates the motion stage in a series of movements until a thermal equilibrium threshold is reached. The sequence of movements may, for example, simulate movements used to process a particular wafer. | 12-25-2008 |
| 20080299783 | SYSTEMS AND METHODS FOR PROCESSING SEMICONDUCTOR STRUCTURES USING LASER PULSES LATERALLY DISTRIBUTED IN A SCANNING WINDOW - Systems and methods process structures on or within a semiconductor substrate using a series of laser pulses. In one embodiment, a deflector is configured to selectively deflect the laser pulses within a processing window. The processing window is scanned over the semiconductor substrate such that a plurality of laterally spaced rows of structures simultaneously pass through the processing window. As the processing window is scanned, the deflector selectively deflects the series of laser pulses among the laterally spaced rows within the processing window. Thus, multiple rows of structures may be processed in a single scan. | 12-04-2008 |
| 20080296273 | METHOD OF AND APPARATUS FOR LASER DRILLING HOLES WITH IMPROVED TAPER - A method of and an apparatus for drilling blind vias with selectable tapers in multilayer electronic circuits permit forming electrical connections between layers while maintaining quality and throughput. The method relies on recognizing that the top diameter of the via and the bottom diameter of the via, which define the taper, are functions of two separate sets of equations. Simultaneous solution of these equations yields a solution space that enables optimization of throughput while maintaining selected taper and quality using temporally unmodified Q-switched CO | 12-04-2008 |
| 20080296272 | MULTIPLE LASER WAVELENGTH AND PULSE WIDTH PROCESS DRILLING - Dual-beam laser outputs, preferably derived from a single laser beam, improve the quality of the sidewalls of vias drilled in a target material, such as printed circuit board, comprising fiber-reinforced resin. Two embodiments each use two laser output components to remove a portion of target material from a target material location of a workpiece and rapidly clean remnants of the target material bonded to a metal layer underlying the target material location at a material removal rate. A first embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and second wavelengths. A second embodiment entails directing for incidence on a portion of the target material at the target material location a processing laser output having first and second components characterized by respective first and pulse widths. | 12-04-2008 |
| 20080293166 | LASER PROCESSING OF LIGHT REFLECTIVE MULTILAYER TARGET STRUCTURE - A solution to an interference effect problem associated with laser processing of target structures entails adjusting laser pulse energy or other laser beam parameter, such as laser pulse temporal shape, based on light reflection information of the target structure and passivation layers stacked across a wafer surface or among multiple wafers in a group of wafers. Laser beam reflection measurements on a target link measurement structure and in a neighboring passivation layer area unoccupied by a link enable calculation of the laser pulse energy adjustment for a more consistent processing result without causing damage to the wafer. For thin film trimming on a wafer, similar reflection measurement information of the laser beam incident on the thin film structure and the passivation layer structure with no thin film present can also deliver the needed information for laser parameter selection to ensure better processing quality. | 11-27-2008 |
| 20080291554 | Fluid Counterbalance for a Laser Lens Used to Scribe an Electronic Component Substrate - An apparatus and method for supporting a device for processing an electronic component substrate includes an assembly supporting a laser lens in a gravity field for focusing movement along a Z-axis by a linear actuator. A fluid counterbalance for the assembly is defined by a piston associated with a housing for movement between end limits of travel. The piston divides the housing into first and second fluid chambers having first and second fluid communication ports. A fluid pressure source is connectable to the first and second chambers through the first and second fluid communication ports. The fluid pressure source is adjustable to statically suspend the supported laser lens in equilibrium within the gravity field. The fluid pressure source permits movement of the supported laser lens to any position between opposite end limits of travel of the piston, while maintaining the mass of the supported laser lens in equilibrium. | 11-27-2008 |
| 20080290879 | CAPACITIVE MEASUREMENTS WITH FAST RECOVERY CURRENT RETURN - An apparatus and method for measuring the leakage current of capacitive components. A switch that grounds a terminal of a component being tested is closed while the component is charged to a desired test voltage. When this charging is complete, the switch opens so that the diode terminal is at the same potential as the input amplifier's virtual ground. An accurate and fast measurement of the leakage current of the component can be measured. | 11-27-2008 |
| 20080289178 | PROCESS FOR FORMING AN ISOLATED ELECTRICALLY CONDUCTIVE CONTACT THROUGH A METAL PACKAGE - A method of forming an isolated electrically conductive contact through a metal substrate by creating at least one via through the substrate. The at least one sidewall of the via is cleaned and coated with a non-conductive layer. In one example, the non-conductive layer is formed by anodizing the sidewall(s) of the via. In another example, the non-conductive layer may be formed by thin film deposition of a dielectric on the sidewall(s). An electrically conductive filler is then placed into the via. In the examples disclosed, the filler may be a conductive ink or a conductive epoxy. | 11-27-2008 |
| 20080272096 | LASER MICRO-MACHINING SYSTEM WITH POST-SCAN LENS DEFLECTION - A laser micro machining system includes a laser source positioned to direct a laser pulse through a scan lens to a work piece mounted on a work surface and a mirror positioned between the scan lens and the work piece and tilted with respect to the work surface to reflect the laser pulse toward the work piece. The mirror can be indexed to a number of positions so that only portions of the mirror are used for a number of processing steps, extending the life of the mirror. | 11-06-2008 |
| 20080272095 | METHOD FOR MACHINING TAPERED MICRO HOLES - A method for laser machining through micro-holes having desired geometric cross-section requirements in a thin, substantially homogenous material. | 11-06-2008 |
| 20080264826 | Test plate for electronic handler - A gap set device for an electronic component handler is provided. The electronic component handler includes a test module operative to load, test and unload electronic components. The electronic components are received in test pockets provided on a test plate. The test pockets include at least one corner relief to improve loading efficiency. | 10-30-2008 |
| 20080252315 | ELECTRICAL COMPONENT HANDLER HAVING SELF-CLEANING LOWER CONTACT - An electrical component handler that tests electrical circuit components and includes a self-cleaning lower contact offers reduced yield loss and mean time between assists. A preferred embodiment of the electrical component handler includes multiple sets of upper and lower contacts, each set of which is spatially aligned to electrically contact a single device-under-test (DUT). Each DUT is seated in a test plate that transports the DUT to and from a test measurement position between the upper and lower contacts. The lower contact includes a contact tip that a biasing mechanism urges against the electrical component as it undergoes a test process and against a surface of the test plate as it transports the electrical component. The lower contact rubs against the test plate, thereby contributing to removal of contaminant material acquired by the contact tip during component handler operation. | 10-16-2008 |
| 20080238198 | CHARGE PUMP FOR BUS-POWERED DEVICE - A charge pump can be used with a bus-powered device connected to a bus. The charge pump is formed of a power connection from the bus carrying a DC power signal constrained to not exceed a given current limit and a given voltage limit, a DC-to-DC step-down voltage converter, a capacitor, and a DC-to-DC step-up voltage converter. The step-down converter has an input connected to the power connection and produces an intermediate signal having a voltage the same or less than the voltage of the power signal. The capacitor is connected to the output of the step-down converter. The step-up converter has an input connected to the output of the step-down converter and to the capacitor, and produces a final output signal having a voltage greater than the given voltage limit. The output of the step-up converter is connected to and provides DC power to the device. | 10-02-2008 |
| 20080223837 | USE OF PREDICTIVE PULSE TRIGGERING TO IMPROVE ACCURACY IN LINK PROCESSING - A predictive pulse triggering (PPT) method enables precise triggering of a laser beam in a link-processing system. The PPT method entails triggering the laser beam based on estimated relative motion parameters of the target and laser beam axis. The PPT method allows for a six-fold improvement in laser positioning accuracy over the conventional, entirely measurement-based method. | 09-18-2008 |
| 20080221817 | METHOD FOR DETECTING PARTICULATE CONTAMINATION UNDER A WORKPIECE - A method for detecting particulate contamination under a workpiece fixtured by a calibrated material handling system includes performing 3D measurements of a workpiece at multiple of positions to construct a 3D map of the workpiece, calibrating the 3D map by comparing a pre-computed calibration map to the 3D measurements, and detecting particulate contamination by processing the calibrated map. | 09-11-2008 |
| 20080203071 | LINK PROCESSING USING LASER PULSES WITH SPECIALLY TAILORED POWER PROFILES - A laser pulse with a specially tailored temporal power profile, instead of a conventional temporal shape or substantially square shape, severs an IC link. The specially tailored laser pulse preferably has either an overshoot at the beginning of the laser pulse or a spike peak within the duration of the laser pulse. The timing of the spike peak is preferably set ahead of the time when the link is mostly removed. A specially tailored laser pulse power profile allows the use of a wider laser pulse energy range and shorter laser wavelengths, such as the green and UV, to sever the links without appreciable damage to the substrate and passivation structure material located on either side of and underlying the links. | 08-28-2008 |
| 20080198373 | SPECIMEN INSPECTION STAGE IMPLEMENTED WITH PROCESSING STAGE COUPLING MECHANISM - A specimen inspection stage implemented with a processing stage coupling mechanism provides a capability to conduct with maximum efficiency post-processing specimen inspections on-board a processing platform. Heavy inspection equipment is mounted on a specimen inspection stage that is separate from a processing stage. In a preferred embodiment, the processing stage moves in response to an applied motive force and performs laser-based processing operations on a specimen. While laser processing is ongoing, the specimen inspection stage remains parked in its home position. When it is time for post-processing inspection, a stage coupling and decoupling mechanism couples together the specimen inspection stage and the processing stage, which transports the specimen inspection stage to and from the specimen position. | 08-21-2008 |
